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DSPIC33EP128GS805-E/PT

Description
IC MCU 16BIT 128KB FLASH 48TQFP
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size212KB,20 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Environmental Compliance
Download Datasheet Download user manual Parametric Compare View All

DSPIC33EP128GS805-E/PT Overview

IC MCU 16BIT 128KB FLASH 48TQFP

DSPIC33EP128GS805-E/PT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrochip
package instructionTFQFP,
Reach Compliance Codecompliant
Factory Lead Time5 weeks
Has ADCYES
Other featuresADC SAMPLE AND HOLD (5-CH 12-BIT)
bit size16
maximum clock frequency60 MHz
DAC channelYES
DMA channelYES
JESD-30 codeS-PQFP-G48
JESD-609 codee3
length7 mm
Number of I/O lines33
Number of terminals48
On-chip program ROM width8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeTFQFP
Package shapeSQUARE
Package formFLATPACK, THIN PROFILE, FINE PITCH
RAM (bytes)8192
rom(word)131072
ROM programmabilityFLASH
Filter levelAEC-Q100; TS 16949
Maximum seat height1.2 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceMatte Tin (Sn) - annealed
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
width7 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Base Number Matches1
dsPIC33EPXXXGS70X/80X
dsPIC33EPXXXGS70X/80X Family
Silicon Errata and Data Sheet Clarification
The dsPIC33EPXXXGS70X/80X family devices that
you have received conform functionally to the current
Device Data Sheet (DS70005258B), except for the
anomalies described in this document.
The silicon issues discussed in the following pages are
for silicon revisions with the Device and Revision IDs
listed in
Table 1.
The silicon issues are summarized in
Table 2.
The errata described in this document will be addressed
in future revisions of the dsPIC33EPXXXGS70X/80X
silicon.
Note:
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the issues
indicated in the last column of
Table 2
apply to the current silicon revision (A2).
For example, to identify the silicon revision level
using MPLAB IDE in conjunction with a hardware
debugger:
1.
2.
3.
4.
Using the appropriate interface, connect the
device to the hardware debugger.
Open an MPLAB IDE project.
Configure the MPLAB IDE project for the
appropriate device and hardware debugger.
Based on the version of MPLAB IDE you are
using, do one of the following:
a) For MPLAB IDE 8, select
Programmer >
Reconnect.
b) For MPLAB X IDE, select
Window > Dash-
board
and click the
Refresh Debug Tool
Status
icon (
).
Depending on the development tool used, the
part number
and
Device Revision ID value
appear in the
Output
window.
Note:
If you are unable to extract the silicon
revision level, please contact your local
Microchip sales office for assistance.
the
various
revisions are
5.
Data Sheet clarifications and corrections start on
page 14,
following the discussion of silicon issues.
The silicon revision level can be identified using the
current version of MPLAB
®
IDE and Microchip’s pro-
grammers, debuggers, and emulation tools, which are
available at the Microchip corporate web site
(www.microchip.com).
The
DEVREV
values
for
dsPIC33EPXXXGS70X/80X silicon
shown in
Table 1.
TABLE 1:
SILICON DEVREV VALUES
Device ID
(1)
Revision ID for
Silicon Revision
(2)
A2
Part Number
Device ID
(1)
Revision ID for
Silicon Revision
(2)
A2
dsPIC33EP128GS705
dsPIC33EP128GS706
dsPIC33EP128GS708
0x4001
dsPIC33EP128GS804
dsPIC33EP128GS805
dsPIC33EP128GS806
dsPIC33EP128GS808
0x6C30
0x6C12
0x6C13
0x6C50
0x6C70
0x6C52
0x6C53
0x4001
Part Number
dsPIC33EP64GS708
dsPIC33EP64GS804
dsPIC33EP64GS805
dsPIC33EP64GS806
dsPIC33EP64GS808
dsPIC33EP128GS702
dsPIC33EP128GS704
Note 1:
2:
0x6C03
0x6C40
0x6C60
0x6C42
0x6C43
0x6C11
0x6C10
The Device IDs (DEVID and DEVREV) are located at the last two implemented addresses of configuration mem-
ory space. They are shown in hexadecimal in the format “DEVID DEVREV”.
Refer to the
“dsPIC33EPXXXGS70X/80X Family Flash Programming Specification”
(DS70005256) for detailed
information on Device and Revision IDs for your specific device.
2017-2018 Microchip Technology Inc.
DS80000722D-page 1

DSPIC33EP128GS805-E/PT Related Products

DSPIC33EP128GS805-E/PT DSPIC33EP128GS706-E/PT DSPIC33EP128GS804-E/PT DSPIC33EP64GS806T-I/PT DSPIC33EP128GS804T-I/PT DSPIC33EP128GS708T-I/PT DSPIC33EP64GS808T-I/PT DSPIC33EP128GS705T-I/PT DSPIC33EP128GS702T-I/2N
Description IC MCU 16BIT 128KB FLASH 48TQFP IC MCU 16BIT 128KB FLASH 64TQFP IC MCU 16BIT 128KB FLASH 44TQFP IC MCU 16BIT 64KB FLASH 64TQFP IC MCU 16BIT 128KB FLASH 44TQFP IC MCU 16BIT 128KB FLASH 80TQFP IC MCU 16BIT 64KB FLASH 80TQFP IC MCU 16BIT 128KB FLASH 48TQFP IC MCU 16BIT 128KB FLASH 28UQFN
core processor - dsPIC dsPIC dsPIC dsPIC dsPIC dsPIC dsPIC dsPIC
core size - 16-bit 16-bit 16-bit 16-bit 16-bit 16-bit 16-bit 16-bit
speed - 60 MIPs 60 MIPs 70 MIPs 70 MIPs 70 MIPs 70 MIPs 70 MIPs 70 MIPs
Connectivity - I²C,IrDA,LINbus,SPI,UART/USART CANbus,I²C,IrDA,LINbus,SPI,UART/USART I²C,IrDA,LINbus,SPI,UART/USART CANbus,I²C,IrDA,LINbus,SPI,UART/USART I²C,IrDA,LINbus,SPI,UART/USART I²C,IrDA,LINbus,SPI,UART/USART I²C,IrDA,LINbus,SPI,UART/USART I²C,IrDA,LINbus,SPI,UART/USART
Peripheral - Power outage detection/reset, capacitive sensing, I²S, POR, PWM, WDT Undervoltage detection/reset, DMA, I²S, POR, PWM, WDT Undervoltage detection/reset, DMA, I²S, POR, PWM, WDT Undervoltage detection/reset, DMA, I²S, POR, PWM, WDT Power outage detection/reset, capacitive sensing, I²S, POR, PWM, WDT Undervoltage detection/reset, DMA, I²S, POR, PWM, WDT Power outage detection/reset, capacitive sensing, I²S, POR, PWM, WDT Power outage detection/reset, capacitive sensing, I²S, POR, PWM, WDT
Number of I/Os - 51 33 51 33 67 67 33 20
Program storage capacity - 128KB(43K x 24) 128KB(43K x 24) 64KB(64K x 8) 128KB(43K x 24) 128KB(43K x 24) 64KB(64K x 8) 128KB(43K x 24) 128KB(43K x 24)
Program memory type - flash memory flash memory flash memory flash memory flash memory flash memory flash memory flash memory
RAM capacity - 8K x 8 8K x 8 8K x 8 8K x 8 8K x 8 8K x 8 8K x 8 8K x 8
Voltage - Power Supply (Vcc/Vdd) - 3 V ~ 3.6 V 3 V ~ 3.6 V 3 V ~ 3.6 V 3 V ~ 3.6 V 3 V ~ 3.6 V 3 V ~ 3.6 V 3 V ~ 3.6 V 3 V ~ 3.6 V
data converter - A/D 22x12b,D/A 2x12b A/D 17x12b,D/A 1x12b A/D 22x12b,D/A 2x12b A/D 17x12b,D/A 1x12b A/D 22x12b,D/A 2x12b A/D 22x12b,D/A 2x12b A/D 17x12b,D/A 1x12b A/D 11x12b,D/A 1x12b
Oscillator type - internal internal internal internal internal internal internal internal
Operating temperature - -40°C ~ 125°C(TA) -40°C ~ 125°C(TA) -40°C ~ 85°C(TA) -40°C ~ 85°C(TA) -40°C ~ 85°C(TA) -40°C ~ 85°C(TA) -40°C ~ 85°C(TA) -40°C ~ 85°C(TA)
Package/casing - 64-TQFP 44-TQFP 64-TQFP 44-TQFP 80-TQFP 80-TQFP 48-TQFP 28-UQFN Exposed Pad
Supplier device packaging - 64-TQFP(10x10) 44-TQFP(10x10) 64-TQFP(10x10) 44-TQFP(10x10) 80-TQFP(12x12) 80-TQFP(12x12) 48-TQFP(7x7) 28-UQFN(6x6)

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