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SSTUH32864EC/G,551

Description
IC BUFFER 1.8V 1/14BIT SOT536-1
Categorylogic    logic   
File Size112KB,20 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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SSTUH32864EC/G,551 Overview

IC BUFFER 1.8V 1/14BIT SOT536-1

SSTUH32864EC/G,551 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeBGA
package instruction13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96
Contacts96
Manufacturer packaging codeSOT536-1
Reach Compliance Codeunknown
seriesSSTU
JESD-30 codeR-PBGA-B96
length13.5 mm
Logic integrated circuit typeD FLIP-FLOP
Humidity sensitivity level2
Number of digits14
Number of functions1
Number of terminals96
Maximum operating temperature70 °C
Minimum operating temperature
Output characteristicsOPEN-DRAIN
Output polarityCOMPLEMENTARY
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)1.8 ns
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
Trigger typePOSITIVE EDGE
width5.5 mm
minfmax450 MHz
SSTUH32864
1.8 V high output drive configurable registered buffer for
DDR2 RDIMM applications
Rev. 01 — 22 April 2005
Product data sheet
1. General description
The SSTUH32864 is a 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer designed
for 1.7 V to 1.9 V V
DD
operation.
All clock and data inputs are compatible with the JEDEC standard for SSTL_18. The
control inputs are LVCMOS. All outputs are 1.8 V CMOS drivers that have been optimized
to drive the DDR2 DIMM load.
The SSTUH32864 operates from a differential clock (CK and CK). Data are registered at
the crossing of CK going HIGH, and CK going LOW.
The C0 input controls the pinout configuration of the 1 : 2 pinout from A configuration
(when LOW) to B configuration (when HIGH). The C1 input controls the pinout
configuration from 25-bit 1 : 1 (when LOW) to 14-bit 1 : 2 (when HIGH).
The device supports low-power standby operation. When the reset input (RESET) is LOW,
the differential input receivers are disabled, and un-driven (floating) data, clock and
reference voltage (VREF) inputs are allowed. In addition, when RESET is LOW all
registers are reset, and all outputs are forced LOW. The LVCMOS RESET and Cn inputs
must always be held at a valid logic HIGH or LOW level.
To ensure defined outputs from the register before a stable clock has been supplied,
RESET must be held in the LOW state during power-up.
In the DDR2 RDIMM application, RESET is specified to be completely asynchronous with
respect to CK and CK. Therefore, no timing relationship can be guaranteed between the
two. When entering reset, the register will be cleared and the data outputs will be driven
LOW quickly, relative to the time to disable the differential input receivers. However, when
coming out of reset, the register will become active quickly, relative to the time to enable
the differential input receivers. As long as the data inputs are LOW, and the clock is stable
during the time from the LOW-to-HIGH transition of RESET until the input receivers are
fully enabled, the design of the SSTUH32864 must ensure that the outputs will remain
LOW, thus ensuring no glitches on the output.
The device monitors both DCS and CSR inputs and will gate the Qn outputs from
changing states when both DCS and CSR inputs are HIGH. If either DCS or CSR input is
LOW, the Qn outputs will function normally. The RESET input has priority over the DCS
and CSR control and will force the outputs LOW. If the DCS-control functionality is not
desired, then the CSR input can be hardwired to ground, in which case the setup time
requirement for DCS would be the same as for the other Dn data inputs.
The SSTUH32864 is available in a 96-ball, low profile fine-pitch ball grid array (LFBGA96)
package.

SSTUH32864EC/G,551 Related Products

SSTUH32864EC/G,551 SSTUH32864EC-S SSTUH32864EC/G-S SSTUH32864EC/G SSTUH32864EC/G-T SSTUH32864EC,557 SSTUH32864EC/G,557 SSTUH32864EC,551 SSTUH32864EC,518
Description IC BUFFER 1.8V 1/14BIT SOT536-1 Register 1.8V config reg buffer/ddrii Buffer and line driver 1.8V config reg buffer/ddrii Register 1.8V config reg buffer/ddrii Register 1.8V config reg buffer/ddrii IC BUFFER 1.8V 1/14BIT SOT536-1 IC BUFFER 1.8V 1/14BIT SOT536-1 IC BUFFER 1.8V 1/14BIT SOT536-1 IC BUFFER 1.8V 1/14BIT SOT536-1
Brand Name NXP Semiconductor - - - - NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
Maker NXP NXP NXP NXP - NXP NXP NXP NXP
Parts packaging code BGA - - BGA - BGA BGA BGA BGA
package instruction 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96 - - LFBGA, BGA96,6X16,32 - LFBGA, BGA96,6X16,32 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96 LFBGA, LFBGA,
Contacts 96 - - 96 - 96 96 96 96
Manufacturer packaging code SOT536-1 - - SOT-536-1 - SOT536-1 SOT-536-1 SOT536-1 SOT536-1
Reach Compliance Code unknown - - unknown - unknown unknown unknown unknown
series SSTU - - SSTU - SSTU SSTU SSTU SSTU
JESD-30 code R-PBGA-B96 - - R-PBGA-B96 - R-PBGA-B96 R-PBGA-B96 R-PBGA-B96 R-PBGA-B96
length 13.5 mm - - 13.5 mm - 13.5 mm 13.5 mm 13.5 mm 13.5 mm
Logic integrated circuit type D FLIP-FLOP - - D FLIP-FLOP - D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP D FLIP-FLOP
Number of digits 14 - - 14 - 14 14 14 14
Number of functions 1 - - 1 - 1 1 1 1
Number of terminals 96 - - 96 - 96 96 96 96
Maximum operating temperature 70 °C + 70 C - 70 °C - 70 °C 70 °C 70 °C 70 °C
Output characteristics OPEN-DRAIN - - OPEN-DRAIN - OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
Output polarity COMPLEMENTARY - - COMPLEMENTARY - COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY COMPLEMENTARY
Package body material PLASTIC/EPOXY - - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA - - LFBGA - LFBGA LFBGA LFBGA LFBGA
Package shape RECTANGULAR - - RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, LOW PROFILE, FINE PITCH - - GRID ARRAY, LOW PROFILE, FINE PITCH - GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
propagation delay (tpd) 1.8 ns - - 1.8 ns - 1.8 ns 1.8 ns 1.8 ns 1.8 ns
Certification status Not Qualified - - Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.5 mm - - 1.5 mm - 1.5 mm 1.5 mm 1.5 mm 1.5 mm
Maximum supply voltage (Vsup) 1.9 V - - 1.9 V - 1.9 V 1.9 V 1.9 V 1.9 V
Minimum supply voltage (Vsup) 1.7 V - - 1.7 V - 1.7 V 1.7 V 1.7 V 1.7 V
Nominal supply voltage (Vsup) 1.8 V - - 1.8 V - 1.8 V 1.8 V 1.8 V 1.8 V
surface mount YES - - YES - YES YES YES YES
technology CMOS - - CMOS - CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL - - COMMERCIAL - COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form BALL - - BALL - BALL BALL BALL BALL
Terminal pitch 0.8 mm - - 0.8 mm - 0.8 mm 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM - - BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM
Trigger type POSITIVE EDGE - - POSITIVE EDGE - POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
width 5.5 mm - - 5.5 mm - 5.5 mm 5.5 mm 5.5 mm 5.5 mm
minfmax 450 MHz - - 450 MHz - 450 MHz 450 MHz 450 MHz 450 MHz
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