Operating Temperature Range ............................. 0NC to +70NC
Junction Temperature Range........................... -40NC to +150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Note 1:
All I/O pins are clamped by internal diodes.
Note 2:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, C
CL
= 75nF coupling capacitor on each output, R
L
= 50I on each output, T
A
= 0NC to +70NC, unless other-
wise noted. Typical values are at V
CC
= +3.3V and T
A
= +25NC.) (Note 3)
PARAMETER
DC PERFORMANCE
Power-Supply Range
Supply Current
Input Impedance, Differential
Output Impedance, Differential
Common-Mode Resistance to
GND, Input Terminations Not
Powered
Common-Mode Resistance
to GND, Input Terminations
Powered
Output Short-Circuit Current
Common-Mode Delta, Between
Active and Idle States
DC Output Offset, During
Active State
DC Output Offset, During
Electrical Idle
AC PERFORMANCE
Input Return Loss, Differential
RL
RX-DIFF
0.05GHz < f
P
1.25GHz (Note 4)
1.25GHz < f
P
2.5GHz (Note 4)
10
8
dB
dB
V
CC
I
CC
Z
RX-DIFF-DC
Z
TX-DIFF-DC
Z
RX-HIGH-IMP-
DC-POS
SYMBOL
CONDITIONS
MIN
3.0
TYP
MAX
3.6
UNITS
V
mA
I
I
kI
kI
EN = V
CC
EN = GND
DC
DC
INEQ_ = ODE_ = GND
INEQ_ = ODE_ = V
CC
80
80
50
1
120
160
50
100
100
150
200
120
120
V
IN_P
= V
IN_M
= 0 to 200mV
V
IN_P
= V
IN_M
= -150mV to 0V
Z
RX-HIGH-IMP-
DC-NEG
Z
RX-DC
I
TX-SHORT
V
TX-CM-DC-
ACTIVE-IDLE-
DELTA
DC
Single-ended (Note 4)
40
50
60
90
I
mA
mV
-100
Difference between DC average of
V
OUT_P
and V
OUT_M
ABS(V
OUT_P
- V
OUT_M
)
+100
V
TX-CM-DC-
LINE-DELTA
-25
-10
+25
+10
mV
mV
V
TX-IDLE-DIFF-
DC
2
PCIe, Single Lane, 2:1/1:2 Multiplexer and
Redriver with Equalization
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +3.0V to +3.6V, C
CL
= 75nF coupling capacitor on each output, R
L
= 50I on each output, T
A
= 0NC to +70NC, unless other-
wise noted. Typical values are at V
CC
= +3.3V and T
A
= +25NC.) (Note 3)
PARAMETER
Input Return Loss, Common
Mode
Output Return Loss, Differential
Output Return Loss, Common
Mode
Differential Input Signal Range,
Redriver Operation
Differential Output Voltage, Full
Swing, No Deemphasis
Differential Output Voltage, Low
Swing, No Deemphasis
Output Deemphasis Ratio, 0dB
Output Deemphasis Ratio,
3.5dB
Output Deemphasis Ratio, 6dB
Input Equalization, 0dB
Input Equalization, 3.5dB
Input Equalization, 6dB
Output Common-Mode Voltage
Propagation Delay
Rise/Fall Time
Rise/Fall Time Mismatch
Output Skew Same Pair
Deterministic Jitter
Random Jitter
Electrical Idle Entry Delay
Electrical Idle Exit Delay
SYMBOL
RL
RX-CM
RL
TX-DIFF
RL
TX-CM
V
RX-DIFF-PP
CONDITIONS
0.05GHz < f
P
2.5GHz (Note 4)
0.05GHz < f
P
1.25GHz (Note 4)
1.25GHz < f
P
2.5GHz (Note 4)
0.05GHz < f
P
2.5GHz (Note 4)
0.05GHz < f
P
2.5GHz
2 x ABS(V
OUT_P
- V
OUT_M
),
ODE_1 = GND, ODE_0 = V
CC
(see Table 1), f = 500MHz
2 x ABS(V
OUT_P
- V
OUT_M
),
ODE_1 = ODE_0 = GND (see Table 1),
f = 500MHz
MIN
6
10
8
6
150
1200
TYP
MAX
UNITS
dB
dB
dB
dB
mV
P-P
MAX4969
V
TX-DIFF-PP
V
TX-DIFF-PP-
LOW
800
1000
1200
mV
P-P
600
750
0
3.5
6
0
3.5
6
900
mV
P-P
dB
dB
dB
dB
dB
dB
V
TX-DE-RATIO-
f = 2.5GHz, ODE_1 = GND, ODE_0 =
V
CC
or GND, Figure 1 (see Table 1)
0dB
V
TX-DE-RATIO-
f = 2.5GHz, ODE_1 = V
CC
,
ODE_0 = GND, Figure 1 (see Table 1)
3.5dB
V
TX-DE-RATIO-
f = 2.5GHz, ODE_1 = V
CC,
ODE_0 = V
CC
, Figure 1 (see Table 1)
6dB
V
RX-EQ-0dB
V
RX-EQ-3.5dB
V
RX-EQ-6dB
V
TX-CM-AC-PP
T
PD
T
TX-RISE-FALL
T
TX-RF-
MISMATCH
f = 2.5GHz, INEQ_1 = GND,
INEQ_0 = GND or V
CC
(see Table 2)
f = 2.5GHz, INEQ_1 = V
CC,
INEQ_0 = GND (see Table 2)
f = 2.5GHz, INEQ_1 = V
CC,
INEQ_0 =
V
CC
(see Table 2)
MAX(V
OUT_P
+ V
OUT_M
)/2 -
MIN(V
OUT_P
+ V
OUT_M
)/2 (Note 4)
(Note 4)
(Notes 4, 5)
(Notes 4, 5)
(Note 4)
K28.5
P
pattern, AC-coupled, R
L
= 50I,
effects of deemphasis deembedded
(Note 4), 5GT/s
D10.2 pattern, f > 1.5MHz
From input to output
From input to output
160
30
100
280
400
mV
P-P
ps
ps
20
10
20
0.5
15
8
1.4
15
ps
ps
ps
P-P
ps
RMS
ns
ns
T
SK
T
TX-DJ-DD
T
TX-RJ-DD
T
TX-IDLE-SET-
TO-IDLE
T
TX-IDLE-TO-
DIFF-DATA
3
PCIe, Single Lane, 2:1/1:2 Multiplexer and
Redriver with Equalization
MAX4969
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +3.0V to +3.6V, C
CL
= 75nF coupling capacitor on each output, R
L
= 50I on each output, T
A
= 0NC to +70NC, unless other-
wise noted. Typical values are at V
CC
= +3.3V and T
A
= +25NC.) (Note 3)
PARAMETER
Electrical Idle Detect Threshold
Output Voltage During
Electrical Idle (AC)
Receiver Detect Pulse
Amplitude
Receiver Detect Pulse Width
Receiver Detect Retry Period
CONTROL LOGIC
Input Logic-Level Low
Input Logic-Level High
Input Logic Hysteresis
Input Pulldown Resistor
V
IL
V
IH
V
HYST
R
DOWN
37.5
1.4
130
60
150
0.6
V
V
mV
kW
SYMBOL
V
TX-IDLE-
THRESH
CONDITIONS
MIN
65
TYP
100
MAX
120
35
600
UNITS
mV
P-P
mV
P-P
mV
ns
ns
V
TX-IDLE-DIFF-
AC-P
ABS(V
OUT_P
- V
OUT_M
)
Voltage change in positive direction
(Note 4)
100
200
V
TX-RCV-
DETECT
Note 3:
All devices are 100% production tested at T
A
= +70NC. Specifications for all temperature limits are guaranteed by design.
Note 4:
Guaranteed by design.
Note 5:
Rise and fall times are measured using 20% and 80% levels.
According to foreign media reports, a powerful copycat factory recently designed an incredible mobile phone, which includes a cigarette lighter, which can be used to light cigarettes through the cigar...
[i=s]This post was last edited by wangerxian on 2021-11-18 15:24[/i]What is the principle of wireless charging?First, let's define wireless charging: Wireless charging refers to a charging method that...
What are these two devices I saw on a sample board? Especially the 22mΩF at the bottom, it looks very unusual. Can anyone tell me what I am doing? Could it be a current measurement or something like t...
ARM supports 16 coprocessors for various coprocessor operations. The most commonly used coprocessors are system coprocessors for controlling on-chip functions, such as controlling the cache memory man...
This is a question from a netizen:What? I bought it! I was brainwashed after watching Li Jiaqi.Do you know? What happened to me who didn't want to use the wires? My God, my wallet is so flat that I ca...
Traditional broadcasting systems generally need to be operated manually at a fixed time, and can only realize one-way broadcasting with few functions. Traditional bell ringing equipment has a singl...[Details]
In early 2002, I started to write a working program for an IC card prepaid electricity meter. The meter used Philips' 8-bit 51-expanded single-chip microcomputer
87LPC764
, and wa...[Details]
Microchip's PIC18F46J50 is a low-power, high-performance 8-bit USB microcontroller (MCU) using nanoWatt XLP technology. The current in deep sleep mode can be as low as 13nA, the operating voltage i...[Details]
introduction
my country has a vast territory and a large population. The scale of housing construction is huge, and the amount of residential construction is large and wide. It is still on t...[Details]
1. Circuit composition
The whole circuit consists of two parts:
1. Power saving control circuit
As shown in the figure below. Including delay circuit and drive circuit.
(1) Delay ci...[Details]
Today, with the increasing integration of functions, mobile phones can also be used as portable media players (PMP), digital cameras, handheld computers (PDAs), and even global positioning systems ...[Details]
1. Introduction
With the growth of parking demand, the scale of parking lots is becoming larger and larger. A lot of research has been done on intelligent parking lots in China, but most of th...[Details]
introduction
Throughout the history of automotive lighting, power has always played an important role. Initially, cars only needed headlights to see the road in the dark. Later, other light so...[Details]
Converged processors meet scalability requirements
In current embedded system design, solutions based on MCU, DSP, FPGA and ASIC account for more than 90% of the market share. These solutions ...[Details]
Abstract: In order to generate a stable excitation signal, the design of a digital frequency synthesizer is implemented on FPGA using Verilog hardware language. The design includes accumulator, wav...[Details]
I. Introduction
In the field of power conversion, isolated converters (forward, flyback, and double-ended) with low output DC voltage all use MOSFET as the rectifier device. Since these devi...[Details]
Two simple circuits are implemented to drive two LEDs from a battery powered microprocessor.
This design is based on a circuit that uses three resistors and a microprocessor I/O pin as an input h...[Details]
AD8205 is
a single-supply high-performance differential
amplifier
launched by
Analog
Devices of the United States
. The typical single-supply voltage is 5V, and its common-mode volta...[Details]
Microcalorimetry
is used to determine energy relationships. Microcalorimetry techniques are often required when performing calorimetric experiments with small sample sizes or slow heating rat...[Details]
I've been studying dot matrix recently. It looks simple, but it takes a while to master it completely! The 8*8 dot matrix hardware circuit I'm making now is like this. The row is driven by 74HC138 + t...[Details]
Creative Market
京公网安备 11010802033920号
EEWORLD
