EK30
Evaluation Kit
APPLICABLE PARTS (SOLD SEPARATELY)
•
•
•
•
•
PA07
PA08
PA85
PA88
PA96
INTRODUCTION
This easy to use kit provides a platform with good circuit board layout and grounding to evaluate Power
Amplifiers PA07, PA08, PA09, PA85, PA88, and PA96. With additional prototype area, it is flexible enough to
analyze a multitude of standard or proprietary circuit configurations. All components are provided with the
kit. Similar circuitry is used for evaluation and the circuit for a particular package can be changed using jump‐
ers. External connections to the evaluation kit can be made through the connectors at the edges of the cir‐
cuit. The circuit provides an input line termination of 50
Ω.
The PA07 and PA09 are configured for a gain of 12. The PA08 and PA96 are configured for a gain of 21.
The PA85 and PA88 are configured for a gain of 53. This evaluation kit provides flexibility for modifying the
gain, in inverting or non‐inverting mode.
Figure 1: PCB Layout
Composite
Component Side
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© Apex Microtechnology Inc.
All rights reserved
Jan 2016
EK30U Rev C
EK30
PARTS LIST
Reference
Resistors
RT
RIN, RIN2
RFB1‐A, RFB3‐A
RFB1‐B, RFB3‐B
RFB1‐C, RFB3‐C
RLIM1‐A, RLIM2‐A
RLIM1‐B
RLIM1‐C, RLIM2‐C
RLIM1‐D
RTRIM
RS‐A
RS‐B
RIS01, RIS02
PR03000205109JAC00
RN60D1801FB14
CMF5510K000FKEA
RN60D1802FB14
RN60D4702FB14
ERX‐3SJR22V
ERX‐3SJR68
ERX‐3SJ4R7
PR01000101109JR500
3386T‐1‐502LF
CMF55267K00FHEB
PR02000207503JR500
51
Ω,
3W, 5%
1.8 kΩ, 1/4W, 1%
10 kΩ, 1/4W, 1%
18 kΩ, 1/4W, 1%
47 kΩ, 1/4W, 1%
0.22
Ω,
3W, 5%
0.68
Ω,
3W, 5%
4.7
Ω,
3W, 5%
11
Ω,
1W, 5%
5 kΩ, 1/2W
267 kΩ, 1/2W, 1%
750 kΩ, 2W, 5%
0
Ω,
Wire Jumper
EVAL 75
CD15CD050DO3F
CD15CD100JO3F
CD15ED330JO3F
DME6P22K‐F
381LX221M400J452
1N4148‐T
MUR160G
HS02
HS14
TW03
MS03
146510CJ
571‐0100
91735A190
91735A192
91841A009
8426
8413
2221
Printed Circuit Board
MICA, 5pF
MICA, 10pF
MICA, 33pF
FILM, 0.22uF
ALUM, 220uF
Switching Diode
Rectifier, Ultra Fast
Heatsink, PA08, PA88
Heatsink, PA07, PA09, PA85, PA96
Thermal Washer (Pack of 10 Pcs)
Socket, TO‐3
BNC Connector, PC Mount
Banana Jacks, PC Mount
Screw, Panhead, #8 X 0.25”
Screw, Panhead, #8 X 0.375”
Nut, Hex, #8
Spacer, Hex, with Stud, #8 X 0.375”
Spacer, Hex, with Stud, #6 X 0.375”
Standoff, Hex, #8 X 2.00”
1
2
2
2
2
2
1
2
1
1
1
1
2
1
1
1
1
2
2
2
2
1
1
1
1
1
5
4
4
4
4
4
4
Manufacturer Part #
Description
Qty
Printed Circuit Board
EVAL 75
Capacitors
CC‐A
CC‐B
CC‐C
CBP1, CBP3
CBP2, CBP4
Diodes
D1, D2
D3, D4
Hardware
EK30U Rev C
3
EK30
Reference
Manufacturer Part #
91735A151
91841A007
91735A146
Description
Screw, Panhead, #6 X 0.75”
Nut, Hex, #6 X 5/16”
Screw, Panhead, #6 X 0.375”
Tubing, Teflon, #18AWG, 6 Inches
Jumper, Slip On
Header, Connector
Test Point, PC Mini
Qty
2
6
4
1
10
10
10
Miscellaneous
TFT20018NA005‐6"
SPC02SVJN‐RC
PRPC002SADN‐RC
5001
Table 1 identifies the components that should be installed in the schematic for a particular Power Ampli‐
fier. The top row lists all the Power Amplifiers. The “X” indicates components which are common to all six op
amp models. N/A means that the component should not be installed. The letters A, B, C, D indicate the spe‐
cific type of component to be selected from the parts list above. The parts list shows all the components that
are supplied with the kit.
TABLE 1
PA07
RT
RIN1, RIN2
D1, D2, D3, D4
RC
CC
RFB1
RFB3
RLIM1
RLIM2
RS
RTRIM
RISO1, RISO2
CBP1, CBP2, CBP3, CBP4
X
X
X
N/A
N/A
A
A
A
A
A
X
X
X
PA08
X
X
X
N/A
N/A
B
B
C
C
B
X
X
X
PA09
X
X
X
0Ω
C
A
A
N/A
N/A
A
X
X
X
PA85
X
X
X
0Ω
A
C
C
C
N/A
N/A
N/A
X
X
PA88
X
X
X
0Ω
B
C
C
D
N/A
N/A
N/A
X
X
PA96
X
X
X
0Ω
B
B
B
B
N/A
N/A
N/A
X
X
4
EK30U Rev C
EK30
BEFORE YOU GET STARTED
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•
•
•
•
•
•
All Apex Microtechnology amplifiers should be handled using proper ESD precautions.
Always use the heat sink and thermal washers included in this kit.
Always use adequate power supply bypassing.
Do not change the connections while the circuit is powered.
Initially set all power supplies to the minimum operation levels allowed in the device data sheet.
Check for oscillations.
Please refer to Application Note, AN01 for general operating considerations.
ASSEMBLY
During the assembly, please refer to the circuit schematics, assembly drawings, and the data sheet of the part
being used on the evaluation kit.
1. Note that each side of the circuit board is identified as either the component side or the DUT side. The
component side has the reference designators printed on that side.
2. All the components (except the mating socket) are installed on the component side of the board and sol‐
dered on the DUT side.
3. A T0‐3 socket (MS03) is supplied with this kit. The MS03 socket incorporates two cavities to retain the #6
x 5/16” nuts (91841A007). Insert one #6 nut into each cavity. Make sure the nuts are fully seated into the
cavities. (Using #6 x 0.75” screws (91735A151) provided with the kit, mount the socket on DUT side of
the board.)
4. Two heat sinks are provided with this kit. Use the larger heat sink (HS14) for power amplifiers PA07, PA09,
PA85, and PA96. Attach the heat sink to the board from the DUT side, using #8 x 0.375” screws
(91735A192). Refer to the assembly drawings for the correct way to attach the heat sink. This is done to
keep the socket tightly mounted to the board, to provide support, and eliminate stress so that the socket
pins do not move while being soldered from the component side. Once the socket pins are soldered, the
socket is now attached to the board; remove the heat sink and all the screws.
5. First install all the smaller components on the board. This is done because it becomes difficult to install a
smaller part on the board once all the larger components are installed.
6. Refer to the table 1 for the components to be soldered for a specific Power amplifier.
7. Some components are common for all the power amplifiers (RT,RIN1,RIN2,D1,D2,D3,D4,RISO1,RISO
2,CBP1,CBP2,CBP3,CBP4). Install these parts first.
8. Ensure that the orientation of the electrolytic capacitors (EC07) and the diodes match the circuit sche‐
matic drawing.
9. Mount the BNC connector provided with the kit (146510CJ) and solder it to the board. Also, mount the
banana jacks (571‐0100) provided with the kit.
10. Attach the appropriate heat sink (HS02 for PA08, PA88 and HS14 for PA07, PA09, PA85, and PA96) to the
board from the DUT side, as in
STEP 4.
11. Stand offs (#8 Hex, 91841A009) are also provided with the kit. Install the # 8 x 0.25”screws (91735A190),
provided with the kit, from the component side. Attach the standoffs to these screws on the corners of
the board. Refer to the assembly drawings while installing the standoffs.
12. Cut the Teflon tubing into 8 pieces, each of length 0.121 (1/8 of an inch) inches approximately. These
pieces go onto the pins of the Power Amplifier before inserting it into the socket. The Teflon tubing is used
to insulate the pins from the heat sink and make sure that the PA is tightly fixed into the socket. An Exacto
knife works well for this.
NOTE
The Teflon pieces should not be longer than the suggested length. If the pieces are longer, they
may interfere in the seating of the part to the heat sink and create a gap between the heat sink and the
part body.
EK30U Rev C
5
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