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430474-501

Description
PELTIER SH10,125,05,L1,W4.5
CategoryThermal management products   
File Size311KB,3 Pages
ManufacturerLaird Technologies
Environmental Compliance
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430474-501 Overview

PELTIER SH10,125,05,L1,W4.5

430474-501 Parametric

Parameter NameAttribute value
Overall dimensions L x W x H29.70mm x 29.70mm x 3.20mm
Qmax at different Th33.7W @ 25°C
Delta Tmax at different Th67°C @ 25°C
Current - maximum4A
Voltage - maximum14.3V
resistance3.3 Ohms
Operating temperature80°C
characteristicLead wire, unsealed
SH Series SH10-125-05
Thermoelectric Modules
The SH Series is an annular-style thermoelectric module (TEM). The
hot and cold side ceramics have a circular hole in the center to
accommodate light protrusion for optics, mechanical fastening or
temperature probe.
This product line is available in multiple configurations. Assembled
with Bismuth Telluride semiconductor material and thermally
conductive Aluminum Oxide ceramics, the SH Series is designed for
higher current and larger heat-pumping applications.
Americas: +1.919.597.7300
Europe: +46.31.420530
Asia: +86.755.2714.1166
ets.sales@lairdtech.com
www.lairdtech.com
FEATURES
Center hole
Precise temperature control
Reliable solid state operation
No sound or vibration
DC operation
RoHS compliant
Analytical instrumentation
Clinical diagnostics
Photonics laser systems
Industrial instrumentation
Food & beverage cooling
Consumer appliances
APPLICATIONS
SPECIFICATIONS
TECHNICAL
Hot Side Temperature (°C)
Qmax (Watts)
Delta Tmax (°C)
Imax (Amps)
Vmax (Volts)
Module Resistance (Ohms)
25°C
33.7
67
4.0
14.3
3.30
50°C
37.0
75
4.0
16.2
3.72
SUFFIX
L
L1
L2
MM
THICKNESS
(PRIOR TO
TINNING)
FLATNESS &
PARALLELISM
0.0015”/0.0015”
0.001”/0.001”
0.0005”/0.0005”
0.002”/0.002”
HOT FACE
Lapped
Lapped
Lapped
Metallized
COLD FACE
Lapped
Lapped
Lapped
Metallized
LEAD LENGTH
4.5”
4.5”
4.5”
4.5”
0.126”±0.010”
0.126”±0.001”
0.126”±0.0005”
0.134”±0.010”
SEALING OPTIONS
SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION
RT
EP
RTV
Epoxy
White
Black
-60 to 204 °C
-55 to 150 °C
Non-corrosive, silicone adhesive
Low density syntactic foam epoxy encapsulant
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