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QB0805B40ESS3

Description
THERMAL CONDUCTOR Q-BRIDGE
CategoryThermal management products   
File Size270KB,3 Pages
ManufacturerATC [American Technical Ceramics]
Environmental Compliance
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QB0805B40ESS3 Overview

THERMAL CONDUCTOR Q-BRIDGE

QB0805B40ESS3 Parametric

Parameter NameAttribute value
typeheat sink
cooling package-
Joining methodSMD base
shaperectangle
length0.080"(2.03mm)
width0.050"(1.27mm)
diameter-
Height from base (fin height)0.040"(1.02mm)
Power dissipation at different temperature rises-
Thermal resistance at different forced airflows-
Thermal resistance under natural conditions7.00°C/W
Materialberyllium oxide ceramics
Material plating-
ATC Q-BRIDGE THERMAL CONDUCTOR
ATC Q-Bridge
Thermal Conductor
ATC’s new Q-Bridge Thermal Conductor is manufac-
tured with the highest quality materials for reliable and
repeatable performance providing a cost effective
thermal management solution. These devices are
constructed with Aluminum Nitride (AlN) or Beryllium
Oxide (BeO) and are available in standard EIA form factors.
Q-Bridge provides the designer with the ability to manage
thermal conditions by directing heat to a thermal ground
plane, heat sink or any other specific thermal point
of interest. The inherently low capacitance makes
this device virtually transparent at RF / microwave
frequencies. This device has the added benefit of offering
additional layers of protection to adjacent components
from hot spot thermal loads.
Q-Bridge provides the benefit of increased overall cir-
cuit reliability. ATC’s Q-Bridge is manufactured using
one-piece construction, providing a RoHS compliant
SMT package that is fully compatible with high speed auto-
mated pick-and-place processing. It is available in various
EIA case sizes. Custom configurations are also available.
Applications:
• GaN Power Amplifiers
• High RF Power Amplifiers
• Filters
• Synthesizers
• Industrial Computers
• Switch Mode Power Supplies
• Pin & Laser Diodes
Features:
• High Thermal Conductivity
• Low Thermal Resistance
• Low Capacitance
• Increases Circuit Reliability
• RoHS Compliant
• More efficient thermal management
Functional Applications:
• Between active device and adjacent ground planes
• Specific contact pad to case
• Contact pad to contact pad
• Direct component contact to via pad or trace
• Edges fully metalized
Termination Materials
ATC Termination Code
Y
S
Termination Materials
Silver Platinum Non-Magnetic Termination
Silver over Magnetic Termination
Note: Non-edge wrapped style in all case sizes is supplied with S termination
Edge wrapped style in case sizes 0302 through 1111 is supplied with Y termination
Edge wrapped style in case sizes 2010 through 3737 are supplied with S termination
ATC # 001-1143
Rev. H, 7/17
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