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C1012-AUDIT-17U-12X18

Description
EMBEDDED CAPACITANCE MATERIAL
CategoryDevelopment board/suite/development tools   
File Size228KB,4 Pages
Manufacturer3M
Websitehttp://3M.com/esd
Environmental Compliance
Download Datasheet Parametric View All

C1012-AUDIT-17U-12X18 Overview

EMBEDDED CAPACITANCE MATERIAL

C1012-AUDIT-17U-12X18 Parametric

Parameter NameAttribute value
Accessory typeEmbedded Capacitive Material (ECM), 12" x 18"
Supporting products/related productscircuit board
Technical Data | July 2017
3M
Embedded Capacitance Material (ECM)
Utilize a proven solution
• Laminate is a UL Recognized Component that’s RoHS2 compliant and
Halogen free3 with high capacitance density that can be embedded
into PCBs and chip packages as either a power ground plane or a
discrete capacitor
• Consists of a very thin layer of ceramic-filled epoxy sandwiched between
two layers of copper foil
• Compatible with a large range of PCB material sets and with standard
PCB fabrication and assembly processes, including lead-free
• A variety of custom panel sizes and copper thicknesses available
• In production in telecom, computer, test and measurement, military/
aerospace, medical and consumer electronics applications
IC
PCB
3M
Embedded Capacitance
Material (ECM)
Allows for Capacitor Removal
IC
PCB
SMT-Capacitor
Simplify design while amplifying performance
• Helps increase usable board area by allowing for the removal of many,
if not all, capacitors equal to or below 0.1 µF and their associated solder
joints and vias
• Helps improve power integrity by reducing power bus noise and
PCB impedance
• Helps reduce EMI by decreasing resonance that causes EMI
• Dissipates heat better than thin FR-4 due to high thermal conductivity
and low thermal impedance
Bus Noise (dbm)
Helps Reduce Power Bus Noise
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
10
99.4
189
368
725
815
904
993
1172
1262
1351
1083
1440
278
457
546
636
3 mil FR-4, No Low L Caps
3M
Embedded Capacitance Material (ECM)
PCB with 3 mil FR-4
PCB with 3M ECM
Frequency (MHz)
Enable product roadmaps
• Simplify board layout and routing
• Reduce PCB size, thickness and weight
• Add functionality on fixed form factors
• Lower spreading inductance
• Helps reduce interference from digital circuits to analog/RF circuits
in mixed signal applications
• Add PCB layers while maintaining similar PCB thickness
• Helps reduce design spins by solving noise issues early in the
design cycle
• Helps improve PCB panel utilization
• Helps improve assembly yields and board reliability due to
fewer components
Visit us at www.3Mcapacitance.com
Field Strength
Helps Reduce EMI
PCB with SMT Capacitor
PCB with 2 mil FR-4
PCB with 3M
Embedded
Capacitance Material (ECM)
• Decrease need for EMC measures such as metal shells, tapes, etc.
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