A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
Recently, I used STM32 to debug an SD card using the SPI method. With the same code, SPI1 and SPI2 can read and write 1G and 2G cards normally, but SPI3 can only read 1G cards, and the 2G card initial...
[font=微软雅黑][size=3]Hello, EE netizens! After the lively Spring Festival holiday, we are back to work again. Some netizens are definitely still in the holiday state~:lol Before we start working at full...
Design Name: IGBT DriverProject description: Use the GD32 pwm module to make an IGBT driver, which uses two timers, one for the high frequency part and the other for the low frequency part.System bloc...
I believe that the question of the development direction of technical personnel is a question that everyone is concerned about. Now let me talk about my thoughts. Technical personnel can choose the fo...
Create a "working copy" of the LED data in a ulab/numpy array and use the ulab functions wherever possible. Then at the last possible moment, copy the information from the working copy into the real L...
This program is written to simulate the serial port hardware mechanism. When used, a timed interrupt can be set with a time interval of 1/4 baud rate. The receiving function is called once for ea...[Details]
All electronic design engineers and scientists have performed electrical signal analysis, or signal analysis for short. Through this basic measurement, they can gain insight into signal details and...[Details]
As cellular phones become more advanced, the power consumption of the system during operation and the power consumption during standby are also increasing. Therefore, the power management design of...[Details]
DSP (digital signal processor) is used more and more frequently in today's engineering applications. There are three main reasons for this: first, it has powerful computing power and is capable of ...[Details]
Power management solutions for today's portable application processors are becoming increasingly integrated. Total power consumption, standby and sleep current consumption affect battery size, bill...[Details]
With the rapid development of urban economy, elevators are increasingly used as a vertical transportation tool. However, elevator fault detection and maintenance, especially the role of elevator remot...[Details]
1. Introduction
At present, most lighting equipment still uses traditional energy for lighting. Making full use of solar energy as the energy supply for lighting equipment is of great si...[Details]
Overview:
This paper introduces a method of connecting a CAN-bus network with Ethernet to form a medium-sized remote monitoring/data transmission network.
CAN (Controller Area Network) is ...[Details]
LED is the abbreviation of light emitting diode, which is an electric light source made of semiconductor technology. The core part of LED is a chip composed of P-type semiconductor and N-type semi...[Details]
Many battery-powered systems require a visual indicator to show when the battery needs to be replaced. LEDs are commonly used for this purpose, but they consume at least 10mA of current. This con...[Details]
It is well known to automotive suppliers that automakers are demanding more from their supply base. For connector suppliers, this means stricter requirements for product performance, stability and ...[Details]
The era of mobile access to the Internet has arrived, and it will rapidly change the business and infrastructure needs of mobile operators under a whole new trend of requirements. We need 4G LTE to...[Details]
To understand how and why OLED power supply affects display image quality, you must first understand OLED display technology and power supply requirements. This article will explain the latest OLED...[Details]
introduction
Incandescent bulbs can emit a variety of light, but in specific applications, only green, red, and yellow light are usually needed - such as traffic lights. If an incand...[Details]
The production process of lithium batteries does not mention the previous processes such as material preparation, winding, liquid injection, and packaging, but only talks about the final formation ...[Details]
stm32/stm8
京公网安备 11010802033920号
EEWORLD
