W25Q256FVCIP datasheet, PDF - EEWORLD Datasheet

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W25Q256FVCIP: Description256MX1 FLASH 3V PROM, PBGA24, 8 X 6 MM, GREEN, TFBGA-24; Categorystorage storage; File Size1MB，108 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw; Environmental Compliance

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W25Q256FVCIP Overview

256MX1 FLASH 3V PROM, PBGA24, 8 X 6 MM, GREEN, TFBGA-24

W25Q256FVCIP Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	1308634909
package instruction	8 X 6 MM, GREEN, TFBGA-24
Reach Compliance Code	compliant
ECCN code	EAR99
Samacsys Manufacturer	Winbond
Samacsys Modified On	2020-06-08 07:33:02
YTEOL	0
Maximum clock frequency (fCLK)	80 MHz
Data retention time - minimum	20
Durability	100000 Write/Erase Cycles
JESD-30 code	R-PBGA-B24
length	8 mm
memory density	268435456 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	24
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	32MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA24,4X6,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
Parallel/Serial	SERIAL
Programming voltage	3 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Serial bus type	SPI
Maximum standby current	0.00002 A
Maximum slew rate	0.025 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
type	NOR TYPE
width	6 mm
write protect	HARDWARE/SOFTWARE

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W25Q256FV

3V 256M-BIT

SERIAL FLASH MEMORY WITH

DUAL/QUAD SPI & QPI

Publication Release Date: April 29, 2013

Preliminary - Revision F

W25Q256FV

Table of Contents

GENERAL DESCRIPTIONS ........................................................................................................ 5

FEATURES ................................................................................................................................. 5

PACKAGE TYPES AND PIN CONFIGURATIONS ....................................................................... 6

3.1

3.2

3.3

3.4

3.5

3.6

4.1

4.2

4.3

4.4

4.5

4.6

Pad Configuration WSON 8x6-mm ................................................................................... 6

Pad Description WSON 8x6-mm ...................................................................................... 6

Pin Configuration SOIC 300-mil........................................................................................ 7

Pin Description SOIC 300-mil ........................................................................................... 7

Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ............................................... 8

Ball Description TFBGA 8x6-mm ...................................................................................... 8

Chip Select (/CS) ............................................................................................................. 9

Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................. 9

Write Protect (/WP) ......................................................................................................... 9

HOLD (/HOLD) ................................................................................................................ 9

Serial Clock (CLK) ........................................................................................................... 9

Reset (/RESET) ............................................................................................................... 9

PIN DESCRIPTIONS ................................................................................................................... 9

BLOCK DIAGRAM ..................................................................................................................... 10

FUNCTIONAL DESCRIPTIONS................................................................................................. 11

6.1

SPI / QPI Operations ..................................................................................................... 11

6.1.1

6.1.2

6.1.3

6.1.4

6.1.5

6.1.6

6.1.7

Standard SPI Instructions .................................................................................................... 11

Dual SPI Instructions ............................................................................................................ 11

Quad SPI Instructions .......................................................................................................... 12

QPI Instructions .................................................................................................................... 12

3-Byte / 4-Byte Address Modes ............................................................................................ 12

Hold Function ....................................................................................................................... 13

Software Reset & Hardware /RESET pin ............................................................................. 13

6.2

7.1

Write Protection ............................................................................................................. 14

Status Registers ............................................................................................................ 15

7.1.1

7.1.2

7.1.3

7.1.4

7.1.5

7.1.6

7.1.7

7.1.8

Erase/Write In Progress (BUSY) –

Status Only

................................................................... 15

Write Enable Latch (WEL) –

Status Only

............................................................................. 15

Block Protect Bits (BP3, BP2, BP1, BP0) –

Volatile/Non-Volatile Writable

.......................... 16

Top/Bottom Block Protect (TB) –

Volatile/Non-Volatile Writable

.......................................... 16

Complement Protect (CMP) –

Volatile/Non-Volatile Writable

............................................... 16

Status Register Protect (SRP1, SRP0) –

Volatile/Non-Volatile Writable

.............................. 16

Erase/Program Suspend Status (SUS) –

Status Only

......................................................... 17

Security Register Lock Bits (LB3, LB2, LB1) –

Volatile/Non-Volatile OTP Writable

............. 17

STATUS AND CONFIGURATION REGISTERS ......................................................................... 15

-1-

W25Q256FV

7.1.9

7.1.10

7.1.11

7.1.12

7.1.13

7.1.14

7.1.15

7.1.16

7.1.17

7.1.18

Quad Enable (QE) –

Volatile/Non-Volatile Writable

............................................................. 17

Current Address Mode (ADS) –

Status Only

...................................................................... 18

Power-Up Address Mode (ADP) –

Non-Volatile Writable

................................................... 18

Write Protect Selection (WPS) –

Volatile/Non-Volatile Writable

......................................... 18

Output Driver Strength (DRV1, DRV0) –

Volatile/Non-Volatile Writable

............................. 19

HOLD or /RESET Pin Function (HOLD/RST) –

Volatile/Non-Volatile Writable...................

Reserved Bits –

Non Functional

......................................................................................... 19

W25Q256FV Status Register Memory Protection (WPS = 0, CMP = 0) ............................ 20

W25Q256FV Status Register Memory Protection (WPS = 0, CMP = 1) ............................ 21

W25Q256FV Individual Block Memory Protection (WPS=1) .............................................. 22

7.2

8.1

Extended Address Register –

Volatile Writable Only

....................................................... 23

Device ID and Instruction Set Tables ............................................................................. 24

8.1.1

8.1.2

8.1.3

8.1.4

8.1.5

8.1.6

8.1.7

Manufacturer and Device Identification ................................................................................ 24

Instruction Set Table 1 (Standard/Dual/Quad SPI, 3-Byte & 4-Byte Address Mode)

(1)

INSTRUCTIONS ........................................................................................................................ 24

........ 25

(1)

Instruction Set Table 2 (Standard/Dual/Quad SPI Instructions, 3-Byte Address Mode) .... 26

Instruction Set Table 3 (Standard/Dual/Quad SPI Instructions, 4-Byte Address Mode) .... 27

Instruction Set Table 4 (QPI Instructions, 3-Byte & 4-Byte Address Mode)

Instruction Set Table 5 (QPI Instructions, 3-Byte Address Mode)

Instruction Set Table 6 (QPI Instructions, 4-Byte Address Mode)

(14)

..................... 28

.................................... 29

8.2

Instruction Descriptions .................................................................................................. 31

8.2.1

8.2.2

8.2.3

8.2.4

8.2.5

8.2.6

8.2.7

8.2.8

8.2.9

8.2.10

8.2.11

8.2.12

8.2.13

8.2.14

8.2.15

8.2.16

8.2.17

8.2.18

8.2.19

8.2.20

8.2.21

Write Enable (06h) ............................................................................................................... 31

Write Enable for Volatile Status Register (50h) .................................................................... 31

Write Disable (04h) .............................................................................................................. 32

Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) .............. 32

Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) .............. 33

Read Extended Address Register (C8h) .............................................................................. 36

Write Extended Address Register (C5h) .............................................................................. 37

Enter 4-Byte Address Mode (B7h) ....................................................................................... 38

Exit 4-Byte Address Mode (E9h) .......................................................................................... 38

Read Data (03h) ................................................................................................................. 39

Read Data with 4-Byte Address (13h) ................................................................................ 40

Fast Read (0Bh) ................................................................................................................. 41

Fast Read with 4-Byte Address (0Ch) ................................................................................ 43

Fast Read Dual Output (3Bh) ............................................................................................. 44

Fast Read Dual Output with 4-Byte Address (3Ch) ............................................................ 45

Fast Read Quad Output (6Bh) ........................................................................................... 46

Fast Read Quad Output with 4-Byte Address (6Ch) .......................................................... 47

Fast Read Dual I/O (BBh) .................................................................................................. 48

Fast Read Dual I/O with 4-Byte Address (BCh) ................................................................. 50

Fast Read Quad I/O (EBh) ................................................................................................. 52

Fast Read Quad I/O with 4-Byte Address (ECh) ................................................................ 55

-2-

Publication Release Date: April 29, 2013

Preliminary - Revision F

W25Q256FV

8.2.22

8.2.23

8.2.24

8.2.25

8.2.26

8.2.27

8.2.28

8.2.29

8.2.30

8.2.31

8.2.32

8.2.33

8.2.34

8.2.35

8.2.36

8.2.37

8.2.38

8.2.39

8.2.40

8.2.41

8.2.42

8.2.43

8.2.44

8.2.45

8.2.46

8.2.47

8.2.48

8.2.49

8.2.50

8.2.51

8.2.52

8.2.53

Word Read Quad I/O (E7h)................................................................................................ 57

Octal Word Read Quad I/O (E3h) ...................................................................................... 59

Set Burst with Wrap (77h) .................................................................................................. 61

Page Program (02h) ........................................................................................................... 62

Quad Input Page Program (32h) ........................................................................................ 64

Sector Erase (20h) ............................................................................................................. 65

32KB Block Erase (52h) ..................................................................................................... 66

64KB Block Erase (D8h) .................................................................................................... 67

Chip Erase (C7h / 60h)....................................................................................................... 68

Erase / Program Suspend (75h)......................................................................................... 69

Erase / Program Resume (7Ah) ......................................................................................... 71

Power-down (B9h).............................................................................................................. 72

Release Power-down / Device ID (ABh) ............................................................................ 73

Read Manufacturer / Device ID (90h) ................................................................................ 75

Read Manufacturer / Device ID Dual I/O (92h) .................................................................. 76

Read Manufacturer / Device ID Quad I/O (94h) ................................................................. 77

Read Unique ID Number (4Bh) .......................................................................................... 78

Read JEDEC ID (9Fh) ........................................................................................................ 79

Read SFDP Register (5Ah) ................................................................................................ 80

Erase Security Registers (44h) .......................................................................................... 81

Program Security Registers (42h) ...................................................................................... 82

Read Security Registers (48h) ........................................................................................... 83

Set Read Parameters (C0h) ............................................................................................... 84

Burst Read with Wrap (0Ch) .............................................................................................. 85

Enter QPI Mode (38h) ........................................................................................................ 86

Exit QPI Mode (FFh) .......................................................................................................... 87

Individual Block/Sector Lock (36h) ..................................................................................... 88

Individual Block/Sector Unlock (39h).................................................................................. 89

Read Block/Sector Lock (3Dh) ........................................................................................... 90

Global Block/Sector Lock (7Eh) ......................................................................................... 91

Global Block/Sector Unlock (98h) ...................................................................................... 91

Enable Reset (66h) and Reset Device (99h)...................................................................... 92

ELECTRICAL CHARACTERISTICS ........................................................................................... 93

9.1

Absolute Maximum Ratings (1) ...................................................................................... 93

9.2

9.3

9.4

9.5

9.6

9.7

9.8

Operating Ranges .......................................................................................................... 93

Power-up Timing and Write Inhibit Threshold ................................................................. 94

DC Electrical Characteristics .......................................................................................... 95

AC Measurement Conditions .......................................................................................... 96

AC Electrical Characteristics

(6)

....................................................................................... 97

AC Electrical Characteristics (cont’d) ............................................................................. 98

Serial Output Timing ...................................................................................................... 99

-3-

W25Q256FVCIP Related Products

	W25Q256FVCIP	W25Q256FVBIP TR	W25Q256FVCIP TR	W25Q256FVEIP TR	W25Q256FVFIP TR	W25Q256FVBIP	W25Q256FVEIP	W25Q256FVFIP
Description	256MX1 FLASH 3V PROM, PBGA24, 8 X 6 MM, GREEN, TFBGA-24	IC FLASH 256M SPI 24TFBGA	IC FLASH 256M SPI 24TFBGA	IC FLASH 256M SPI 104MHZ 8WSON	IC FLASH 256M SPI 104MHZ 16SOIC	256MX1 FLASH 3V PROM, PBGA24, 8 X 6 MM, GREEN, TFBGA-24	IC FLASH 256M SPI 104MHZ 8WSON	IC FLASH 256M SPI 104MHZ 16SOIC
technology	CMOS	FLASH - NOR	FLASH - NOR	FLASH - NOR	FLASH - NOR	CMOS	FLASH - NOR	FLASH - NOR
memory type	-	non-volatile	non-volatile	non-volatile	non-volatile	-	non-volatile	non-volatile
memory format	-	flash memory	flash memory	flash memory	flash memory	-	flash memory	flash memory
storage	-	256Mb （32M x 8）	256Mb （32M x 8）	256Mb （32M x 8）	256Mb （32M x 8）	-	256Mb （32M x 8）	256Mb （32M x 8）
Clock frequency	-	104MHz	104MHz	104MHz	104MHz	-	104MHz	104MHz
Write cycle time - words, pages	-	3ms	3ms	3ms	3ms	-	3ms	3ms
memory interface	-	SPI	SPI	SPI	SPI	-	SPI	SPI
Voltage - Power	-	2.7 V ~ 3.6 V	2.7 V ~ 3.6 V	2.7 V ~ 3.6 V	2.7 V ~ 3.6 V	-	2.7 V ~ 3.6 V	2.7 V ~ 3.6 V
Operating temperature	-	-40°C ~ 85°C（TA）	-40°C ~ 85°C（TA）	-40°C ~ 85°C（TA）	-40°C ~ 85°C（TA）	-	-40°C ~ 85°C（TA）	-40°C ~ 85°C（TA）
Installation type	-	surface mount	surface mount	surface mount	surface mount	-	surface mount	surface mount
Package/casing	-	24-TBGA	24-TBGA	8-WDFN Exposed Pad	16-SOIC (0.295", 7.50mm wide)	-	8-WDFN Exposed Pad	16-SOIC (0.295", 7.50mm wide)
Supplier device packaging	-	24-TFBGA（6x8）	24-TFBGA（6x8）	8-WSON（8x6）	16-SOIC	-	8-WSON（8x6）	16-SOIC

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