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W25Q256FVEIP

Description
IC FLASH 256M SPI 104MHZ 8WSON
Categorystorage   
File Size1MB,108 Pages
ManufacturerWinbond Electronics Corporation
Websitehttp://www.winbond.com.tw
Environmental Compliance
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W25Q256FVEIP Overview

IC FLASH 256M SPI 104MHZ 8WSON

W25Q256FVEIP Parametric

Parameter NameAttribute value
memory typenon-volatile
memory formatflash memory
technologyFLASH - NOR
storage256Mb (32M x 8)
Clock frequency104MHz
Write cycle time - words, pages3ms
memory interfaceSPI
Voltage - Power2.7 V ~ 3.6 V
Operating temperature-40°C ~ 85°C(TA)
Installation typesurface mount
Package/casing8-WDFN Exposed Pad
Supplier device packaging8-WSON(8x6)
W25Q256FV
3V 256M-BIT
SERIAL FLASH MEMORY WITH
DUAL/QUAD SPI & QPI
Publication Release Date: April 29, 2013
Preliminary - Revision F

W25Q256FVEIP Related Products

W25Q256FVEIP W25Q256FVBIP TR W25Q256FVCIP TR W25Q256FVEIP TR W25Q256FVFIP TR W25Q256FVBIP W25Q256FVCIP W25Q256FVFIP
Description IC FLASH 256M SPI 104MHZ 8WSON IC FLASH 256M SPI 24TFBGA IC FLASH 256M SPI 24TFBGA IC FLASH 256M SPI 104MHZ 8WSON IC FLASH 256M SPI 104MHZ 16SOIC 256MX1 FLASH 3V PROM, PBGA24, 8 X 6 MM, GREEN, TFBGA-24 256MX1 FLASH 3V PROM, PBGA24, 8 X 6 MM, GREEN, TFBGA-24 IC FLASH 256M SPI 104MHZ 16SOIC
technology FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR FLASH - NOR CMOS CMOS FLASH - NOR
memory type non-volatile non-volatile non-volatile non-volatile non-volatile - - non-volatile
memory format flash memory flash memory flash memory flash memory flash memory - - flash memory
storage 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) 256Mb (32M x 8) - - 256Mb (32M x 8)
Clock frequency 104MHz 104MHz 104MHz 104MHz 104MHz - - 104MHz
Write cycle time - words, pages 3ms 3ms 3ms 3ms 3ms - - 3ms
memory interface SPI SPI SPI SPI SPI - - SPI
Voltage - Power 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V 2.7 V ~ 3.6 V - - 2.7 V ~ 3.6 V
Operating temperature -40°C ~ 85°C(TA) -40°C ~ 85°C(TA) -40°C ~ 85°C(TA) -40°C ~ 85°C(TA) -40°C ~ 85°C(TA) - - -40°C ~ 85°C(TA)
Installation type surface mount surface mount surface mount surface mount surface mount - - surface mount
Package/casing 8-WDFN Exposed Pad 24-TBGA 24-TBGA 8-WDFN Exposed Pad 16-SOIC (0.295", 7.50mm wide) - - 16-SOIC (0.295", 7.50mm wide)
Supplier device packaging 8-WSON(8x6) 24-TFBGA(6x8) 24-TFBGA(6x8) 8-WSON(8x6) 16-SOIC - - 16-SOIC
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