Accu-Guard
®
SMD Thin-Film Fuse
ACCU-GUARD
®
TECHNOLOGY
The Accu-Guard
®
series of fuses is based on thin-film tech-
niques. This technology provides a level of control on the com-
ponent electrical and physical characteristics that is generally
not possible with standard fuse technologies. This has allowed
AVX to offer a series of devices which are designed for mod-
ern surface mount circuit boards which require protection.
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
Cellular Telephones
Two-Way Radios
Computers
Battery Chargers
Rechargeable Battery Packs
Hard Disk Drives
PDA’s
LCD Screens
SCSI Interface
Digital Cameras
Video Cameras
FEATURES
• Accurate current rating
• Fast acting
• Small-standard 0402, 0603, 0805, 1206 and 0612
chip sizes
• Taped and reeled
• Completely compatible with all soldering systems
used for SMT
• Lead Free Series (F0402G, F0603G, F0402E, F0603E,
F0805B, F1206B)
For RoHS compliant products,
please select correct termination style.
APPROVAL FILE NUMBERS
• UL, cUL:
RCD#E143842
millimeters (inches)
F0603C, F0805B, F1206A and F1206B
B
1
DIMENSIONS
F0402E and F0603E
B
F0402G and F0603G
S
A
D
B
H
W
T
T
B
2
L
W
L
T
L
W
F0402G
1.00±0.05
L
(0.039±0.002)
0.58±0.04
W
(0.023±0.002)
0.35±0.05
T
(0.014±0.002)
0.48±0.05
B
(0.019±0.002)
0.20±0.05
A
(0.008±0.002)
0.54±0.10
D
(0.021±0.004)
0.05±0.05
S, H
(0.002±0.002)
F0603G
1.60±0.10
(0.063±0.004)
0.81±0.10
(0.032±0.004)
0.61±0.10
(0.024±0.004)
0.66±0.05
(0.026±0.002)
0.28±0.05
(0.011±0.002)
0.91±0.10
(0.036±0.004)
0.10±0.05
(0.004±0.002)
F0402E
1.00±0.10
(0.039±0.004)
0.55±0.07
(0.022±0.003)
0.40±0.10
(0.016±0.004)
0.20±0.10
(0.008±0.004)
F0603E
1.60±0.10
(0.063±0.004)
0.81±0.10
(0.032±0.004)
0.63±0.10
(0.025±0.004)
0.35±0.15
(0.014±0.006)
F0603C
1.65±0.25
(0.065±0.010)
0.80±0.15
(0.031±0.006)
0.70±0.15
(0.028±0.006)
0.35±0.15
(0.014±0.006)
F0805B
2.10±0.20
(0.083±0.008)
1.27±0.10
(0.050±0.004)
0.90±0.2
(0.035±0.008)
0.30±0.15
(0.012±0.006)
F1206A/B
3.10±0.20
(0.122±0.008)
1.60±0.10
(0.063±0.004)
1.20±0.20
(0.047±0.008)
0.43±0.25
(0.017±0.010)
F0612D
1.65±0.25
(0.065±0.010)
3.10±0.20
(0.122±0.008)
0.90±0.20
(0.036±0.008)
0.35±0.15
(0.014±0.006)
HOW TO ORDER
F
Product
Fuse
1206
Size
See table for
standard sizes
A
Fuse Version
A=Accu-Guard®
B=Accu-Guard® II
C=Accu-Guard® II 0603
D=Accu-Guard® II 0612
E=Accu-Guard® II 0402, 0603
G=Accu-Guard® II Low Current
0402, 0603
0R20
Rated Current
Current expressed in
Amps. Letter R denotes
decimal point. e.g.
0.20A=0R20
1.75A=1R75
F
Fuse
Speed
F=Fast
W
Termination
S=Nickel/Lead-Free
Solder coated
(Sn 100)
W=Nickel/solder coated
(Sn 63, Pb 37)
N=Nickel/Lead-Free
Solder Coated (Sn100)
TR
Packaging
TR=Tape and reel
2
Accu-Guard
®
II Low Current
Miniature 0402 and 0603 Size Thin-Film Fuses
The new F0402G and F0603G Accu-Guard
®
series of fuses
is based on thin-film technology which allows precise control
of the component electrical and physical characteristics that
is not possible with standard fuse technologies. The Accu-
Guard Low Current series encompasses the lowest current
ratings in compact 0402 and 0603 packages and features
LGA terminations.
RECOMMENDED PAD LAYOUT
millimeters (inches)
F0402G
0.55
(0.022)
0.31 (0.012)
ELECTRICAL SPECIFICATIONS
Operating temperature: -55ºC to +125ºC
Current carrying capacity:
-55ºC to -11ºC 107% of rating
-10ºC to +60ºC 100% of rating
+61ºC to +100°C 85% of rating
+101ºC to +125°C 80% of rating
Rated voltage:
63V
(F0603G), 32V (F0402G)
Post-fusing resistance: >1MΩ
Interrupt rating: 50A
1.15 (0.045)
F0603G
1.1
(0.043)
0.85 (0.033)
2.4 (0.095)
Part Number
F0402G0R05FNTR
F0402G0R06FNTR
F0402G0R07FNTR
F0402G0R10FNTR
F0402G0R12FNTR
F0402G0R15FNTR
F0402G0R20FNTR
F0603G0R05FNTR
F0603G0R06FNTR
F0603G0R07FNTR
F0603G0R10FNTR
F0603G0R12FNTR
F0603G0R15FNTR
F0603G0R20FNTR
0.050
0.062
0.075
0.100
0.125
0.150
0.200
Resistance
10%xI
RATED
, 25°C
Ω (max.)
Pre-Arc I
2
t
Fusing Current
Voltage Drop
10%xI
RATED
, 25°C (within 5sec), 25°C
@10xI
RATED
,
A
2
-sec(typ)
mV (max.)
A
Color
Code
3.4
2.5
2.0
2.4
1.6
1.2
0.8
250
280
280
300
250
220
210
0.125
0.155
0.1875
0.250
0.312
0.375
0.500
2 x 10
-6
2 x 10
-6
4 x 10
-6
7 x 10
-6
1 x 10
-5
2 x 10
-5
4 x 10
-5
Blue
Yellow
Brown
Red
White
Green
Pink
ENVIRONMENTAL CHARACTERISTICS
Test
Solderability
Leach Resistance
Storage
Shear
Conditions
Components completely immersed in a
solder bath at 245 ±5°C for 3 secs.
Components completely immersed in a solder
bath at 255 ±5°C for 60 secs.
12 months minimum with components
stored in “as received” packaging.
Components mounted to a substrate.
Increasing shearing force applied paralled to
the sufstrate till destruction.
Components mounted to a flexible substrate
(e.g. FR – 4). 1000 cycles -55ºC to +125ºC.
Tested as shown in diagram
Requirement
Total area of imperfections in solder coating
up to 5% of the land suface area
Dissolution of termination
≤ 15% of the land surface area
Good solderability
Destruction at 5N force minimum
Temperature
Cycling
Bend
No Visible damage
ΔR/R<10%
No visible damage
ΔR/R<10%
3 mm
Deflection
45mm
45mm
3
Analog electronics
京公网安备 11010802033920号
EEWORLD
