*Customer:
Pb Free
SPECIFICATION
ITEM
MODEL
Revision Date
CHIP LED DEVICE
SSC-HB601
[Contents]
1. Features
2. Absolute maximum ratings
3. Electro-optical characteristics
4. Characteristic diagram
5. Soldering profile
6. Outline dimension
7. Packing
8. Reel packing structure
9.
Label Structure
10. Precaution for use
11. Ranks
Customer
Approved by
Approved by
Approved by
Supplier
Drawn by
Checked by
Approved by
SSC-QP-0401-06(REV.1)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-HB601
Seoul Semiconductor
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1/9
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1. Features
Package : 2.1×1.0×0.6 mm
Untinted, Diffused flat mold
Wavelength : 470 nm
2. Absolute Maximum Ratings
Parameter
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Symbol
P
d
I
F
I
FM*1
V
R
T
opr
T
stg
Value
72
20
60
5
-30 ~ +85
-40 ~ +100
(Ta=25℃)
Unit
mW
mA
mA
V
℃
℃
*1 I
FM
conditions : Pulse width Tw
≤
0.1msec. Duty ratio
≤
1/10
I
FM
applies for the condition : Tw
≤
0.1msec and Duty cycle
≤
1/10
3. Electro-Optical Characteristics
Parameter
Forward Voltage
Reverse Current
Luminous Intensity
*2
Wavelength
Spectral Bandwidth
Viewing angle
*3
Symbol
V
F
I
R
I
V
λ
Δλ
2θ
1/2
(Ta=25℃)
Condition
I
F
=5mA
V
R
=5V
I
F
=5mA
I
F
=5mA
I
F
=5mA
I
F
=5mA
Min
2.7
-
14
465
-
-
Typ
2.9
-
24
470
30
150
Max
3.1
10
40
475
-
-
Unit
V
㎂
mcd
nm
nm
˚
*2 The luminous intensity I
V
is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
*3
θ
1/2
is the off-axis where the luminous intensity is 1/2 the peak intensity.
Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 5mA, 20mA
within the maximum ratings shown above. All measurements were made under the standardized environment of SSC.
(Tolerance: V
F
±0.1V,
I
V
±10%, λ
d
±2nm)
SSC-QP-0401-06(REV.1)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-HB601
-
2/9
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4. Characteristic Diagram
Forward Current vs Forward Voltage
100
Relative Intensity vs Forward Current
400
350
Forward Current I
F
(mA)
10
Relative Intensity I
V
[%]
300
250
200
150
100
50
1
2.8
2.9
3.0
3.1
3.2
3.3
0
5
10
15
20
25
30
Forward Voltage V
F
(V)
Forward Current I
F
[mA]
Forward Current Derating Curve
25
Radiation Diagram
20
90
120
60
Forward current I
F
(mA)
15
150
10
30
5
80
0
-25
0
25
50
75
100
0
Ambient temperature Ta(
℃
)
SSC-QP-0401-06(REV.1)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-HB601
-
3/9
-
5. Soldering Profile
Reflow Soldering Conditions/ Profile
(1) Lead Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 240℃max. for 5 seconds max.
LED Surface temperature
LED Surface temperature
°C
Operation heating
240
150
~
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
120
0
60 to 120 sec.
5sec. max
(2) Lead-Free Solder
-Preliminary heating to be at 150℃max. for 2 minutes max.
-Soldering heat to be at 260℃max. for 10 seconds max.
°C
Operation heating
260
150
~
120
0
Pre-heating
Temperature
rise: 5°C/sec.
Cooling:
-5°C/sec.
60 to 120 sec.
10 sec.
(3) Hand Soldering conditions
-Not more than 3 seconds @MAX280℃, under Soldering iron.
[Note] In case the soldered products are reused in soldering process, we don’t guarantee the products.
SSC-QP-0401-06(REV.1)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
SSC-HB601
-
4/9
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6. Outline Dimension
Tolerance:
±0.1,
(1)
1.0
0.6
0.5
0.3
Polarity Mark
Unit:
㎜
Cathode
(1)
(4)
2.1
1.7
0.3
Anode
7. Packing
+0.1
-0
1.5
2.0
±0.05
1.75
±0.1
4.0
±0.1
0.2
±0.05
±0.1
±0.05
2.4
3.5
(2.75)
0.5
±0.05
1.15
±0.05
8.0
±0.2
0.8
±0.1
180
+0
-3
11.4
9
±0.3
2
±0.2
+0.2
-0
22
13
±0.2
Label
60
Tolerance:
±0.2,
Unit:
㎜
(1) Quantity: 3,000pcs./Reel
(2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be
±0.2mm
(3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off
from the carrier tape at 10˚ angle to be the carrier tape.
(4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package.
SSC-HB601
SSC-QP-0401-06(REV.1)
SEOUL SEMICONDUCTOR CO,. LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea
TEL: 82-2-3281-6269 FAX: 82-2-858-5537
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5/9
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