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CY7C1327B-100AC

Description
256KX18 CACHE SRAM, 5.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Categorystorage    storage   
File Size1MB,18 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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CY7C1327B-100AC Overview

256KX18 CACHE SRAM, 5.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

CY7C1327B-100AC Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeQFP
package instructionLQFP,
Contacts100
Reach Compliance Codeunknow
Maximum access time5.5 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density4718592 bi
Memory IC TypeCACHE SRAM
memory width18
Number of functions1
Number of terminals100
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize256KX18
Package body materialPLASTIC/EPOXY
encapsulated codeLQFP
Package shapeRECTANGULAR
Package formFLATPACK, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusCOMMERCIAL
Maximum seat height1.6 mm
Maximum supply voltage (Vsup)3.63 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm
Base Number Matches1
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CY7C1327B-100AC Related Products

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Description 256KX18 CACHE SRAM, 5.5ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 256KX18 CACHE SRAM, 5.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, FBGA-119 256KX18 CACHE SRAM, 4ns, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 256KX18 CACHE SRAM, 5.5ns, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, FBGA-119
Parts packaging code QFP BGA QFP BGA
package instruction LQFP, 14 X 22 MM, 2.40 MM HEIGHT, FBGA-119 LQFP, 14 X 22 MM, 2.40 MM HEIGHT, FBGA-119
Contacts 100 119 100 119
Reach Compliance Code unknow unknow unknow unknown
Maximum access time 5.5 ns 5.5 ns 4 ns 5.5 ns
Other features PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 code R-PQFP-G100 R-PBGA-B119 R-PQFP-G100 R-PBGA-B119
length 20 mm 22 mm 20 mm 22 mm
memory density 4718592 bi 4718592 bi 4718592 bi 4718592 bit
Memory IC Type CACHE SRAM CACHE SRAM CACHE SRAM CACHE SRAM
memory width 18 18 18 18
Number of functions 1 1 1 1
Number of terminals 100 119 100 119
word count 262144 words 262144 words 262144 words 262144 words
character code 256000 256000 256000 256000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
organize 256KX18 256KX18 256KX18 256KX18
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LQFP BGA LQFP BGA
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK, LOW PROFILE GRID ARRAY FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Certification status COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Maximum seat height 1.6 mm 2.4 mm 1.6 mm 2.4 mm
Maximum supply voltage (Vsup) 3.63 V 3.63 V 3.63 V 3.63 V
Minimum supply voltage (Vsup) 3.135 V 3.135 V 3.135 V 3.135 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD NOT SPECIFIED
Terminal form GULL WING BALL GULL WING BALL
Terminal pitch 0.65 mm 1.27 mm 0.65 mm 1.27 mm
Terminal location QUAD BOTTOM QUAD BOTTOM
width 14 mm 14 mm 14 mm 14 mm
Base Number Matches 1 1 1 1
Is it lead-free? Contains lead Contains lead Contains lead -
Is it Rohs certified? incompatible incompatible incompatible -
JESD-609 code e0 e0 e0 -
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED -
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