Product Data Sheet
TTC–LF
May 2007
TIP TINNER/CLEANER
PRODUCT DESCRIPTION
Multicore TTC-LF is a speedy and effective product for
cleaning and re-tinning de-wetted soldering irons that
cannot be re-tinned by sponges, pads or rosin-cored
solder wire. Multicore TTC-LF is a small block of
electronics grade lead free solder powder and flux
compacted into the shape of a thick disc, applicable for
both lead and lead free applications. It is packaged in a
metal container complete with lid and self-adhesive pad
on the underside so that it can be readily affixed to any
convenient surface.
FEATURES AND BENEFITS
Lead Free
Rapidly re-tins badly oxidised soldering irons
Activators thermally decompose
Minimal residues
Applicable for both lead free and Sn-Pb processes
Alloy meets international purity standards
APPLICATION NOTES
Multicore TTC-LF should be used when soldering iron bits
become oxidised and cannot be re-tinned using cored solder
wire or solder and flux employed in the normal assembly
process.
The soldering iron should be at normal working temperature
and loose debris should be wiped from its surface. It should
then be wiped gently across the surface of the TTC-LF to
produce local melting. There is no need to use a scrubbing
action or undue pressure. If the iron is too cool (<220°C),
residue inactivation cannot be assured. If it is too high
(>450°C) re-tinning may be impaired. After re-tinning, the
soldering iron bit should be wiped as normal on a damp
sponge. It will then be ready for re-use.
Multicore TTC-LF should not be used as a fluxing system for
the regular assembly process.
TYIPICAL PROPERTIES
Multicore TTC-LF is a mixture including electronic grade
solder powder and a unique fluxing system. The flux shows
very high activity to clean heavily oxidised metal surfaces
such as copper and iron plated soldering iron bits. It is
formulated to decompose completely into inert components
when exposed briefly to soldering temperatures.
Consequently, the residues left after a normal bit re-tinning
cycle are compatible with modern No Clean soldering
processes.
The assembly was placed in a fume cupboard and shielded
from draught. A small Bunsen flame was placed beneath the
assembly for the minimum time to completely melt the solder
alloy in the Multicore TTC-LF. Immediately the test pieces
had cooled they were separated and placed in a humidity
cabinet 95% RH at 22°C for 24 hours. After this time, both
panels were examined by X100 microscope for signs of
corrosion. There was no evidence of corrosion on the lower
or upper coupons.
British Standard 5625 for soft soldering fluxes
5.2 Corrosion Test on flux residues
CORROSION TESTS
Multicore TTC-LF passes the corrosion tests to DTD 599A,
BS 5625 copper mirror corrosion tests. The tests were
carried out in the following manner:
UK Ministry of Defence DTD 599A
Non-corrosive flux for soft soldering specification
Appendix II corrosion test
Two pieces of copper foil, one 2” x 2” the other 2” x 2½”
were polished with fine abrasive carborundum paper and
degreased. The 2” x 2” copper square was dished and the
other given a ¼” bend each side to make a 2” square “U-
shaped coupon, 0.06g of Multicore TTC-LF was placed in
the dished coupon and the “U”-shaped coupon was placed
over the top and clamped together.
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREIN IS INTENDED FOR REFERENCE ONLY. PLEASE CONTACT HENKEL
TECHNOLOGIES TECHNICAL SERVICE FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS
PRODUCT.
TTC-LF, May 2007
The corrosion test on Multicore TTC-LF was carried out
according to the specified method. 0.08g of Multicore TTC-
LF was taken for each copper test panel. The test panels were
heated at 235°C for the minimum time to completely melt the
solder alloy and then given a dwell time of 5 seconds. After
cooling the panels were conditioned at 40°C, 91-95% RH for
3 days. The panels were inspected under x10 microscope for
signs of corrosion. There was no evidence of corrosion.
PACKAGING
Multicore TTC-LF blocks have a net weight of 15g (0.5oz)
and are supplied in cartons of 10.
GENERAL INFORMATION
For safe handling information on this product, consult
the Material Safety Data Sheet, (MSDS).
Note
The data contained herein are furnished for information only and are
believed to be reliable. We cannot assume responsibility for the results
obtained by others over whose methods we have no control. It is the user's
responsibility to determine suitability for the user's purpose of any
production methods mentioned herein and to adopt such precautions as may
be advisable for the protection of property and of persons against any
hazards that may be involved in the handling and use thereof. In light of the
foregoing,
Henkel Corporation specifically disclaims all warranties
expressed or implied, including warranties of merchantability or fitness
for a particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically disclaims any
liability for consequential or incidental damages of any kind, including
lost profits.
The discussion herein of various processes or compositions is
not to be interpreted as representation that they are free from domination of
patents owned by others or as a license under any Henkel Corporation
patents that may cover such processes or compositions. We recommend that
each prospective user test his proposed application before repetitive use,
using this data as a guide. This product may be covered by one or more
United States or foreign patents or patent applications.
Americas
Henkel Corporation
15350 Barranca Parkway
Irvine, CA 92618 U.S.A.
949.789.2500
Europe
Henkel Loctite Adhesives Ltd
Technologies House, Wood Lane End
Hemel Hempstead
Hertfordshire HP2 4RQ, United Kingdom
+44 (0) 1442 278 000
Asia
Henkel Loctite (China) Co. Ltd
No. 90 Zhujiang Road
Yantai Development Zone
Shandong, China 264006
+86 535 6399820
All trademarks, except where noted are the property of Henkel Corp.
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