SPBT3.0DP1
Bluetooth® Classic module
Datasheet - production data
Features
Bluetooth radio
Fully embedded Bluetooth
®
v3.0 with
SPP and HID profiles
Class 1 module
Enhanced Data Rate (EDR) support
Complete RF-ready module
Embedded support for MFi iAP2 profile
128-bit encryption security
Integrated antenna
ST Cortex-M4 microprocessor
Up to 100 MHz
512 KB Flash
128 KB RAM
Supports transmission speed with SPP up to
1500 Kbit/s
14 general-purpose I/Os
User interface
AT command Data Package (DP)
Firmware upgrade over UART
EU, FCC, IC and Bluetooth qualified
Single voltage supply: 3.3 V typical
Small form factor: 15.24 x 26.9 x 2.9 mm
Operating temperature range: -40 °C to
85 °C
September 2017
DocID029412 Rev 2
1/35
www.st.com
This is information on a product in full production.
Contents
SPBT3.0DP1
Contents
1
2
3
4
Description....................................................................................... 6
RoHS compliance ............................................................................ 7
Applications ..................................................................................... 8
Software architecture ...................................................................... 9
4.1
4.2
4.3
BT stack layers.................................................................................. 9
Supported profile ............................................................................. 10
AT command set: Data Package..................................................... 10
5
6
Module block diagram ................................................................... 11
Hardware specifications ............................................................... 12
6.1
6.2
6.3
6.4
6.5
6.6
Recommended operating conditions ............................................... 12
Radio features ................................................................................. 12
Absolute maximum ratings .............................................................. 12
Current consumption ....................................................................... 12
I/O operating characteristics............................................................ 13
Pin assignment................................................................................ 14
RF module package information ..................................................... 17
Reflow soldering.............................................................................. 19
UART interface................................................................................ 20
GPIO interface ................................................................................ 21
Reset circuit .................................................................................... 22
8.4.1
8.4.2
Simple external reset circuit ............................................................. 22
Host controlled reset circuit .............................................................. 22
7
8
Package information ..................................................................... 16
7.1
8.1
8.2
8.3
8.4
Hardware design ........................................................................... 19
8.5
8.6
MFi co-processor interface .............................................................. 23
PCB layout guidelines ..................................................................... 24
Enter bootloader mode .................................................................... 26
Transfer the new firmware .............................................................. 26
Exit bootloader mode ...................................................................... 26
FCC certification.............................................................................. 27
DocID029412 Rev 2
9
Firmware upgrade ......................................................................... 26
9.1
9.2
9.3
10
Regulatory compliance ................................................................. 27
10.1
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SPBT3.0DP1
10.1.1
10.1.2
Contents
FCC labeling instructions.................................................................. 27
Product manual instructions for FCC compliance ............................ 28
10.2
IC certification ................................................................................. 28
10.2.1
10.2.2
IC labeling instructions ..................................................................... 29
Product manual instructions for IC compliance ................................ 29
10.3
10.4
Bluetooth certification ...................................................................... 30
CE certification ................................................................................ 30
11
12
13
Traceability .................................................................................... 32
Ordering information..................................................................... 33
Revision history ............................................................................ 34
DocID029412 Rev 2
3/35
List of tables
SPBT3.0DP1
List of tables
Table 1: Recommended operating conditions .......................................................................................... 12
Table 2: Radio features............................................................................................................................. 12
Table 3: Absolute maximum ratings ......................................................................................................... 12
Table 4: Power consumption .................................................................................................................... 13
Table 5: I/O operating characteristics ....................................................................................................... 13
Table 6: Pin assignment ........................................................................................................................... 14
Table 7: Soldering ..................................................................................................................................... 19
Table 8: Traceability information ............................................................................................................... 32
Table 9: Ordering information ................................................................................................................... 33
Table 10: Document revision history ........................................................................................................ 34
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DocID029412 Rev 2
SPBT3.0DP1
List of figures
List of figures
Figure 1: Software architecture overview ................................................................................................... 9
Figure 2: SPBT3.0DP1 block diagram ...................................................................................................... 11
Figure 3: Pin assignment .......................................................................................................................... 14
Figure 4: RF module package outline (dimensions in mm) ...................................................................... 17
Figure 5: Recommended land (top view) pattern (dimensions in mm) ..................................................... 18
Figure 6: Soldering profile ......................................................................................................................... 20
Figure 7: Connection to host device ......................................................................................................... 20
Figure 8: Typical RS232 circuit ................................................................................................................. 21
Figure 9: Simple external reset circuit ...................................................................................................... 22
Figure 10: Host controlled reset circuit ..................................................................................................... 22
Figure 11: SPBT3.0DP2 to MFi coprocessor interconnections ................................................................ 24
Figure 12: Power supply capacitors .......................................................................................................... 25
Figure 13: CE marking .............................................................................................................................. 31
DocID029412 Rev 2
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