Express-BASE7 datasheet, PDF - EEWORLD Datasheet

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Express-BASE7: Description模块配件 COM Express type 7 Prototype/Evaluation Board with full size ATX form factor (for Basic and Compact size modules); CategoryEmbedded solution Module accessories; File Size272KB，5 Pages; ManufacturerADLINK; Websitehttps://www.adlinktech.com/en/AboutUs.aspx; Environmental Compliance

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Express-BASE7 Overview

模块配件 COM Express type 7 Prototype/Evaluation Board with full size ATX form factor (for Basic and Compact size modules)

Express-BASE7 Parametric

Parameter Name	Attribute value
Maker	ADLINK
Product Category	Module accessories
Shipping restrictions	Mouser does not currently sell this product.
product	Carrier Boards
used for	Type 7 Module in Basic, Compact Form Factor
size	305 mm x 244 mm
series	Express-BD7
Factory packaging quantity	1

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Express-CF/CFE

COM Express

Basic Size Type 6 Module with Hexacore Mobile 8

Gen

Intel

Xeon

and Core™ Processors

Features

●

PICMG COM.0 R3.0 Type 6 module with hexacore and quad-core

Intel

processors

Up to 48GB Dual Channel DDR4 at 2133/2400MHz

Three DDI channels, one LVDS (or 4 lanes eDP), supports up to

3 independent displays

One PCIe x16 Gen3, eight PCIe x1 Gen3 (NVMe SSD &

Intel

Optane™ Memory Technology support)

GbE, four SATA 6 Gb/s, four USB 3.1 and four USB 2.0

Supports Smart Embedded Management Agent (SEMA) functions

●

Specifications

●

Core System

CPU

Mobile 8th Generation Intel Xeon and Core™ Processors - 14nm process

• Xeon

E-2176M, 2.7 (4.4)GHz, 12MB. 45W (35W cTDP), 6C/GT2

• Core™ i7-8850H, 2.6 (4.3)GHz, 9MB, 45W (35W cTDP), 6C/GT2

• Core™ i5-8400H, 2.5 (4.2)GHz, 8MB, 45W (35W cTDP), 4C/GT2

• Core™ i3-8100H, 3.0GHz, 6MB, 45W (35W cTDP), 4C/GT2

Supports: Intel

VT, Intel

TXT, Intel

SSE4.2, Intel

HT Technology, Intel

Architecture, Execute Disable Bit, Intel

Turbo Boost Technology 2.0, Intel

AVX2, Intel

AES-NI, PCLMULQDQ Instruction, Intel

Secure Key and Intel

TSX.

●

Video

GPU Feature Support

Intel

Generation 9 LP Graphics Core Architecture, supporting 3 independent

and simultaneous display combinations of DisplayPort/HDMI (or VGA), LVDS

or eDP outputs

• Hardware encode/transcode HD content (including HEVC 10-bit)

• DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1,

DirectX 10,DirectX 9 support

• OpenGL 4.5 support

• OpenCL 2.1, 2.0/1.2 support

Note: Availability of the features may vary between processor SKUs.

Memory

2133/2400 MHz DDR4 memory up to 48GB in three SODIMM sockets

(Xeon

paired with CM246 supports both ECC and non-ECC memory)

(48GB is build support)

Digital Display Interface

DDI1/2/3 supporting DisplayPort 1.2, HDMI 1.4, DVI

Notes:

DP1.2: max. resolution is 4096x2304 @ 60Hz, 24bpp

HDMI1.4: max. resolution is 4096x2160 @ 24Hz, 24bpp

Embedded BIOS

AMI EFI with CMOS backup in 32MB SPI BIOS with Intel

AMT 12.0 support

VGA

VGA support, in place of DDI3 channel (build option, max. resolution

1920x1200@60Hz)

Cache

12MB for Xeon

, 9MB for Core™ i7, 8MB for Core™ i5

6MB for Core™ i3

LVDS

Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC (max. resolution

1920x1200@60Hz in dual mode)

Chipset

• CM246 (supports ECC memory and Intel

AMT)

• QM370 (supports Intel

AMT )

• HM370 (no support for Intel

AMT )

eDP

4 lane support optional, in place of LVDS (build option, max. resolution

4096x2304 @60Hz, 24bpp)

Expansion Busses

• PCIe x16, 2 PCIe x8, or 1 PCIe x8 with 2 PCIe x4 (Gen3)

• 6 PCI Express x1 (Gen3); AB connector, Lanes 0/1/2/3/4/5

• 2 PCI Express x1 (Gen3); CD connector, Lane 6/7

• LPC bus, SMBus (system), I

C (user)

●

Audio

Chipset: Intel

HD Audio integrated in chipset

Audio Codec:located on carrier Express-BASE6 (ALC886 standard supported)

●

Ethernet

Intel

I219LM/V with AMT 12.0 support (only LM version support AMT)

Interface: 10/100/1000 GbE connection

SEMA Board Controller

Supports: voltage/current monitoring, power sequence debug support,

AT/ATX mode control, logistics and forensic information, flat panel control,

general purpose I

C, failsafe BIOS (dual BIOS ), watchdog timer and fan

control

Debug Headers

• 40-pin multipurpose flat cable connector for use with DB-40 debug module

providing BIOS POST code LED, BMC access, SPI BIOS flashing, power

testpoints, debug LEDs

• 60-pin XDP header for ICE debug of CPU/chipset

Note:

“build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.

Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.

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