EV_ICM-20649 datasheet, PDF - EEWORLD Datasheet

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EV_ICM-20649: DescriptionMultifunctional sensor development tool ICM-20649; CategoryEmbedded solution Engineering tools Sensor development tools Multifunctional sensor development tools; File Size1MB，19 Pages; ManufacturerTDK Corporation; Websitehttp://www.tdk.com; Environmental Compliance

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EV_ICM-20649 Overview

Multifunctional sensor development tool ICM-20649

EV_ICM-20649 Parametric

Parameter Name	Attribute value
Maker	TDK Corporation
Product Category	Multifunctional sensor development tools
product	Evaluation Boards
type	Motion Sensors
Tools for assessment	ICM-20649
Working power voltage	3 V
size	38.1 mm x 38.1 mm x 1.6 mm
Interface Type	I2C, SPI
Factory packaging quantity	1

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Application Note

InvenSense Motion Sensor Universal

Evaluation Board (UEVB) User Guide

PURPOSE

This document describes the hardware and circuitry on the Universal Evaluation Board (UEVB). The UEVB is used to

evaluate most of InvenSense’s current motion sensing (gyroscopes, accelerometers, magnetometers) products. It

covers applying the UEVB to a larger system, and requires the understanding of key signals and circuit functions,

hardware jumper settings, and port connections.

USAGE

This UEVB provides up to nine axes of motion sensing comprised of:



Digital-output of 3-axis gyroscope with user-programmable full-scale ranges

Digital-output of 3-axis accelerometer with user-programmable full-scale ranges

Digital-output of 3-axis magnetometer

On-chip temperature sensor

Data is measured using on-chip ADCs and is transmitted over I²C or SPI interfaces

The UEVB may be used by itself utilizing SPI or I ²C serial communications interfaces. Alternatively, it may be

connected to the InvenSense ARM Controller Board for connectivity to a host computer via USB interface.

The UEVB was designed to support up to 9-axis MPUs (Motion Processing Units) with a built-in compass (MPU-

91xx and MPU-92xx). Connecting an external compass board to the UEVB may require the user to connect their

third-party compass to the UEVB via its auxiliary I

C bus. The UEVB is populated with an external compass, and can

access the main or auxiliary I

C bus lines provided by the sensor (AUX_DA and AUX_CL) via resistor options.

The UEVB is lead-free and RoHS compliant.

RELATED DOCUMENTS

Please refer to the product specification of the main motion sensor for electrical characteristics, pinout and

applications details. Sensor product specifications can be found at

www.invensense.com.

For product specifications

for unreleased parts, please contact the InvenSense s ales department at

sales@invensense.com.

InvenSense reserves the right to change the

detail specifications as may be required to

permit improvements in the design of its

products.

InvenSense Inc.

1745 Technology Drive, San Jose, CA 95110 U.S.A

+1(408) 988–7339

www.invensense.com

Document Number:

AN-IVS-0001EVB-00

Rev Number: 1.2

Rev Date: 11/07/2014

UEVB

TABLE OF CONTENTS

PURPOSE............................................................................................................................................................................................ 1

USAGE ............................................................................................................................................................................................ 1

RELATED DOCUMENTS ............................................................................................................................................................... 1

UEVB O VERVIEW .............................................................................................................................................................................. 3

TABLE 1A. PARTS FOR UEVB FOOTPRINTS ............................................................................................................................... 3

TABLE 1B. RESISTOR OPTIONS ................................................................................................................................................... 4

KEY FUNCTIONS AND PINOUTS.................................................................................................................................................. 6

C/SPI BUS CO NNECTIONS......................................................................................................................................................... 6

SCHEMATIC ....................................................................................................................................................................................... 7

BILL OF MATERIAL (BO M) ............................................................................................................................................................... 8

TABLE 2A. BILL OF MATERIAL FOR U1A .................................................................................................................................... 8

TABLE 2B. BILL OF MATERIAL FOR U1B..................................................................................................................................... 8

TABLE 2C. BILL OF MATERIAL FOR U1C..................................................................................................................................... 9

TABLE 2D. BILL OF MATERIAL FOR U1D, OPTION-A................................................................................................................ 9

TABLE 2E. BILL OF MATERIAL FOR U1D, OPTION-B ..............................................................................................................10

POWER SUPPLY CONNECTIONS ...................................................................................................................................................11

TABLE 3. POWER SELECTION JUMPERS (JP1, JP2).................................................................................................................11

UEVB CO NNECTOR SIGNALS DESCRIPTION................................................................................................................................12

TABLE 4. USER INTERFACE CONNECTOR SIGNALS (CN1) .....................................................................................................12

CONNECTING THE FSYNC LINE.................................................................................................................................................13

SERIAL BUS LEVELS, SPEEDS, AND TERMINATIONS ..............................................................................................................13

DATA GATHERING OPTIONS .........................................................................................................................................................14

CONNECTION TO THE INVENSENSE ARM CONTROLLER BOARD........................................................................................14

USE OF THE UEVB WITHOUT AN ARM CONTRO LLER BOARD .............................................................................................14

SPECIAL INSTRUCTIONS ................................................................................................................................................................15

ELECTROSTATIC DISCHARGE SENSITIVITY..............................................................................................................................15

BOARD LAYO UT AND FOOTPRINT DISCUSSION ....................................................................................................................15

REVISION HISTORY.....................................................................................................................................................................17

Document Numb er:

AN- IVS-0001EVB-00

Rev Number: 1.2

Rev Date: 11/07/2014

Page 2 of 18

EV_ICM-20649 Related Products

	EV_ICM-20649	EV_MPU-9250	EV_ITG-1010	CA-SDK BOARD	EV_ICM-20602	EV_MPU-6500
Description	Multifunctional sensor development tool ICM-20649	Multifunctional sensor development tool MPU-9250	Multifunctional sensor development tool ITG-1010	Multifunctional sensor development tools	Multifunctional sensor development tool ICM-20602	Multifunctional sensor development tool MPU-6500
Maker	TDK Corporation	TDK Corporation	TDK Corporation	TDK Corporation	TDK Corporation	TDK Corporation
Product Category	Multifunctional sensor development tools	Multifunctional sensor development tools	Multifunctional sensor development tools	Multifunctional sensor development tools	Multifunctional sensor development tools	Multifunctional sensor development tools
product	Evaluation Boards	Evaluation Boards	Evaluation Boards	Reference Design Boards	Evaluation Boards	Evaluation Boards
type	Motion Sensors	Motion Sensor	Motion Sensors	Motion Sensors	Motion Sensors	Motion Sensors
Tools for assessment	ICM-20649	MPU-9250	ITG-1010	-	ICM-20602	MPU-6500
Working power voltage	3 V	3 V	3 V	3.7 V	3 V	3 V
Factory packaging quantity	1	1	1	1	1	1
size	38.1 mm x 38.1 mm x 1.6 mm	3 mm x 3 mm x 1 mm	-	-	38.1 mm x 38.1 mm x 1.6 mm	3 mm x 3 mm x 0.9 mm

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