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S73WS256ND0BAWAB0

Description
Stacked Multi-Chip Product (MCP)
Categorystorage    storage   
File Size4MB,251 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Download Datasheet Parametric View All

S73WS256ND0BAWAB0 Overview

Stacked Multi-Chip Product (MCP)

S73WS256ND0BAWAB0 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerSPANSION
Parts packaging codeBGA
package instructionTFBGA,
Contacts137
Reach Compliance Codecompli
Other featuresMOBILE SDRAM IS ORGANIZED AS 2M X 16 X 4BANKS; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 codeR-PBGA-B137
JESD-609 codee0
length12 mm
memory density268435456 bi
Memory IC TypeMEMORY CIRCUIT
memory width16
Number of functions1
Number of terminals137
word count16777216 words
character code16000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize16MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)1.95 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width9 mm
S73WS256N Based MCPs
Stacked Multi-Chip Product (MCP)
512/256 Megabit (32M/16M x 16-bit) CMOS 1.8 Volt-only,
Simultaneous Read/Write, Burst Mode Flash Memory with
256/128 Megabit (4M/2M x 16-bit x 4 Banks) Mobile SDRAM
on Shared Data Bus
Data Sheet
ADVANCE
INFORMATION
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Publication Number
S73WS256N_00
Revision
A
Amendment
3
Issue Date
December 16, 2005

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