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S25FL512SAGBHBB13

Description
NOR flash memory
Categorysemiconductor    Memory IC    NOR flash memory   
File Size4MB,147 Pages
ManufacturerCypress Semiconductor
Environmental Compliance
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S25FL512SAGBHBB13 Overview

NOR flash memory

S25FL512SAGBHBB13 Parametric

Parameter NameAttribute value
MakerCypress Semiconductor
Product CategoryNOR flash memory
seriesS25FL512S
EncapsulationReel
Factory packaging quantity2500
S25FL512S
512 Mbit (64 Mbyte), 3.0 V SPI Flash Memory
Features
CMOS 3.0 Volt Core with versatile I/O
Serial Peripheral Interface (SPI) with Multi-I/O
Density
512 Mbits (64 Mbytes)
SPI
SPI Clock polarity and phase modes 0 and 3
Double Data Rate (DDR) option
Extended Addressing: 32-bit address
Serial Command set and footprint compatible with
S25FL-A,
S25FL-K, and S25FL-P SPI families
Multi I/O Command set and footprint compatible with
S25FL-P SPI family
READ Commands
Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR
AutoBoot - power up or reset and execute a Normal or Quad
read command automatically at a preselected address
Common Flash Interface (CFI) data for configuration infor-
mation.
Programming (1.5 MB/s)
512-byte Page Programming buffer
Quad-Input Page Programming (QPP) for slow clock sys-
tems
Automatic ECC -internal hardware Error Correction Code
generation with single bit error correction
Erase (0.5 to 0.65 MB/s)
Uniform 256-kbyte sectors
Cycling Endurance
100,000 Program-Erase Cycles, minimum
Data Retention
20 Year Data Retention, minimum
Security features
OTP array of 1024 bytes
Block Protection:
• Status Register bits to control protection against program
or erase of a contiguous range of sectors.
• Hardware and software control options
Advanced Sector Protection (ASP)
• Individual sector protection controlled by boot code or
password
Cypress
®
65 nm MirrorBit
®
Technology with Eclipse
Architecture
Core Supply Voltage: 2.7 V to 3.6 V
I/O Supply Voltage: 1.65 V to 3.6 V
SO16 and FBGA packages
Temperature Range:
Industrial (–40 °C to +85 °C)
Industrial Plus (–40 °C to +105 °C)
Automotive, AEC-Q100 Grade 3 (–40 °C to +85 °C)
Automotive, AEC-Q100 Grade 2 (–40 °C to +105 °C)
Automotive, AEC-Q100 Grade 1 (–40 °C to +125 °C)
Packages (all Pb-free)
16-lead SOIC (300 mil)
BGA-24 6 × 8 mm
• 5 × 5 ball (FAB024) and 4 × 6 ball (FAC024) footprint op-
tions
Known Good Die and Known Tested Die
Logic Block Diagram
CS#
SCK
SI/IO0
SO/IO1
I/O
WP#/IO2
HOLD#/IO3
RESET#
Data Path
Control
Logic
X Decoders
SRAM
MirrorBit Array
Y Decoders
Data Latch
Cypress Semiconductor Corporation
Document Number: 001-98284 Rev. *P
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised June 22, 2018

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