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MRC1/21008661GLF

Description
MELF resistor
CategoryPassive components    The resistor    MELF resistors   
File Size248KB,3 Pages
ManufacturerWelwyn Components (TT Electronics)
Download Datasheet Parametric View All

MRC1/21008661GLF Overview

MELF resistor

MRC1/21008661GLF Parametric

Parameter NameAttribute value
MakerWelwyn Components (TT Electronics)
Product CategoryMELF resistor
seriesMRC
EncapsulationReel
Installation stylePCB Mount
Factory packaging quantity2500
Resistors
Metal Glaze™ High Power Density
Surface Mount Power Resistor
MRC Series
Metal Glaze High
Power
Density
MRC Series
Surface
Mount
Power
Resistor
TM
1/2 watt in 1/8 watt package
MRC1/2: 0.05 Ω to 1.0 Ω (contact factory for higher values)
1/2
watt
in 1/8
watt
package
150°C maximum operating temperature
1
watt
in 1/2
watt
package (2010
footprint)
Superior surge handling capability
MRC1/2:
0.05
to 1.0
(contact
factory for
higher
values)
RoHS compliant Versions available
150°C maximum operating temperature
Superior surge handling capability
Metal Glaze
thick film
element fired at 1000°C to
solid ceramic substrate
High temperature
dielectric coating
All Pb-free parts comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
60/40 Solder
over
nickel barrier
Electrical Data
Size
Industry
Code
1
Footprint
IRC
Type
Max.
Power Rating
Working
Voltage
2
Max.
Resistance
TCR
Tolerance
Voltage Range (ohms)
3
(ppm/°C)
3
(±%)
3
0.1 to 0.99
C
1206
MRC1/2
1/2W @ 70°C
200
400
1.0 to 10K
20 to 10K
1,2,5
1,2,5
0.25, 0.5
100
50,100
50,100
Product
Catagory
Low
Range
Standard
Tight
Tolerance
MRC Applications:
The
MRC1/2
will dissipate
1/2 watt at
70°C on
a
1206
footprint.
The
MRC
is recommended
for
applications where
board
real estate
is
a
major concern. Due
to
high power density and superior
surge
handling capability, it is
also
recommended
as a
direct replacement on
existing
board designs where standard 1206 resistors are marginal or
failing.
Environmental
Data
Characteristics
Temperature Coefficient
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
As specifi
ed
±(0.5% + 0.01Ω)
±(0.25% + 0.01Ω)
±(1.0% + 0.01Ω)
±(0.5% + 0.01Ω)
±(0.25% + 0.01Ω)
95% minimum coverage
±(0.5% + 0.01Ω)
±(1.0% + 0.01Ω)
±(1% + 0.01Ω)
no mechanical damage
±(1% + 0.01Ω)
no mechanical damage
Test Method
MIL-R-55342E
Par
4.7.9 (-55°C + 125°C)
MIL-R-55342E
Par
4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E
Par
4.7.4 (-65°C @
working voltage)
MIL-R-55342E
Par
4.7.5
2.5 x
PxR
for
5 seconds
MIL-R-55342E
Par
4.7.6 (+150°C
for
100 hours)
MIL-R-55342E
Par
4.7.7
(Refl
ow
soldered to board at 260°C
for
10 seconds)
MIL-STD-202, Method 208 (245°C
for
5 seconds)
MIL-R-55342E
Par
4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E
Par
4.7.10 (2000 hours @ 70°C intermittent)
1200
gram
push from underside of mounted chip
for
60 seconds
Chip mounted in center of 90mm long board, deflected 5mm
so as to
exert
pull on chip contacts
for
10 seconds
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
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