GS82582TT38GE-400 datasheet, PDF

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GS82582TT38GE-400: DescriptionStatic random access memory 1.5/1.8V 8M x 36 288M; Categorysemiconductor Memory IC Static random access memory; File Size307KB，24 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/; Environmental Compliance

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GS82582TT38GE-400 Overview

Static random access memory 1.5/1.8V 8M x 36 288M

GS82582TT38GE-400 Parametric

Parameter Name	Attribute value
Maker	GSI Technology
Product Category	static random access memory
storage	288 Mbit
organize	8 M x 36
maximum clock frequency	400 MHz
Interface Type	Parallel
Supply voltage - max.	1.9 V
Supply voltage - min.	1.7 V
Supply current—max.	790 mA
Minimum operating temperature	0 C
Maximum operating temperature	+ 70 C
Installation style	SMD/SMT
Package/box	BGA-165
Encapsulation	Tray
storage type	DDR-II
series	GS82582TT38GE
type	SigmaDDR-II+
Factory packaging quantity	10

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GS82582TT20/38GE-550/500/450/400

165-Bump BGA

Commercial Temp

Industrial Temp

Features

• 2.5 Clock Latency

• Simultaneous Read and Write SigmaDDR

Interface

• JEDEC-standard pinout and package

• Double Data Rate interface

• Byte Write controls sampled at data-in time

• Burst of 2 Read and Write

• Dual-Range On-Die Termination (ODT) on Data (D), Byte

Write (BW), and Clock (K, K) inputs

• 1.8 V +100/–100 mV core power supply

• 1.5 V or 1.8 V HSTL Interface

• Pipelined read operation

• Fully coherent read and write pipelines

• ZQ pin for programmable output drive strength

• Data Valid Pin (QVLD) Support

• IEEE 1149.1 JTAG-compliant Boundary Scan

• RoHS-compliant 165-bump BGA package

288Mb SigmaDDR-II+

Burst of 2 SRAM

550 MHz–400 MHz

1.8 V V

1.8 V or 1.5 V I/O

are just one element in a family of low power, low voltage

HSTL I/O SRAMs designed to operate at the speeds needed to

implement economical high performance networking systems.

Clocking and Addressing Schemes

The GS82582TT20/38GE SigmaDDR-II+ SRAMs are

synchronous devices. They employ two input register clock

inputs, K and K. K and K are independent single-ended clock

inputs, not differential inputs to a single differential clock input

buffer.

Each internal read and write operation in a SigmaDDR-II+ B2

RAM is two times wider than the device I/O bus. An input data

bus de-multiplexer is used to accumulate incoming data before

it is simultaneously written to the memory array. An output

data multiplexer is used to capture the data produced from a

single memory array read and then route it to the appropriate

output drivers as needed. Therefore, the address field of a

SigmaDDR-II+ B2 RAM is always one address pin less than

the advertised index depth (e.g., the 16M x 18 has an 8M

addressable index).

SigmaDDR-II™ Family Overview

The GS82582TT20/38GE are built in compliance with the

SigmaDDR-II+ SRAM pinout standard for Common I/O

synchronous SRAMs. They are 301,989,888-bit (288Mb)

SRAMs. The GS82582TT20/38GE SigmaDDR-II+ SRAMs

Parameter Synopsis

-550

tKHKH

tKHQV

1.81 ns

0.45 ns

-500

2.0 ns

0.45 ns

-450

2.2 ns

0.45 ns

-400

2.5 ns

0.45 ns

Rev: 1.03b 11/2017

1/24

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS82582TT20/38GE-550/500/450/400

Background

Common I/O SRAMs, from a system architecture point of view, are attractive in read dominated or block transfer applications.

Therefore, the SigmaDDR-II+ SRAM interface and truth table are optimized for burst reads and writes. Common I/O SRAMs are

unpopular in applications where alternating reads and writes are needed because bus turnaround delays can cut high speed

Common I/O SRAM data bandwidth in half.

Burst Operations

Read and write operations are "Burst" operations. In every case where a read or write command is accepted by the SRAM, it will

respond by issuing or accepting two beats of data, executing a data transfer on subsequent rising edges of K and K, as illustrated in

the timing diagrams. This means that it is possible to load new addresses every K clock cycle. Addresses can be loaded less often,

if intervening deselect cycles are inserted.

Deselect Cycles

Chip Deselect commands are pipelined to the same degree as read commands. This means that if a deselect command is applied to

the SRAM on the next cycle after a read command captured by the SRAM, the device will complete the two beat read data transfer

and then execute the deselect command, returning the output drivers to High-Z. A high on the LD pin prevents the RAM from

loading read or write command inputs and puts the RAM into deselect mode as soon as it completes all outstanding burst transfer

operations.

SigmaDDR-II+ Burst of 2 SRAM Read Cycles

The SRAM executes pipelined reads. The status of the Address, LD and R/W pins are evaluated on the rising edge of K. The read

command (LD low and R/W high) is clocked into the SRAM by a rising edge of K.

SigmaDDR-II+ Burst of 2 SRAM Write Cycles

The status of the Address, LD and R/W pins are evaluated on the rising edge of K. The SRAM executes "late write" data transfers.

Data in is due at the device inputs on the rising edge of K following the rising edge of K clock used to clock in the write command

(LD and R/W low) and the write address. To complete the remaining beat of the burst of two write transfer, the SRAM captures

data in on the next rising edge of K, for a total of two transfers per address load.

Special Functions

Byte Write Control

Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with

a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be

stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven High or Low

during the data in sample times in a write sequence.

Each write enable command and write address loaded into the RAM provides the base address for a 2-beat data transfer. The x18

version of the RAM, for example, may write 36 bits in association with each address loaded. Any 9-bit byte may be masked in any

write sequence.

Resulting Write Operation

Byte 1

D0–D8

Written

Beat 1

Byte 2

D9–D17

Unchanged

Byte 3

D0–D8

Unchanged

Beat 2

Byte 4

D9–D17

Written

Rev: 1.03b 11/2017

5/24

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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