Preliminary
‡
Xccela™ Flash Memory Data Sheet Brief
Features
Xccela™ Flash Memory Data Sheet Brief
MT35X 1.8/3V, Octal I/O, 4KB/32KB/128KB Sector Erase
Features
• SPI-compatible Xccela™ bus interface
– Octal DDR protocol
– Extended-SPI protocol with octal commands
• Single and double transfer rate (SDR/DDR)
• Clock frequency:
– 166 MHz (MAX) in SDR (166 MB/s) (1.8V)
– 200 MHz (MAX) in DDR (400 MB/s) with DQS
(1.8V)
– 133 MHz (MAX) in SDR (133 MB/s) (3.0V)
– 133 MHz (MAX) in DDR (266MB/s) with DQS
(3.0V)
• Execute-in-place (XIP)
• PROGRAM/ERASE SUSPEND operations
• Volatile and nonvolatile configuration settings
• Software reset
• Reset pin available
• 3-byte and 4-byte address modes – enable memory
access beyond 128Mb
• Dedicated 64-byte OTP area outside main memory
– Readable and user-lockable
– Permanent lock with PROGRAM OTP command
• Erase capability
– Bulk erase for monolithic, die erase for stacked
devices
– Sector erase 128KB uniform granularity
– Subsector erase 4KB, 32KB granularity
• Security and write protection
– Volatile and nonvolatile locking and software
write protection for each 128KB sector
– Nonvolatile configuration locking and password
protection
– Protection management register offering en-
hanced security features
– Hardware write protection: nonvolatile bits
(BP[3:0] and TB) define protected area size
– Program/erase protection during power-up
– CRC detects accidental changes to raw data
• Electronic signature
– JEDEC-standard 3-byte signature
– Extended device ID: two additional bytes identify
device factory options
• JESD47I-compliant
– Minimum 100,000 ERASE cycles per sector
– Data retention: 20 years (TYP)
Options
• Voltage
– 1.7–2.0V
– 2.7–3.6V
• Density
– 256Mb
– 512Mb
– 1Gb
– 2Gb
• Device stacking
– Monolithic
– 2 die stacked
– 4 die stacked
• Device Generation
• Die revision
• Configuration
– Boot in SDR x1
– Boot in DDR x8
• Sector Size
– 128KB
• Packages: JEDEC-standard, RoHS-com-
pliant
– 24-ball T-PBGA 05/6mm x 8mm
(5 x 5 array)
• Security features
– Standard security
• Special options
– Standard
– Automotive
• Operating temperature range
– From –40°C to +85°C
– From –40°C to +105°C
– From –40°C to +125°C
Marking
U
L
256
512
01G
02G
A
B
C
B
A
1
2
G
12
0
S
A
IT
AT
UT
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‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2018 Micron Technology, Inc. All rights reserved.
Preliminary
Xccela™ Flash Memory Data Sheet Brief
Features
Part Number Ordering
Micron
®
Xccela
flash devices are available in different configurations and densities. Verify valid part numbers by
using Micron’s part catalog search at www.micron.com. To compare features and specifications by device type,
visit www.micron.com/products. Contact the factory for devices not found.
Figure 1: Part Number Ordering Information
MT 35X L
Micron Technology
Part Family
35X = Xccela™ flash memory
Voltage
L = 2.7–3.6V
U = 1.7–2.0V
Density
256 = 256Mb
512 = 512Mb
01G = 1Gb
02G = 2Gb
Stack
A = 1 die/1 S#
B = 2 die/1 S#
C = 4 die/1 S#
Device Generation
B = 2nd generation
Die Revision
A = Rev. A
xxx
A
B
A
1
G
12 - 0
S
IT
ES
Production Status
Blank = Production
ES = Engineering samples
QS = Qualification samples
Operating Temperature
IT = –40°C to +85°C
AT = –40°C to +105°C
UT = –40°C to +125°C
Special Options
S = Standard
A = Automotive grade AEC-Q100
Security Features
0 = Standard default security
Package Codes
12 = 24-ball T-PBGA, 05/6 x 8mm (5 x 5 array)
Sector Size
G = Uniform 128KB
I/O Pin Configuration Option
1 = Boot in SDR x1
2 = Boot in DDR x8
CCMTD-1718347970-10442
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2018 Micron Technology, Inc. All rights reserved.
Preliminary
Xccela™ Flash Memory Data Sheet Brief
Important Notes and Warnings
Important Notes and Warnings
Micron Technology, Inc. ("Micron") reserves the right to make changes to information published in this document,
including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this docu-
ment if you obtain the product described herein from any unauthorized distributor or other source not authorized
by Micron.
Automotive Applications.
Products are not designed or intended for use in automotive applications unless specifi-
cally designated by Micron as automotive-grade by their respective data sheets. Distributor and customer/distrib-
utor shall assume the sole risk and liability for and shall indemnify and hold Micron harmless against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-
automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con-
ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to in-
demnify and hold Micron harmless against all claims, costs, damages, and expenses and reasonable attorneys'
fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage
resulting from any use of non-automotive-grade products in automotive applications.
Critical Applications.
Products are not authorized for use in applications in which failure of the Micron compo-
nent could result, directly or indirectly in death, personal injury, or severe property or environmental damage
("Critical Applications"). Customer must protect against death, personal injury, and severe property and environ-
mental damage by incorporating safety design measures into customer's applications to ensure that failure of the
Micron component will not result in such harms. Should customer or distributor purchase, use, or sell any Micron
component for any critical application, customer and distributor shall indemnify and hold harmless Micron and
its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims,
costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, or death arising in any way out of such critical application, whether or not Mi-
cron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the
Micron product.
Customer Responsibility.
Customers are responsible for the design, manufacture, and operation of their systems,
applications, and products using Micron products. ALL SEMICONDUCTOR PRODUCTS HAVE INHERENT FAIL-
URE RATES AND LIMITED USEFUL LIVES. IT IS THE CUSTOMER'S SOLE RESPONSIBILITY TO DETERMINE
WHETHER THE MICRON PRODUCT IS SUITABLE AND FIT FOR THE CUSTOMER'S SYSTEM, APPLICATION, OR
PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included
in customer's applications and products to eliminate the risk that personal injury, death, or severe property or en-
vironmental damages will result from failure of any semiconductor component.
Limited Warranty.
In no event shall Micron be liable for any indirect, incidental, punitive, special or consequential
damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such damages are based on tort, warranty,
breach of contract or other legal theory, unless explicitly stated in a written agreement executed by Micron's duly
authorized representative.
CCMTD-1718347970-10442
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Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2018 Micron Technology, Inc. All rights reserved.
Preliminary
Xccela™ Flash Memory Data Sheet Brief
Device Description
Device Description
This is a brief version of the MT35X data sheet. For complete information, please refer
to the full NDA version.
To request access to the full NDA version of the MT35X data sheet, please contact your
sales representative.
The Micron
Xccela
flash is a high-performance, multiple I/O, SPI-compatible flash
memory device. It features a high-speed, low pin count
Xccela
bus interface with a DDR
clock frequency of up to 200 MHz for 1.8V parts and up to 133 MHz for 3.0 V parts, using
eight I/O signals and a data strobe (DQS pin).
SUSPEND and RESUME commands provide the ability to pause and resume PRO-
GRAM/ERASE operations. Nonvolatile and volatile configuration registers enable re-
spective default and temporary settings such as READ operation dummy clock cycles
and wrap modes, memory protection, output buffer impedance, SPI protocol type and
XIP mode.
Memory is organized as uniform 128KB sectors, 4KB and 32KB subsectors, and 256 byte
pages. The device also includes a 64-byte one-time-programmable (OTP) memory area
that can be permanently locked.
Direct boot in octal DDR protocol provides high performance and ease of use, enabling
communication between the host and flash device without need to configure extended
SPI protocol operations. However, the device still supports both extended SPI and octal
DDR protocols to ensure legacy system support and an easy migration path. The exten-
ded SPI protocol supports address and data transmission on one or eight data lines, de-
pending on the command.
Information in octal DDR protocol is always transmitted by eight data lines on both ris-
ing and falling clock edges. Most legacy x1 SPI commands are supported, but require
only one clock cycle because the command is latched on both the rising and falling
edges of the clock. Address cycles are fixed at 4-byte READ operations from the flash ar-
ray.
The host is not required to drive DQS during the input operation to the memory. The
data input (DQ) to the memory still relies on clock (C) to latch all address and data op-
erations. Most register outputs require dummy clock cycles due to the critical timing
from command decoding. With the help of DQS for data latching, the number of dum-
my clocks is transparent to the host.
CCMTD-1718347970-10442
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4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2018 Micron Technology, Inc. All rights reserved.
Preliminary
Xccela™ Flash Memory Data Sheet Brief
Device Description
Block Diagram
Figure 2: Block Diagram – Components and Signals
RESET#
W#
S#
C
DQ[7:0]
DQS
I/O shift register
Control logic
High voltage
generator
64 OTP bytes
Address register
and counter
256 byte
data buffer
Status
register
Y decoder
Memory
X decoder
Note:
1. Each page of memory can be individually programmed, but the device is not page-eras-
able.
CCMTD-1718347970-10442
Xccela_summary– Rev. A 04/18
5
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2018 Micron Technology, Inc. All rights reserved.
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