EEWORLDEEWORLDEEWORLD

Part Number

Search

DS2-324-2BR

Description
IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder
Categorysocket   
File Size30KB,2 Pages
ManufacturerThomas & Betts Corporation
Websitehttp://www.tnb.com/
Download Datasheet Parametric View All

DS2-324-2BR Overview

IC Socket, DIP24, 24 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder

DS2-324-2BR Parametric

Parameter NameAttribute value
MakerThomas & Betts Corporation
Reach Compliance Codeunknown
ECCN codeEAR99
Is SamacsysN
Other features.10uF CAPACITOR
body width0.4 inch
subject depth0.165 inch
body length1.2 inch
Contact to complete cooperationAU ON NI
Contact completed and terminatedTIN OVER NICKEL
Contact materialBE-CU
Contact styleRND PIN-SKT
current rating3 A
Device slot typeIC SOCKET
Type of equipment usedDIP24
Dielectric withstand voltage1000VAC V
Shell materialEPOXY
Insulation resistance5000000000 Ω
Manufacturer's serial numberDS
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts24
Maximum operating temperature85 °C
Minimum operating temperature10 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.3 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Base Number Matches1
DS Series
A
Capacitor Socket With Four-Finger Contact
DS1-316-1AR
FEATURES:
Augat has combined its four-finger high reliability contact with a surface
mount capacitor and a circuit assembly to create a full line of decoupling
(dual-in-line) sockets.
• Available in three lead termination styles, .125" (3,18) PC tail,
.180" (4,57) PC tail and 3-level solderless wire wrap
• Reduces PCB utilized space by 12% to 15%
• Allows handling, inventory and installation of one component
instead of two
• Available in three capacitor values: .01µF, .10µF and .33µF
• Optional assignment of voltage and ground available for custom
decoupling requirements, consult factory
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1, Cond. II
Shock .............................. Passed MIL-STD-1344, Method 2004.1, Cond. C
Durability ...................... Passed 50 cycles
Normal Force ................ 115 Grams (4.1 0z.) min. with .018" (0,46) dia.
polished steel pin (typ.)
Inner Contact
Retention .................... 7.5 Lbs. per line average
Solderability .................. Passed MIL-STD-202, Method 208
Insertion Force .............. 179 Grams (6.3 oz.) average with .018" (0,46) dia.
polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with .018" (0,46) dia.
polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202F, Method 305
(adjacent contacts max.)
Insulation Resistance .... 5,000 Megohms @ 500 VDC per MIL-STD-1344,
Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 VAC RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Moisture Resistance ...... Passed MIL-STD-202, Method 106
Temperature Cycling .... Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temp.* .......... +10°C to +85°C
* This temperature range applies to the capacitor only
APPLICATION DIMENSIONS:
• PCB Hole Size Range: .055"
±
.003" (1,40
±
0,08) Solderless wrap
.035"
±
.003" (0,89
±
0,08) PC solder termination
• IC Pin Dimension Range: .016" to .021" (0,41 to 0,53) dia.
.105" (2,67) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Glass epoxy
Outer Sleeve .................. Machined brass/formed copper,
tin/lead or gold plated
Inner Contact .................. Beryllium copper, gold over nickel
or tin/lead plated
Quality & Innovation From The
Product Group
A20
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
Black Gold FPGA development board, C8051F020 small system plus simulator
[color=#666666][font=tahoma, Verdana, Arial, 宋体]I have a set of unused black gold FPGA development boards (90% new). I also have a C8051F020 small system plus simulator (90% new). My junior year is al...
liklon Buy&Sell
103VBT6 chip program does not run on 103RET6
I was so depressed.I searched for two days but couldn't find the problem. I want to describe the problem.The UC/OS operating system I use can run normally on the 103VBT6 chip, but it doesn't run when ...
staraa stm32/stm8
How to replace the vias as a whole in Allegro?
[b]How to replace the vias in Allegro? [/b]...
ohahaha PCB Design
Design of a Single-Chip Microcomputer Multi-Machine Communication System
1 Introduction With the continuous development of single-chip microcomputer and computer technology, the application of single-chip microcomputer has also developed from independent single machine to ...
maker MCU
Does anyone know about Honeywell software?
As the title says, I have encountered a transmission problem and hope friends who have worked for Honeywell can help me....
logics Embedded System
Altium Dexigner 6.9
Does anyone have the decryption software for Altium Designer 6.9?...
jinpost PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1607  1053  548  2711  1589  33  22  12  55  32 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号