Measured with a Micro ohm meter 34420A(Agilent) or 3541(HIOKI) or equivalent. The measurement point of DCR is side of terminal. (refer to the Picture-1)
: 定格電流(インダクタンス変化に基づく場合)又は定格電流(温度上昇に基づく場合)の
測定箇所
½れか小さい方の直流電流値とします。
measurement point
:
Value defined when DC current flows and Rated Current (Based on Inductance Change)
or when current flows and Rated Current (Based on Temperature rise) whichever is smaller.
: 定格電流(インダクタンス変化に基づく場合)とは½ンダ½タン½½が初期値より
30% ½下した時の電流値。
(周囲温度 20℃)
:
The DC saturation allowable current value is specified when the decrease of the
initial inductance value at 30%.(The ambient reference temperature is 20℃)
: 定格電流(温度上昇に基づく場合)とは、直流を流した時の½品温度上昇が
40℃に達する電流値。 (周囲温度20℃)
:
Rated Current (Based on Temperature rise) is specified when temperature of the inductor
is raised 40℃ by DC current.
( The ambient reference temperature is 20
℃)
*特に指定がない限り、測定は標準状態で行う。
Unless
otherwise specified, measurement is the standard atmospheric conditions.
Picture-1
(4)絶対最大電圧
: 絶対最大電圧は30V DC です。
Absolute maximum voltage
:
Absolute maximum voltage 30V DC.
Reference Only
FDVE0630 Type
一般仕様
General Specifications ( 1/3 )
項 目
Item
1 たわみ強度
Bending test
3/8
規 格
Specification
初期値に対する
Lの変化率 ± 5%以内
Change from an initial value
L
:
within ± 5%
条 件
Condition
矢印の方向に曲げ幅 2mmになるまで毎秒約 0.5mmの速さで
加圧し 30±5秒間保持する。
Apply pressure gradually in the direction of the arrow at a rate of about
0.5mm/s until bent depth reaches 2mm and hold for 30±5 s.
基板
Board : 40
×
100mm
厚さ
thickness 1.0mm
2 固着強度
Adhesion strength
初期値に対する
Lの変化率 ± 5%以内
Change from an initial value
L
:
within ± 5%
3 耐振性
Vibration
初期値に対する
Lの変化率 ± 5%以内
Change from an initial value
L
:
within ± 5%
4 耐衝撃性
Mechanical shock
初期値に対する
Lの変化率 ± 5%以内
Change from an initial value
L
:
within ± 5%
5 自由½下試験
Free fall test
初期値に対する
Lの変化率 ± 5%以内
Change from an initial value
L
:
within ± 5%
6 はんだ付け性
Solderability
浸漬した電極面の 90%
以上新しいはんだで覆わ
れている事。
New solder shall cover
90% minimum of the surface
immersed.
初期値に対する
Lの変化率 ± 7%以内
R0.5の押し治具を½用して、矢印の方向に
静荷重を加え60±5秒間保持する。
測定は、荷重を取り去った後に行なう。
A static load using a R0.5 pressing tool shall be applied
to the body of the specimen in the direction of the arrow and
shall be hold for 60±5 s. Measure after removing pressure.
掃引の割合 10½55½10Hz/分、全振幅 1.5mm
X½Y½Z 方向に各 2時間(計 6時間)加える。
The specimen shall be subjected to a vibration of 1.5mm
amplitude, sweep frequency 10½55Hz(10Hz to 55Hz to 10Hz
in a period of one minute) for 2 h in each of 3(X, Y, Z) axes.
加速度
Peak acceleration
½用時間
Duration of pulse
3方向に各 3回(計 9回)
:
981 m/s
2
:
6 ms
:
3 times in each of 3(X, Y, Z) axes.
Three successive shock shall be applied in the perpendicular
direction of each surface of the specimen.
供試品を取り付けた試験基板を、質量 200g の治具に
取り付け,高さ 1m から堅い木版上に、互いに垂直
な3方向に、各3回(計 9回)自然½下させる。
The specimen must be fixed on test board. It must be equipped with
instruments of which weight is 200g. Then it shall be fallen freely
from 1m height to rigid wood 3 times in each of three axes.
電極に常温にてフラ½½½½を塗布し下記条件にて
プリヒ½ト後試料全½をはんだ½に浸漬する。
Electrode shall be immersed in flux at room temperature
and then shall be immersed in solder bath after preheat.
245±5℃ , 3±1s
・はんだ付け
Soldering
試験方法
Test method
リフロ½はんだ
Reflow soldering method
・プリヒ½ト
Preheat
150½180℃ , 90±30 s
・ピ½½温度
Peak temp. 250(+5,-0)℃ ( 230℃min , 30±10 s )
試料を板厚0.8mm½゙ラ½½½ポ½½基板に½き、上記
条件にてリフロ½炉を2回通す。
The specimen shall be subjected to the reflow process
under the above condition 2 times.
Test board shall be 0.8 mm thick. Base material shall
be glass epoxy resin.
測定
Measurement
常温常湿中に1時間放½後測定。
The specimen shall be stored at standard atmospheric
conditions for 1 h in prior to the measurement.
7 はんだ耐熱性
Resistance to
soldering heat
Change from an initial value
L
:
within ± 7%
FDVE0630
Reference Only
FDVE0630 Type
一般仕様
General Specifications ( 2/3 )
項 目
Item
8 耐電圧
Dielectric strength
9 耐寒性
Low temperature
4/8
規 格
Specification
異常がないこと。
Without damage.
初期値に対する
Lの変化率 ± 5%以内
Change from an initial value
L : within ± 5%
条 件
Condition
端子・½½間に DC50V を 1分間印加。½ン½½電流は5mA。
50V DC shall be applied for 60 s between the terminal and the core.
Cut off current 5mA.
温度-40±3℃中に 500±12時間放½後常温常湿中に
1時間放½し、1時間以内に測定。
The specimen shall be stored at a temperature of -40±3℃
for 500±12 h. Then it shall be stabilized under standard
atmospheric conditions for 1 h before measurement.
Measurement shall be made within 1 h.
温度+100±2℃中に 500±12時間放½後常温常湿中に
1時間放½し、1時間以内に測定。
The specimen shall be stored at a temperature of 100±2℃
for 500±12 h. Then it shall be stabilized under standard
atmospheric conditions for 1 h before measurement.
Measurement shall be made within 1 h.
温度60±2℃、湿度90½95%中に 500±12時間放½後
常温常湿中に1時間放½し、1時間以内に測定。
The specimen shall be stored at a temperature of 60±2℃
with relative humidity of 90½95% for 500±12 h. Then it shall be
stabilized under standard atmospheric conditions for 1 h
before measurement. Measurement shall be made within 1 h.
-40℃(30分)→常温(2分以内)→100℃(30分)→常温
(2分以内)を1½½½ルとし、これを 500½½½ル行い、
常温常湿中に1時間放½し、1時間以内に測定。
The specimen shall be subjected to 500 continuous cycles
of temperature change of -40℃ for 30 min and 100℃ for
30 min with the transit period of 2min or less. Then it shall be
stabilized under standard atmospheric conditions for 1 h
before measurement Measurement shall be made within 1 h
[i=s] This post was last edited by paulhyde on 2014-9-15 03:27 [/i] I found a circuit with automatic gain control on the Internet. After simulating it with multisim, the output of the latter stage is ...
My nios project has been built and compiled successfully, but the following prompt appears when running
Using cable "USB-Blaster [USB-0]", device 1, instance 0x00 Pausing target processor: OK Initiali...
Hello, everyone: Today I shared the introductory material on electrical engineering that I learned, "OHM-Illustrated Introduction to Electrical Engineering" by OHM of Japan. This book explains the bas...
The program often runs out of control when the PCB board I drew is soldered and put into the system. What are the possible reasons and solutions? Thank you....
Assume that data is read from 8-bit AD (if it is a higher-bit AD, the data type can be defined as int), the subroutine is get_ad();
1. Limited secondary filtering
/* A value can be adjust...[Details]
As a wireless broadband metropolitan area network standard, WiMAX technology has greater advantages than previous 3.5GHz MMDS products in terms of non-line-of-sight transmission and spectrum utiliz...[Details]
Floating-point digital signal processing has become a constant requirement for precision technology, often in applications requiring high accuracy in areas such as aviation, industrial machinery, a...[Details]
1 Introduction
Solar street lights are mainly composed of four parts: solar photovoltaic cell components, batteries, charge and discharge controllers, and lighting fixtures. The bo...[Details]
I. Introduction
In the field of power conversion, isolated converters (forward, flyback, and double-ended) with low output DC voltage all use MOSFET as the rectifier device. Since these devi...[Details]
Overview
In spectral measurement, photomultiplier tubes (PMT) and charge-coupled devices (CCD) are often used as photoelectric converters. PMT is used in slow-changing, high-precision spectral...[Details]
Problems such as the depletion of natural resources, air pollution, traffic congestion, and rising fossil fuel prices have forced societies and individuals to seek alternative means of transportati...[Details]
Motors, especially those with brushes, generate a lot of noise. This noise must be dealt with if the appliance is to meet the requirements of EMC standards. The means to solve EMC are nothing more ...[Details]
Traditional
virtual instruments
consist of a data acquisition
board
based on PCI bus and
corresponding software. However, with
the rapid development of
computer
network techno...[Details]
The DisplayPort interface standard is approved by the Video Electronics Standards Association (VESA) to provide an open, scalable standard for the entire industry. The development of DisplayPort ca...[Details]
Analysis of the three core aspects of digital TV transmission standards
According to the differences in regionality, transmission method and modulation method, the transmission method needs to...[Details]
LED is the abbreviation of the English word. Its main meanings are: LED = Light Emitting Diode, a solid-state semiconductor device that can convert electrical energy into visible light. It can dire...[Details]
The future energy storage hotspot is not coal or iron ore, but lithium. This lightest metal in nature may be the heaviest resource in the future energy landscape. China launched an ambitious electr...[Details]
Nowadays, more and more people have digital cameras. The convenience and speed of digital cameras have gradually replaced film cameras and become the main tool for people's daily photography. The n...[Details]
The principles to be followed are as follows:
(1) In terms of component layout, related components should be placed as close as possible. For example, clock generators, crystal oscillat...[Details]