Differential Multiplexer, 1 Func, 8 Channel, CMOS, CQCC28,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Vishay |
| package instruction | QCCN, LCC28,.45SQ |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| Analog Integrated Circuits - Other Types | DIFFERENTIAL MULTIPLEXER |
| JESD-30 code | S-XQCC-N28 |
| JESD-609 code | e0 |
| Number of channels | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| Maximum on-state resistance (Ron) | 125 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC28,.45SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 12/+-15 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum signal current | 0.02 A |
| surface mount | YES |
| Maximum connection time | 600 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Base Number Matches | 1 |
| DG407AZ/883 | DG407AK/883 | DG406AK/883 | DG406AZ/883 | |
|---|---|---|---|---|
| Description | Differential Multiplexer, 1 Func, 8 Channel, CMOS, CQCC28, | Differential Multiplexer, 1 Func, 8 Channel, CMOS, CDIP28, | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CDIP28, | Single-Ended Multiplexer, 1 Func, 16 Channel, CMOS, CQCC28, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Vishay | Vishay | Vishay | Vishay |
| package instruction | QCCN, LCC28,.45SQ | DIP, DIP28,.6 | DIP, DIP28,.6 | QCCN, LCC28,.45SQ |
| Reach Compliance Code | unknown | unknown | unknow | unknow |
| Analog Integrated Circuits - Other Types | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 code | S-XQCC-N28 | R-XDIP-T28 | R-XDIP-T28 | S-XQCC-N28 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of channels | 8 | 8 | 16 | 16 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 |
| Maximum on-state resistance (Ron) | 125 Ω | 125 Ω | 125 Ω | 125 Ω |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | QCCN | DIP | DIP | QCCN |
| Encapsulate equivalent code | LCC28,.45SQ | DIP28,.6 | DIP28,.6 | LCC28,.45SQ |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER |
| power supply | 12/+-15 V | 12/+-15 V | 12/+-15 V | 12/+-15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Filter level | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| Maximum signal current | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| surface mount | YES | NO | NO | YES |
| Maximum connection time | 600 ns | 600 ns | 600 ns | 600 ns |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | DUAL | QUAD |
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