M24C04-WDW6TP datasheet, PDF - EEWORLD Datasheet

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M24C04-WDW6TP: Categorystorage storage; File Size589KB，40 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M24C04-WDW6TP Parametric

Parameter Name	Attribute value
Brand Name	STMicroelectronics
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	SOIC
package instruction	TSSOP, TSSOP8,.25
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	13 weeks
Is Samacsys	N
Maximum clock frequency (fCLK)	0.4 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDMR
JESD-30 code	R-PDSO-G8
JESD-609 code	e4
length	4.4 mm
memory density	4096 bit
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512X8
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP8,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
power supply	3/5 V
Certification status	Not Qualified
Maximum seat height	1.2 mm
Serial bus type	I2C
Maximum standby current	0.000001 A
Maximum slew rate	0.002 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	3 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE
Base Number Matches	1

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M24C04-W M24C04-R

M24C04-F

4-Kbit serial I²C bus EEPROM

Datasheet

production data

Features

•

Compatible with I

C bus modes:

– 400 kHz

– 100 kHz

TSSOP8 (DW)

169 mil width

•

Memory array:

– 4 Kbit (512 bytes) of EEPROM

– Page size: 16 byte

•

Single supply voltage:

– M24C04-W: 2.5 V to 5.5 V

– M24C04-R: 1.8 V to 5.5 V

– M24C04-F: 1.7 V to 5.5 V (full temperature

range) and 1.6 V to 1.7 V (limited

temperature range)

•

Write:

– Byte Write within 5 ms

– Page Write within 5 ms

PDIP8 (BN)

(1)

•

Operating temperature range:

– from -40 °C up to +85 °C

•

Random and sequential Read modes

•

Write protect of the whole memory array

•

Enhanced ESD/Latch-Up protection

UFDFPN8 (MC)

DFN8 - 2 x 3 mm

•

More than 4 million Write cycles

•

More than 200-years data retention

SO8 (MN)

150 mil width

Packages

•

RoHS compliant and halogen-free

(ECOPACK2

)

UFDFPN5 (MH)

DFN5 - 1.7 x 1.4 mm

October 2017

This is information on a product in full production.

DocID023994 Rev 5

1/40

www.st.com

Contents

M24C04-W M24C04-R M24C04-F

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Enable (E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

(ground) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.6.1

2.6.2

2.6.3

2.6.4

Operating supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4.1

4.2

4.3

4.4

4.5

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Data input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Device addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.1

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

5.1.1

5.1.2

5.1.3

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Minimizing Write delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 17

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5.2

Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5.2.1

5.2.2

5.2.3

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DocID023994 Rev 5

List of tables

M24C04-W M24C04-R M24C04-F

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Address byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Operating conditions (voltage range W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Operating conditions (voltage range R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Operating conditions (voltage range F, for devices identified

by process letter T) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Operating conditions (voltage range F, for all other devices) . . . . . . . . . . . . . . . . . . . . . . . 22

AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Cycling performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Memory cell data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

DC characteristics (M24C04-W, device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

DC characteristics (M24C04-R device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

DC characteristics (M24C04-F device grade 6 and grade 5) . . . . . . . . . . . . . . . . . . . . . . . 26

400 kHz AC characteristics (I2C Fast-mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

100 kHz AC characteristics (I

C Standard mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

UFDFPN5 - 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch

dual flat package, no lead - package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch dual flat package,

no lead - package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

TSSOP8 – 3 x 4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 36

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

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DocID023994 Rev 5

M24C04-W M24C04-R M24C04-F

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Figure 19.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

8-pin package connections, top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

UFDFPN5 (DFN5) package connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 16

Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Maximum Rbus value versus bus parasitic capacitance (Cbus) for

an I2C bus at maximum frequency fC = 400 kHz

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

UFDFPN5 – 1.7x1.4 mm, 0.55 mm thickness, ultra thin fine pitch

dual flat package, no lead - package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

UFDFPN5 - 5-lead, 1.7 × 1.4 mm, 0.55 mm thickness, ultra thin fine pitch

dual flat package, no lead recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

UFDFPN8 – 2x3 mm, 0.55 thickness, ultra thin fine pitch

dual flat package, no lead - package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width, package outline . 34

SO8N – 3.9x4.9 mm, 8-lead plastic small outline, 150 mils body width,

package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 36

DocID023994 Rev 5

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M24C04-WDW6TP Related Products

	M24C04-WDW6TP	M24C04-RMN6TP	M24C04-FMH6TG
Description			Memory interface type: I2C Memory capacity: 4Kb (512 x 8) Operating voltage: 1.7V ~ 5.5V Memory type: Non-Volatile
Brand Name	STMicroelectronics	STMicroelectronics	STMicroelectronics
Is it Rohs certified?	conform to	conform to	conform to
package instruction	TSSOP, TSSOP8,.25	SOP, SOP8,.25	HVSON,
Reach Compliance Code	compliant	compliant	compliant
Factory Lead Time	13 weeks	13 weeks	12 weeks
Maximum clock frequency (fCLK)	0.4 MHz	0.4 MHz	0.4 MHz
JESD-30 code	R-PDSO-G8	R-PDSO-G8	R-PDSO-N5
length	4.4 mm	4.9 mm	1.7 mm
memory density	4096 bit	4096 bit	4096 bit
Memory IC Type	EEPROM	EEPROM	EEPROM
memory width	8	8	8
Number of functions	1	1	1
Number of terminals	8	8	5
word count	512 words	512 words	512 words
character code	512	512	512
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
organize	512X8	512X8	512X8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	SOP	HVSON
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	260	NOT SPECIFIED
Maximum seat height	1.2 mm	1.75 mm	0.6 mm
Serial bus type	I2C	I2C	I2C
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	2.5 V	1.8 V	1.7 V
Nominal supply voltage (Vsup)	5 V	2.5 V	2.5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal form	GULL WING	GULL WING	NO LEAD
Terminal pitch	0.65 mm	1.27 mm	0.4 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	NOT SPECIFIED
width	3 mm	3.9 mm	1.4 mm
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms
Base Number Matches	1	1	1
Parts packaging code	SOIC	SOIC	-
Contacts	8	8	-
ECCN code	EAR99	EAR99	-
Data retention time - minimum	40	40	-
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	-
I2C control byte	1010DDMR	1010DDMR	-
JESD-609 code	e4	e4	-
Humidity sensitivity level	1	1	-
Encapsulate equivalent code	TSSOP8,.25	SOP8,.25	-
power supply	3/5 V	2/5 V	-
Certification status	Not Qualified	Not Qualified	-
Maximum standby current	0.000001 A	0.000001 A	-
Maximum slew rate	0.002 mA	0.0008 mA	-
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	-
write protect	HARDWARE	HARDWARE	-

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