TH02 SI7005 datasheet, PDF - EEWORLD Datasheet

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TH02 SI7005: DescriptionHumidity range: 0 ~ 100% RH Temperature range: - Accuracy: ± 4.5 % RH Sensor type: Humidity, Temperature Output type: I²C; CategoryThe sensor Temperature and humidity sensor; File Size740KB，36 Pages; ManufacturerHOPERF; Websitehttp://www.hoperf.com/

Download Datasheet Parametric View All

TH02 SI7005 Overview

Humidity range: 0 ~ 100% RH Temperature range: - Accuracy: ± 4.5 % RH Sensor type: Humidity, Temperature Output type: I²C

TH02 SI7005 Parametric

Parameter Name	Attribute value
Humidity range	0 ~ 100% RH
temperature range	-
Accuracy	± 4.5 % RH
Response time	18s
operating temperature	-40°C ~ 85°C
Supply voltage	2.1 V ~ 3.6 V
sensor type	Humidity, Temperature
Output type	I²C

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TH02

I G I TA L

C H

UM I D I T Y AND

EM P ER AT U R E

EN S OR

Features

VDD

GND

DNC

GND

EXT

Applications

Industrial HVAC/R

Thermostats/humidistats

Respiratory therapy

White goods

Micro-environments/data centers

Automotive climate control and de-

fogging

Asset and goods tracking

E-mail:sales@hoperf.com

www.hoperf.com

DNC



Relative Humidity Sensor

± 4.5 % RH (maximum @ 0–80% RH)

Temperature Sensor

±0.5 ºC accuracy (typical)

±1 ºC accuracy (maximum @ 0 to 70 °C)

0 to 100% RH operating range

–40 to +85 °C (GM) or 0 to +70 °C

operating range (FM)

Wide operating voltage range

(2.1 to 3.6 V)

Low Power Consumption

240 µA during RH conversion

Excellent long term stability

Factory calibrated

Optional factory-installed

cover

Low-profile

Protection during reflow

Excludes liquids and

particulates

(hydrophobic/oleophobic)

18 DNC

17 DNC

16 DNC

15 CS

14 DNC

13 DNC

I2C host interface

Integrated on-chip heater

4x4 mm QFN package

GND

DNC

SCL

SDA

DNC

Pin Assignments

GND

DNC



Rev 2.0

TH02

AB L E OF

O N TE NTS

Section

Page

1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2. Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

4.2. Relative Humidity Sensor Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

or Ac

4.3. Linearization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

4.4. Temperature Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.5. Hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

4.6. Prolonged Exposure to High Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

.6.

4.7. PCB Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.8. Protecting the Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

4.9. Bake/Hydrate Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

4.10. Long Term Drift/Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

5. Host Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5.1. I

C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

5.2. I

C Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

6. TH02 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

7. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

7.1. Register Detail (Defaults in Bold) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

8. Pin Descriptions: TH02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

9. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

10. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

10.1. 24-Pin QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

10.2. 24-Pin QFN with Protective Cover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

11. PCB Land Pattern and Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

lder

12. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

12.1. TH02 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

12.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

E-mail:sales@hoperf.com

www.hoperf.com

Rev 2.0

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