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K8S1115EBC-FE1ET

Description
EEPROM Card, 32MX16, 95ns, Parallel, CMOS, PBGA64,
Categorystorage    storage   
File Size667KB,83 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K8S1115EBC-FE1ET Overview

EEPROM Card, 32MX16, 95ns, Parallel, CMOS, PBGA64,

K8S1115EBC-FE1ET Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerSAMSUNG
package instructionFBGA, BGA64,10X14,20
Reach Compliance Codecompli
Maximum access time95 ns
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingYES
JESD-30 codeR-PBGA-B64
memory density536870912 bi
Memory IC TypeEEPROM CARD
memory width16
Humidity sensitivity level1
Number of departments/size4,511
Number of terminals64
word count33554432 words
character code32000000
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
organize32MX16
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA64,10X14,20
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)225
power supply1.8 V
Programming voltage2.7 V
Certification statusNot Qualified
ready/busyYES
Department size16K,64K
Maximum standby current0.00003 A
Maximum slew rate0.07 mA
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
switch bitYES
typeNOR TYPE
Base Number Matches1
Rev. 1.1, Sep. 2010
K8S1215ETC
K8S1215EBC
K8S1215EZC
512Mb C-die NOR FLASH
9x11, 64FBGA, 32M x16, Muxed Burst, Multi Bank SLC
1.7V ~ 1.95V
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2010 Samsung Electronics Co., Ltd. All rights reserved.
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