MSP430F5525IPNR datasheet, PDF

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MSP430F5525IPNR: Description16-bit ultra-low power microprocessor with USB interface, 64KB flash memory, 4KB RAM, 12-bit ADC, 2 USCI, 32-bit HW MPY; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，128 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/; Environmental Compliance

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MSP430F5525IPNR Overview

16-bit ultra-low power microprocessor with USB interface, 64KB flash memory, 4KB RAM, 12-bit ADC, 2 USCI, 32-bit HW MPY

MSP430F5525IPNR Parametric

Parameter Name	Attribute value
Brand Name	Texas Instruments
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	QFP
package instruction	LFQFP, QFP80,.55SQ,20
Contacts	80
Reach Compliance Code	compliant
ECCN code	EAR99
Factory Lead Time	6 weeks
Has ADC	YES
Other features	ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ
Address bus width
bit size	16
boundary scan	YES
CPU series	MSP430
maximum clock frequency	32 MHz
DAC channel	NO
DMA channel	YES
External data bus width
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	S-PQFP-G80
JESD-609 code	e4
length	12 mm
low power mode	YES
Humidity sensitivity level	3
Number of DMA channels	3
Number of external interrupt devices
Number of I/O lines	63
Number of serial I/Os	4
Number of terminals	80
Number of timers	4
On-chip data RAM width	8
On-chip program ROM width	8
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP80,.55SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	2/3.3 V
Certification status	Not Qualified
RAM (bytes)	4096
RAM (number of words)	4
rom(word)	65536
ROM programmability	FLASH
Maximum seat height	1.6 mm
speed	25 MHz
Maximum slew rate	11 mA
Maximum supply voltage	3.6 V
Minimum supply voltage	2.4 V
Nominal supply voltage	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	12 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC
Base Number Matches	1

MSP430F5525IPNR Related Products

	MSP430F5525IPNR	MSP430F5517IPNR	MSP430F5528IRGCR
Description	16-bit ultra-low power microprocessor with USB interface, 64KB flash memory, 4KB RAM, 12-bit ADC, 2 USCI, 32-bit HW MPY	Mixed Signal Microprocessors	Working voltage: 1.8V ~ 3.6V CPU bits: 16-Bit CPU core: CPUXV2 Main frequency (MAX): 25MHz ROM type: FLASH 16-bit ultra-low power microprocessor with 128KB flash memory, 8KB RAM, USB interface, 12-bit ADC, 2 USCI, 32-bit HW MPY
Brand Name	Texas Instruments	Texas Instruments	Texas Instruments
Is it lead-free?	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to
Parts packaging code	QFP	QFP	QFN
package instruction	LFQFP, QFP80,.55SQ,20	LFQFP, QFP80,.55SQ,20	VQFN-64
Contacts	80	80	64
Reach Compliance Code	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99
Factory Lead Time	6 weeks	6 weeks	6 weeks
Has ADC	YES	YES	YES
Other features	ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ	ALSO OPERATES AT 1.8 MINIMUM SUPPLY AT 8 MHZ
bit size	16	16	16
boundary scan	YES	YES	YES
CPU series	MSP430	MSP430	MSP430
maximum clock frequency	32 MHz	32 MHz	32 MHz
DAC channel	NO	NO	NO
DMA channel	YES	YES	YES
Format	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	NO	NO	NO
JESD-30 code	S-PQFP-G80	S-PQFP-G80	S-PQCC-N64
JESD-609 code	e4	e4	e4
length	12 mm	12 mm	9 mm
low power mode	YES	YES	YES
Humidity sensitivity level	3	3	3
Number of DMA channels	3	3	3
Number of I/O lines	63	63	47
Number of serial I/Os	4	4	4
Number of terminals	80	80	64
Number of timers	4	4	4
On-chip data RAM width	8	8	8
On-chip program ROM width	8	8	8
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	HVQCCN
Encapsulate equivalent code	QFP80,.55SQ,20	QFP80,.55SQ,20	LCC64,.35SQ,20
Package shape	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	260
power supply	2/3.3 V	2/3.3 V	2/3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	4096	6144	8192
RAM (number of words)	4	6	8
rom(word)	65536	98304	131072
ROM programmability	FLASH	FLASH	FLASH
Maximum seat height	1.6 mm	1.6 mm	1 mm
speed	25 MHz	25 MHz	25 MHz
Maximum slew rate	11 mA	11 mA	11 mA
Maximum supply voltage	3.6 V	3.6 V	3.6 V
Minimum supply voltage	2.4 V	2.4 V	2.4 V
Nominal supply voltage	3 V	3 V	3 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	GULL WING	NO LEAD
Terminal pitch	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	12 mm	12 mm	9 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Base Number Matches	1	1	1
Maker	-	Texas Instruments	Texas Instruments

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