EEPROM, 2KX8, 700ns, Parallel, CMOS, PDSO24, 0.300 INCH, SOIC-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Catalyst |
| Parts packaging code | SOIC |
| package instruction | SOP, SOP24,.45 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Maximum access time | 700 ns |
| Other features | AUTOMATIC WRITE |
| command user interface | NO |
| Data polling | YES |
| Durability | 10000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G24 |
| JESD-609 code | e0 |
| length | 15.4 mm |
| memory density | 16384 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP24,.45 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3 V |
| Programming voltage | 3 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.65 mm |
| Maximum standby current | 0.00005 A |
| Maximum slew rate | 0.01 mA |
| Maximum supply voltage (Vsup) | 3.3 V |
| Minimum supply voltage (Vsup) | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| switch bit | NO |
| width | 7.5 mm |
| Maximum write cycle time (tWC) | 20 ms |
| Base Number Matches | 1 |
| CAT28C16V3K-70 | CAT28C16V3N-70 | CAT28C16V3P-70 | |
|---|---|---|---|
| Description | EEPROM, 2KX8, 700ns, Parallel, CMOS, PDSO24, 0.300 INCH, SOIC-24 | EEPROM, 2KX8, 700ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 | EEPROM, 2KX8, 700ns, Parallel, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Parts packaging code | SOIC | QFJ | DIP |
| package instruction | SOP, SOP24,.45 | QCCJ, LDCC32,.5X.6 | DIP, DIP24(UNSPEC) |
| Contacts | 24 | 32 | 24 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 700 ns | 700 ns | 700 ns |
| Other features | AUTOMATIC WRITE | AUTOMATIC WRITE | AUTOMATIC WRITE |
| command user interface | NO | NO | NO |
| Data polling | YES | YES | YES |
| Durability | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles |
| JESD-30 code | R-PDSO-G24 | R-PQCC-J32 | R-PDIP-T24 |
| JESD-609 code | e0 | e0 | e0 |
| length | 15.4 mm | 13.97 mm | 31.877 mm |
| memory density | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | EEPROM | EEPROM | EEPROM |
| memory width | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 24 | 32 | 24 |
| word count | 2048 words | 2048 words | 2048 words |
| character code | 2000 | 2000 | 2000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C |
| organize | 2KX8 | 2KX8 | 2KX8 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | QCCJ | DIP |
| Encapsulate equivalent code | SOP24,.45 | LDCC32,.5X.6 | DIP24(UNSPEC) |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | CHIP CARRIER | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3 V | 3 V | 3 V |
| Programming voltage | 3 V | 3 V | 3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.65 mm | 3.55 mm | 5.08 mm |
| Maximum standby current | 0.00005 A | 0.00005 A | 0.00005 A |
| Maximum slew rate | 0.01 mA | 0.01 mA | 0.01 mA |
| Maximum supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| Minimum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V |
| Nominal supply voltage (Vsup) | 3 V | 3 V | 3 V |
| surface mount | YES | YES | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | J BEND | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | QUAD | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| switch bit | NO | NO | NO |
| width | 7.5 mm | 11.43 mm | 15.24 mm |
| Maximum write cycle time (tWC) | 20 ms | 20 ms | 20 ms |
| Maker | Catalyst | - | Catalyst |
| Base Number Matches | 1 | 1 | - |
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