MPC8245TZU266D datasheet, PDF - EEWORLD Datasheet

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MPC8245TZU266D: Description32-BIT, 266MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352; CategoryMicrocontrollers and processors; File Size1MB，69 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/; Environmental Compliance

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MPC8245TZU266D Overview

32-BIT, 266MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352

MPC8245TZU266D Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	incompatible
Maker	Rochester Electronics
Parts packaging code	BGA
package instruction	35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352
Contacts	352
Reach Compliance Code	unknown
Is Samacsys	N
Other features	ALSO OPERATES AT 2V SUPPLY
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	66 MHz
External data bus width	32
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B352
JESD-609 code	e0
length	35 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	352
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)	220
Certification status	COMMERCIAL
Maximum seat height	1.65 mm
speed	266 MHz
Maximum supply voltage	1.9 V
Minimum supply voltage	1.7 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN LEAD
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	35 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

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Features

The peripheral logic integrates a PCI bridge, dual universal asynchronous receiver/transmitter (DUART),

memory controller, DMA controller, PIC interrupt controller, a message unit (and I

O interface), and an

C controller. The processor core is a full-featured, high-performance processor with floating-point

support, memory management, a 16-Kbyte instruction cache, a 16-Kbyte data cache, and power

management features. The integration reduces the overall packaging requirements and the number of

discrete devices required for an embedded system.

An internal peripheral logic bus interfaces the processor core to the peripheral logic. The core can operate

at a variety of frequencies, allowing the designer to trade off performance for power consumption. The

processor core is clocked from a separate PLL that is referenced to the peripheral logic PLL. This allows

the microprocessor and the peripheral logic block to operate at different frequencies while maintaining a

synchronous bus interface. The interface uses a 64- or 32-bit data bus (depending on memory data bus

width) and a 32-bit address bus along with control signals that enable the interface between the processor

and peripheral logic to be optimized for performance. PCI accesses to the MPC8245 memory space are

passed to the processor bus for snooping when snoop mode is enabled.

The general-purpose processor core and peripheral logic serve a variety of embedded applications. The

MPC8245 can be used as either a PCI host or PCI agent controller.

Features

Major features of the MPC8245 are as follows:

• Processor core

— High-performance, superscalar processor core

— Integer unit (IU), floating-point unit (FPU) (software enabled or disabled), load/store unit

(LSU), system register unit (SRU), and branch processing unit (BPU)

— 16-Kbyte instruction cache

— 16-Kbyte data cache

— Lockable L1 caches—Entire cache or on a per-way basis up to three of four ways

— Dynamic power management: 60x nap, doze, and sleep modes

• Peripheral logic

— Peripheral logic bus

– Various operating frequencies and bus divider ratios

– 32-bit address bus, 64-bit data bus

– Full memory coherency

– Decoupled address and data buses for pipelining of peripheral logic bus accesses

– Store gathering on peripheral logic bus-to-PCI writes

— Memory interface

– Up to 2 Gbytes of SDRAM memory

– High-bandwidth data bus (32- or 64-bit) to SDRAM

– Programmable timing supporting SDRAM

– One to eight banks of 16-, 64-, 128-, 256-, or 512-Mbit memory devices

MPC8245 Integrated Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

MPC8245TZU266D Related Products

	MPC8245TZU266D	MPC8245LZU300D	MPC8245LZU333D	MPC8245LVV266D	MPC8245LZU266D	MPC8245LVV333D	MPC8245LVV300D
Description	32-BIT, 266MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352	32-BIT, 300MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352	32-BIT, 333MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352	32-BIT, 266MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352	32-BIT, 266MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352	32-BIT, 333MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352	32-BIT, 300MHz, RISC PROCESSOR, PBGA352, 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352
Is it lead-free?	Lead free	Contains lead	Contains lead	Contains lead	Lead free	Lead free	Lead free
Is it Rohs certified?	incompatible	incompatible	incompatible	conform to	incompatible	conform to	conform to
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352	35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352	35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352	35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352	35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, TBGA-352	35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352	35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, TBGA-352
Contacts	352	352	352	352	352	352	352
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Address bus width	32	32	32	32	32	32	32
bit size	32	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	66 MHz	66 MHz	66 MHz	66 MHz	66 MHz	66 MHz	66 MHz
External data bus width	32	32	32	32	32	32	32
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352	S-PBGA-B352
JESD-609 code	e0	e0	e0	e1	e0	e1	e1
length	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm
low power mode	YES	YES	YES	YES	YES	YES	YES
Humidity sensitivity level	3	3	3	3	3	3	3
Number of terminals	352	352	352	352	352	352	352
Maximum operating temperature	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)	220	220	220	245	220	245	245
Certification status	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Maximum seat height	1.65 mm	1.65 mm	1.65 mm	1.65 mm	1.65 mm	1.65 mm	1.65 mm
speed	266 MHz	300 MHz	333 MHz	266 MHz	266 MHz	333 MHz	300 MHz
Maximum supply voltage	1.9 V	2.1 V	2.2 V	2.1 V	2.1 V	2.2 V	2.1 V
Minimum supply voltage	1.7 V	1.7 V	1.9 V	1.7 V	1.7 V	1.9 V	1.7 V
Nominal supply voltage	1.8 V	1.8 V	2 V	1.8 V	1.8 V	2 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD	TIN SILVER COPPER	TIN LEAD	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	30	30	30	30	30	30
width	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Maker	Rochester Electronics	-	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics

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