DUAL PULSE, 0.5MHz, TIMER, PDIP14, PLASTIC, DIP-14
| Parameter Name | Attribute value |
| Maker | NXP |
| Parts packaging code | DIP |
| package instruction | PLASTIC, DIP-14 |
| Contacts | 14 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| Analog Integrated Circuits - Other Types | PULSE |
| control mode | VOLTAGE-MODE |
| JESD-30 code | R-PDIP-T14 |
| length | 19.025 mm |
| Number of functions | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Maximum output frequency | 0.5 GHz |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum seat height | 4.2 mm |
| Maximum supply current (Isup) | 30 mA |
| Maximum supply voltage (Vsup) | 16 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| Maximum switching frequency | 100 kHz |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| Base Number Matches | 1 |
| NE556-1N | RNN70C2803BPRJ8 | SE556N | SE556F883C | NE556F | |
|---|---|---|---|---|---|
| Description | DUAL PULSE, 0.5MHz, TIMER, PDIP14, PLASTIC, DIP-14 | Fixed Resistor, Metal Film, 0.5W, 280000ohm, 350V, 0.1% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED | IC DUAL PULSE, TIMER, PDIP14, PLASTIC, DIP-14, Analog Waveform Generation Function | IC DUAL PULSE, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function | IC DUAL PULSE, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function |
| package instruction | PLASTIC, DIP-14 | AXIAL LEADED | PLASTIC, DIP-14 | DIP, | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Number of terminals | 14 | 2 | 14 | 14 | 14 |
| Maximum operating temperature | 70 °C | 175 °C | 125 °C | 125 °C | 70 °C |
| Package form | IN-LINE | Axial | IN-LINE | IN-LINE | IN-LINE |
| surface mount | NO | NO | NO | NO | NO |
| technology | BIPOLAR | METAL FILM | BIPOLAR | BIPOLAR | BIPOLAR |
| Maker | NXP | - | - | NXP | NXP |
| Parts packaging code | DIP | - | DIP | DIP | DIP |
| Contacts | 14 | - | 14 | 14 | 14 |
| Analog Integrated Circuits - Other Types | PULSE | - | PULSE; RECTANGULAR | PULSE | - |
| JESD-30 code | R-PDIP-T14 | - | R-PDIP-T14 | R-GDIP-T14 | R-CDIP-T14 |
| Number of functions | 2 | - | 2 | 2 | - |
| Package body material | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | - | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP8,.3 | - | DIP14,.3 | - | DIP14,.3 |
| Package shape | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 16 V | - | 18 V | 18 V | - |
| Minimum supply voltage (Vsup) | 4.5 V | - | 4.5 V | 4.5 V | - |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V | - |
| Temperature level | COMMERCIAL | - | MILITARY | MILITARY | COMMERCIAL |
| Terminal form | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | - | DUAL | DUAL | DUAL |
| ECCN code | - | EAR99 | EAR99 | EAR99 | - |
| JESD-609 code | - | e0 | e0 | - | e0 |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |