SE556F883C datasheet, PDF - EEWORLD Datasheet

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SE556F883C: DescriptionIC DUAL PULSE, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function; CategoryAnalog mixed-signal IC The signal circuit; File Size151KB，5 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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SE556F883C Overview

IC DUAL PULSE, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function

SE556F883C Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	DIP
package instruction	DIP,
Contacts	14
Reach Compliance Code	unknown
ECCN code	EAR99
Analog Integrated Circuits - Other Types	PULSE
JESD-30 code	R-GDIP-T14
length	19.535 mm
Number of functions	2
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	5.08 mm
Maximum supply voltage (Vsup)	18 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	7.62 mm

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SE556F883C Related Products

	SE556F883C	NE556-1N	RNN70C2803BPRJ8	SE556N	NE556F
Description	IC DUAL PULSE, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function	DUAL PULSE, 0.5MHz, TIMER, PDIP14, PLASTIC, DIP-14	Fixed Resistor, Metal Film, 0.5W, 280000ohm, 350V, 0.1% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED	IC DUAL PULSE, TIMER, PDIP14, PLASTIC, DIP-14, Analog Waveform Generation Function	IC DUAL PULSE, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function
package instruction	DIP,	PLASTIC, DIP-14	AXIAL LEADED	PLASTIC, DIP-14	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Number of terminals	14	14	2	14	14
Maximum operating temperature	125 °C	70 °C	175 °C	125 °C	70 °C
Package form	IN-LINE	IN-LINE	Axial	IN-LINE	IN-LINE
surface mount	NO	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	METAL FILM	BIPOLAR	BIPOLAR
Maker	NXP	NXP	-	-	NXP
Parts packaging code	DIP	DIP	-	DIP	DIP
Contacts	14	14	-	14	14
ECCN code	EAR99	-	EAR99	EAR99	-
Analog Integrated Circuits - Other Types	PULSE	PULSE	-	PULSE; RECTANGULAR	-
JESD-30 code	R-GDIP-T14	R-PDIP-T14	-	R-PDIP-T14	R-CDIP-T14
Number of functions	2	2	-	2	-
Package body material	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	-	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	-	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Maximum supply voltage (Vsup)	18 V	16 V	-	18 V	-
Minimum supply voltage (Vsup)	4.5 V	4.5 V	-	4.5 V	-
Nominal supply voltage (Vsup)	5 V	5 V	-	5 V	-
Temperature level	MILITARY	COMMERCIAL	-	MILITARY	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	-	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	-	DUAL	DUAL
Encapsulate equivalent code	-	DIP8,.3	-	DIP14,.3	DIP14,.3
JESD-609 code	-	-	e0	e0	e0
Terminal surface	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)

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