NE556F datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Analog mixed-signal IC> The signal circuit> NE556F

NE556F: DescriptionIC DUAL PULSE, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function; CategoryAnalog mixed-signal IC The signal circuit; File Size151KB，5 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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NE556F Overview

IC DUAL PULSE, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function

NE556F Parametric

Parameter Name	Attribute value
Maker	NXP
Parts packaging code	DIP
package instruction	DIP, DIP14,.3
Contacts	14
Reach Compliance Code	unknown
JESD-30 code	R-CDIP-T14
JESD-609 code	e0
Number of terminals	14
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5/15 V
Certification status	Not Qualified
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED

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NE556F Related Products

	NE556F	NE556-1N	RNN70C2803BPRJ8	SE556N	SE556F883C
Description	IC DUAL PULSE, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function	DUAL PULSE, 0.5MHz, TIMER, PDIP14, PLASTIC, DIP-14	Fixed Resistor, Metal Film, 0.5W, 280000ohm, 350V, 0.1% +/-Tol, 50ppm/Cel, Through Hole Mount, AXIAL LEADED	IC DUAL PULSE, TIMER, PDIP14, PLASTIC, DIP-14, Analog Waveform Generation Function	IC DUAL PULSE, TIMER, CDIP14, CERDIP-14, Analog Waveform Generation Function
package instruction	DIP, DIP14,.3	PLASTIC, DIP-14	AXIAL LEADED	PLASTIC, DIP-14	DIP,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
Number of terminals	14	14	2	14	14
Maximum operating temperature	70 °C	70 °C	175 °C	125 °C	125 °C
Package form	IN-LINE	IN-LINE	Axial	IN-LINE	IN-LINE
surface mount	NO	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	METAL FILM	BIPOLAR	BIPOLAR
Maker	NXP	NXP	-	-	NXP
Parts packaging code	DIP	DIP	-	DIP	DIP
Contacts	14	14	-	14	14
JESD-30 code	R-CDIP-T14	R-PDIP-T14	-	R-PDIP-T14	R-GDIP-T14
JESD-609 code	e0	-	e0	e0	-
Package body material	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	-	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	-	DIP	DIP
Encapsulate equivalent code	DIP14,.3	DIP8,.3	-	DIP14,.3	-
Package shape	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR
Certification status	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified
Temperature level	COMMERCIAL	COMMERCIAL	-	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	THROUGH-HOLE	THROUGH-HOLE	-	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	-	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	-	DUAL	DUAL
Analog Integrated Circuits - Other Types	-	PULSE	-	PULSE; RECTANGULAR	PULSE
Number of functions	-	2	-	2	2
Maximum supply voltage (Vsup)	-	16 V	-	18 V	18 V
Minimum supply voltage (Vsup)	-	4.5 V	-	4.5 V	4.5 V
Nominal supply voltage (Vsup)	-	5 V	-	5 V	5 V
ECCN code	-	-	EAR99	EAR99	EAR99

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