ISM330DLC datasheet, PDF - EEWORLD Datasheet

ISM330DLC: DescriptioniNEMO Inertial Measurement Unit (IMU): 3D accelerometer and 3D gyroscope with digital output for industrial applications; File Size3MB，116 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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ISM330DLC Overview

iNEMO Inertial Measurement Unit (IMU): 3D accelerometer and 3D gyroscope with digital output for industrial applications

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ISM330DLC

Datasheet

iNEMO inertial module: 3D accelerometer and 3D gyroscope with digital output

for industrial applications

Features

LGA-14L

(2.5 x 3.0 x 0.83 mm) typ.

•

Product status link

ISM330DLC

Product summary

Order code

Temperature range

[°C]

Package

Packing

ISM330DLCTR

-40 to +85

LGA-14L

(2.5 x 3.0 x 0.83 mm)

Tape and reel

3D accelerometer with selectable full scale: ±2/±4/±8/±16

3D gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps

Analog supply voltage: 1.71 V to 3.6 V

SPI & I²C serial interface with main processor data synchronization

Dedicated gyroscope output chain with low latency, low noise and dedicated

low-pass filters for control loop stability (OIS and other stabilization applications)

Auxiliary SPI serial interface for independent, low-noise low-latency data output

for gyroscope and accelerometer

Ultra-low power consumption for both accelerometer and gyroscope enabling

long-lasting battery-operated applications: 0.5 mA in combo normal mode and

0.75 mA in combo high-performance mode

Smart FIFO up to 4 kbyte

Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D

orientation, click and double-click

Sensor hub feature to efficiently collect data from additional external sensors

Embedded hard, soft ironing for external magnetic sensor corrections

Embedded temperature sensor

Embedded self-test both for gyroscope and accelerometer

High shock survivability

Extended operating temperature range (-40 °C to +85 °C)

ECOPACK

, RoHS and “Green” compliant

Applications

•

Industrial IoT and connected devices

Antennas, platforms, and optical image and lens stabilization

Robotics, drones and industrial automation

Navigation systems and telematics

Vibration monitoring and compensation

Description

The

ISM330DLC

is a system-in-package featuring a high-performance 3D digital

accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.

ST’s family of MEMS sensor modules leverages the robust and mature

manufacturing processes already used for the production of micromachined

accelerometers and gyroscopes.

The various sensing elements are manufactured using specialized micromachining

processes, while the IC interfaces are developed using CMOS technology that allows

the design of a dedicated circuit which is trimmed to better match the characteristics

of the sensing element.

In the ISM330DLC the sensing element of the accelerometer and of the gyro are

implemented on the same silicon die, thus guaranteeing superior stability and

robustness.

Product label

DS12171

Rev 3

November 2018

For further information contact your local STMicroelectronics sales office.

www.st.com

ISM330DLC

Overview

The ISM330DLC is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital

gyroscope tailored for Industry 4.0 applications.

The ISM330DLC has a full-scale acceleration range of ±2/±4/±8/±16 g, an angular rate range of

±125/±250/±500/±1000/±2000 dps and is capable of delivering highly accurate and reliable measurements at an

ultra-low power consumption (0.75 mA in high-performance, combo mode).

The ISM330DLC embeds smart features which simplify and optimize the application design and allows the usage

of complex motion-sensing information also in power-constrained applications

The event-detection interrupts enable efficient and reliable motion tracking and contextual awareness,

implementing hardware recognition of free-fall events, 6D orientation, click and double-click sensing, activity or

inactivity, and wakeup events.

Up to 4 kbyte of FIFO with dynamic allocation of significant data (i.e. external sensors, timestamp, etc.) allows

overall power saving of the system and protects against any loss of data.

With the sensor hub feature, data from up to 4 external sensors can be collected and stored in the internal FIFO

without intervention of the application microcontroller.

Moreover, the ISM330DLC offers specific support, both for the gyroscope and the accelerometer, to applications

requiring closed control loop. The device, through a dedicated auxiliary SPI interface and a configurable signal

processing path having low latency and low noise, can provide data for the control loop while, at the same time, a

second fully independent path can output data for other application intents.

Like the entire portfolio of MEMS sensor modules, the ISM330DLC leverages the robust and mature in-house

manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The

various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces

are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better

match the characteristics of the sensing element.

In the ISM330DLC, the sensing element of the accelerometer and of the gyroscope are implemented on the same

silicon die, thus guaranteeing superior stability and robustness.

The ISM330DLC is available in a small plastic land grid array (LGA) package of 2.5 x 3.0 x 0.83 mm.

DS12171

Rev 3

page 3/116

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