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STEVAL-MKI182V1

Description
ISM330DLC ADAPTER BOARD STANDARD
CategoryDevelopment board/suite/development tools   
File Size3MB,116 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance
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STEVAL-MKI182V1 Overview

ISM330DLC ADAPTER BOARD STANDARD

STEVAL-MKI182V1 Parametric

Parameter NameAttribute value
sensor typeAccelerometer, gyroscope, 3-axis
Sensing range±2g, 4g, 8g, 16g, ±125°/sec, ±250°/sec, ±500°/sec, ±1000°/sec, ±2000°/sec
interfaceI²C,SPI
Sensitivity-
Voltage - Power1.71 V ~ 3.6 V
Embeddedno
What's includedplate
IC/parts usedISM330DLC
ISM330DLC
Datasheet
iNEMO inertial module: 3D accelerometer and 3D gyroscope with digital output
for industrial applications
Features
LGA-14L
(2.5 x 3.0 x 0.83 mm) typ.
Product status link
ISM330DLC
Product summary
Order code
Temperature range
[°C]
Package
Packing
ISM330DLCTR
-40 to +85
LGA-14L
(2.5 x 3.0 x 0.83 mm)
Tape and reel
3D accelerometer with selectable full scale: ±2/±4/±8/±16
g
3D gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps
Analog supply voltage: 1.71 V to 3.6 V
SPI & I²C serial interface with main processor data synchronization
Dedicated gyroscope output chain with low latency, low noise and dedicated
low-pass filters for control loop stability (OIS and other stabilization applications)
Auxiliary SPI serial interface for independent, low-noise low-latency data output
for gyroscope and accelerometer
Ultra-low power consumption for both accelerometer and gyroscope enabling
long-lasting battery-operated applications: 0.5 mA in combo normal mode and
0.75 mA in combo high-performance mode
Smart FIFO up to 4 kbyte
Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D
orientation, click and double-click
Sensor hub feature to efficiently collect data from additional external sensors
Embedded hard, soft ironing for external magnetic sensor corrections
Embedded temperature sensor
Embedded self-test both for gyroscope and accelerometer
High shock survivability
Extended operating temperature range (-40 °C to +85 °C)
ECOPACK
®
, RoHS and “Green” compliant
Applications
Industrial IoT and connected devices
Antennas, platforms, and optical image and lens stabilization
Robotics, drones and industrial automation
Navigation systems and telematics
Vibration monitoring and compensation
Description
The
ISM330DLC
is a system-in-package featuring a high-performance 3D digital
accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.
ST’s family of MEMS sensor modules leverages the robust and mature
manufacturing processes already used for the production of micromachined
accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining
processes, while the IC interfaces are developed using CMOS technology that allows
the design of a dedicated circuit which is trimmed to better match the characteristics
of the sensing element.
In the ISM330DLC the sensing element of the accelerometer and of the gyro are
implemented on the same silicon die, thus guaranteeing superior stability and
robustness.
Product label
DS12171
-
Rev 3
-
November 2018
For further information contact your local STMicroelectronics sales office.
www.st.com

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