M24C32-WMB3GP datasheet, PDF - EEWORLD Datasheet

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M24C32-WMB3GP: Description4KX8 I2C/2-WIRE SERIAL EEPROM, DSO8, 2 X 3 MM, ROHS COMPLIANT, MLP-8; Categorystorage storage; File Size329KB，39 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M24C32-WMB3GP Overview

4KX8 I2C/2-WIRE SERIAL EEPROM, DSO8, 2 X 3 MM, ROHS COMPLIANT, MLP-8

M24C32-WMB3GP Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	SOIC
package instruction	2 X 3 MM, ROHS COMPLIANT, MLP-8
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Is Samacsys	N
Maximum clock frequency (fCLK)	0.4 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDDR
JESD-30 code	R-XDSO-N8
length	3 mm
memory density	32768 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	4096 words
character code	4000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
organize	4KX8
Package body material	UNSPECIFIED
encapsulated code	VSON
Encapsulate equivalent code	SOLCC8,.11,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, VERY THIN PROFILE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/5 V
Certification status	Not Qualified
Filter level	AEC-Q100
Maximum seat height	0.6 mm
Serial bus type	I2C
Maximum standby current	0.00001 A
Maximum slew rate	0.005 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	2.5 V
Nominal supply voltage (Vsup)	2.7 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	2 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE
Base Number Matches	1

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M24128

M24C64 M24C32

128 Kbit, 64 Kbit and 32 Kbit serial I²C bus EEPROM

Features

■

Supports the I

C bus 100 kHz Standard-mode

and 400 kHz Fast-mode

Single supply voltages (see

Table 1

for root

part numbers):

– 2.5 V to 5.5 V

– 1.8 V to 5.5 V

– 1.7 V to 5.5 V

Write Control input

Byte and Page Write

Random and Sequential Read modes

Self-timed programming cycle

Automatic address incrementing

Enhanced ESD/latch-up protection

More than 1 Million write cycles

More than 40-year data retention

Packages

– ECOPACK

(RoHS compliant)

Device summary

Part number

M24128-BW

Supply voltage

2.5 V to 5.5V

1.8 V to 5.5V

1.7 V to 5.5V

2.5 V to 5.5V

1.8 V to 5.5V

1.7 V to 5.5V

2.5 V to 5.5V

1.8 V to 5.5V

1.7 V to 5.5V

WLCSP (CS)

PDIP8 (BN)

■

SO8 (MN)

150 mil width

Table 1.

Reference

TSSOP8 (DW)

169 mil width

M24128

M24128-BR

M24128-BF

M24C64-W

UFDFPN8 (MB)

2 × 3 mm (MLP)

M24C64

M24C64-R

M24C64-F

M24C32-W

M24C32

M24C32-R

M24C32-F

January 2009

Rev 16

1/39

www.st.com

Contents

M24128, M24C64, M24C32

Contents

Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1

2.2

2.3

2.4

2.5

2.6

Serial Clock (SCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Serial Data (SDA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Chip Enable (E0, E1, E2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Write Control (WC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Supply voltage (V

) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

2.6.1

2.6.2

2.6.3

2.6.4

Operating supply voltage V

CC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

4.9

4.10

4.11

4.12

4.13

4.14

4.15

Start condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Stop condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Acknowledge bit (ACK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Data Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Memory addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Write operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

ECC (error correction code) and write cycling . . . . . . . . . . . . . . . . . . . . . 17

Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . . 18

Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Acknowledge in Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

2/39

List of tables

M24128, M24C64, M24C32

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Address most significant byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Address least significant byte . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Operating conditions (M24xxx-W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Operating conditions (M24xxx-R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Operating conditions (M24xxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

AC test measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Input parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

DC characteristics (M24xxx-W, device grade 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

DC characteristics (M24xxx-W, device grade 3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

DC characteristics (M24xxx-R - device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

DC characteristics (M24xxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

AC characteristics (M24xxx-W6, M24xxW3, M24xxR6) . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

AC characteristics (M24xxx-F) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data. . . . . . . . . . . . 29

SO8 narrow – 8 lead plastic small outline, 150 mils body width,

package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

TSSOP8 – 8 lead thin shrink small outline, package mechanical data. . . . . . . . . . . . . . . . 31

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

M24128 WLCSP, 0.5 mm pitch, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . 33

Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Available M24C32 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35

Available M24C64 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35

Available M24128 products (package, voltage range, temperature grade) . . . . . . . . . . . . 35

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

4/39

M24128, M24C64, M24C32

List of figures

Figure 1.

Figure 2.

Figure 3.

Figure 4.

Figure 5.

Figure 6.

Figure 7.

Figure 8.

Figure 9.

Figure 10.

Figure 11.

Figure 12.

Figure 13.

Figure 14.

Figure 15.

Figure 16.

Figure 17.

Figure 18.

Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

DIP, SO, TSSOP and UFDFPN connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

M24128 WLCSP connections (top view, marking side, with balls on the

underside) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Maximum R

value versus bus parasitic capacitance (C) for an I

C bus . . . . . . . . . . . . . . 10

C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Write mode sequences with WC = 1 (data write inhibited) . . . . . . . . . . . . . . . . . . . . . . . . . 15

Write mode sequences with WC = 0 (data write enabled) . . . . . . . . . . . . . . . . . . . . . . . . . 17

Write cycle polling flowchart using ACK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Read mode sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

AC test measurement I/O waveform. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline . . . . . . . . . . . . . . . . . . . 29

SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline . . . . . . . 30

TSSOP8 – 8 lead thin shrink small outline, package outline . . . . . . . . . . . . . . . . . . . . . . . 31

UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

M24128 WLCSP, 0.5 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

5/39

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