MX29LV320DTTI-70G datasheet, PDF

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MX29LV320DTTI-70G: DescriptionFlash, 2MX16, 70ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142, TSOP1-48; Categorystorage storage; File Size2MB，68 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx; Environmental Compliance

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MX29LV320DTTI-70G Overview

Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142, TSOP1-48

MX29LV320DTTI-70G Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Macronix
Parts packaging code	TSOP1
package instruction	12 X 20 MM, ROHS COMPLIANT, MO-142, TSOP1-48
Contacts	48
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
Is Samacsys	N
Maximum access time	70 ns
Spare memory width	8
startup block	TOP
command user interface	YES
Universal Flash Interface	YES
Data polling	YES
JESD-30 code	R-PDSO-G48
JESD-609 code	e3
length	18.4 mm
memory density	33554432 bit
Memory IC Type	FLASH
memory width	16
Number of functions	1
Number of departments/size	8,63
Number of terminals	48
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP48,.8,20
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3/3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	8K,64K
Maximum standby current	0.000015 A
Maximum slew rate	0.03 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
switch bit	YES
type	NOR TYPE
width	12 mm
Base Number Matches	1

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MX29LV320D T/B

DATASHEET

P/N:PM1281

REV. 1.2, OCT. 02, 2009

MX29LV320D T/B

Contents

FEATURES ............................................................................................................................................................. 5

GENERAL DESCRIPTION ..................................................................................................................................... 6

PIN CONFIGURATION ........................................................................................................................................... 7

PIN DESCRIPTION ................................................................................................................................................. 8

BLOCK DIAGRAM.................................................................................................................................................. 9

BLOCK DIAGRAM DESCRIPTION ...................................................................................................................... 10

BLOCK STRUCTURE........................................................................................................................................... 11

Table 1.a: MX29LV320DT SECTOR GROUP ARCHITECTURE ................................................................ 11

Table 1.b: MX29LV320DB SECTOR GROUP ARCHITECTURE ............................................................... 13

BUS OPERATION ................................................................................................................................................. 15

Table 2-1. BUS OPERATION ...................................................................................................................... 15

Table 2-2. BUS OPERATION ...................................................................................................................... 16

FUNCTIONAL OPERATION DESCRIPTION ....................................................................................................... 17

READ OPERATION .................................................................................................................................... 17

WRITE OPERATION ................................................................................................................................... 17

DEVICE RESET .......................................................................................................................................... 17

STANDBY MODE ........................................................................................................................................ 17

OUTPUT DISABLE ..................................................................................................................................... 17

BYTE/WORD SELECTION ......................................................................................................................... 18

HARDWARE WRITE PROTECT ................................................................................................................. 18

ACCELERATED PROGRAMMING OPERATION ...................................................................................... 18

TEMPORARY SECTOR GROUP UNPROTECT OPERATION ................................................................. 18

SECTOR GROUP PROTECT OPERATION ............................................................................................... 18

CHIP UNPROTECT OPERATION............................................................................................................... 19

AUTOMATIC SELECT BUS OPERATIONS ................................................................................................ 19

SECTOR LOCK STATUS VERIFICATION .................................................................................................. 19

READ SILICON ID MANUFACTURER CODE ............................................................................................ 19

READ SILICON ID MX29LV320DT CODE .................................................................................................. 19

READ SILICON ID MX29LV320DB CODE ................................................................................................. 19

READ INDICATOR BIT (Q7) FOR SECURITY SECTOR ........................................................................... 20

INHERENT DATA PROTECTION................................................................................................................ 20

COMMAND COMPLETION......................................................................................................................... 20

LOW VCC WRITE INHIBIT ......................................................................................................................... 20

WRITE PULSE "GLITCH" PROTECTION................................................................................................... 20

LOGICAL INHIBIT ....................................................................................................................................... 20

POWER-UP SEQUENCE ........................................................................................................................... 20

POWER-UP WRITE INHIBIT ...................................................................................................................... 21

POWER SUPPLY DECOUPLING ............................................................................................................... 21

P/N:PM1281

REV. 1.2, OCT. 02, 2009

MX29LV320D T/B

COMMAND OPERATIONS ................................................................................................................................... 22

TABLE 3. MX29LV320D T/B COMMAND DEFINITIONS ............................................................................ 22

AUTOMATIC PROGRAMMING OF THE MEMORY ARRAY ...................................................................... 23

SECTOR ERASE ........................................................................................................................................ 24

CHIP ERASE.............................................................................................................................................. 25

SECTOR ERASE SUSPEND ...................................................................................................................... 25

SECTOR ERASE RESUME ........................................................................................................................ 26

AUTOMATIC SELECT OPERATIONS ........................................................................................................ 26

AUTOMATIC SELECT COMMAND SEQUENCE ....................................................................................... 26

READ MANUFACTURER ID OR DEVICE ID ............................................................................................. 27

SECURITY SECTOR LOCK STATUS ......................................................................................................... 27

VERIFY SECTOR GROUP PROTECTION ................................................................................................. 27

SECURITY SECTOR FLASH MEMORY REGION ..................................................................................... 27

FACTORY LOCKED: SECURITY SECTOR PROGRAMMED AND PROTECTED AT THE FACTORY .... 27

FACTORY LOCKED: SECURITY SECTOR PROGRAMMED AND PROTECTED AT THE FACTORY .... 28

CUSTOMER LOCKABLE: SECURITY SECTOR NOT PROGRAMMED OR PROTECTED AT THE

FACTORY.................................................................................................................................................... 28

ENTER AND EXIT SECURITY SECTOR .................................................................................................... 28

RESET OPERATION .................................................................................................................................. 29

COMMON FLASH MEMORY INTERFACE (CFI) MODE ..................................................................................... 30

QUERY COMMAND AND COMMAND FLASH MEMORY INTERFACE (CFI) MODE ............................... 30

Table 4-1. CFI mode: Identification Data Values

......................................................................................... 30

Table 4-2. CFI Mode: System Interface Data Values

.................................................................................. 30

Table 4-3. CFI Mode: Device Geometry Data Values

.................................................................................. 31

Table 4-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values

............................................ 32

ELECTRICAL CHARACTERISTICS .................................................................................................................... 33

ABSOLUTE MAXIMUM STRESS RATINGS............................................................................................... 33

OPERATING TEMPERATURE AND VOLTAGE .......................................................................................... 33

DC CHARACTERISTICS ............................................................................................................................ 34

SWITCHING TEST CIRCUIT ...................................................................................................................... 35

SWITCHING TEST WAVEFORM ............................................................................................................... 35

AC CHARACTERISTICS ............................................................................................................................ 36

WRITE COMMAND OPERATION......................................................................................................................... 37

Figure 1. COMMAND WRITE OPERATION

................................................................................................ 37

READ/RESET OPERATION ................................................................................................................................. 38

Figure 2. READ TIMING WAVEFORM

........................................................................................................ 38

Figure 3. RESET# TIMING WAVEFORM

................................................................................................... 39

ERASE/PROGRAM OPERATION ........................................................................................................................ 40

Figure 4. AUTOMATIC CHIP ERASE TIMING WAVEFORM

...................................................................... 40

Figure 5. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART

............................................................ 41

Figure 6. AUTOMATIC SECTOR ERASE TIMING WAVEFORM

................................................................ 42

Figure 7. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART

.................................................... 43

P/N:PM1281

REV. 1.2, OCT. 02, 2009

MX29LV320D T/B

Figure 8. ERASE SUSPEND/RESUME FLOWCHART

.............................................................................. 44

Figure 9. AUTOMATIC PROGRAM TIMING WAVEFORM

.......................................................................... 45

Figure 10. ACCELERATED PROGRAM TIMING DIAGRAM

..................................................................... 45

Figure 11. CE# CONTROLLED WRITE TIMING WAVEFORM

................................................................... 46

Figure 12. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART

.................................................... 47

SECTOR GROUP PROTECT/CHIP UNPROTECT .............................................................................................. 48

Figure 13. SECTOR GROUP PROTECT/CHIP UNPROTECT WAVEFORM (RESET# Control)

............... 48

Figure 14. IN-SYSTEM SECTOR GROUP PROTECT WITH RESET#=Vhv

.............................................. 49

Figure 15. CHIP UNPROTECT ALGORITHM WITH RESET#=Vhv

............................................................ 50

Table 5. TEMPORARY SECTOR GROUP UNPROTECT ........................................................................... 51

Figure 16. TEMPORARY SECTOR GROUP UNPROTECT WAVEFORM

................................................. 51

Figure 17. TEMPORARY SECTOR GROUP UNPROTECT FLOWCHART

............................................... 52

Figure 18. SILICON ID READ TIMING WAVEFORM

.................................................................................. 53

WRITE OPERATION STATUS .............................................................................................................................. 54

Figure 19. DATA# POLLING TIMING WAVEFORM (DURING AUTOMATIC ALGORITHM)

....................... 54

Figure 20. DATA# POLLING ALGORITHM

................................................................................................. 55

Figure 21. TOGGLE BIT TIMING WAVEFORM (DURING AUTOMATIC ALGORITHM)

............................ 56

Figure 22. TOGGLE BIT ALGORITHM........................................................................................................

Figure 23. BYTE# TIMING WAVEFORM FOR READ OPERATIONS (BYTE# switching from byte mode to

word mode)

................................................................................................................................................. 58

RECOMMENDED OPERATING CONDITIONS .................................................................................................... 59

ERASE AND PROGRAMMING PERFORMANCE ............................................................................................... 60

DATA RETENTION ............................................................................................................................................... 60

LATCH-UP CHARACTERISTICS ......................................................................................................................... 60

TSOP PIN CAPACITANCE ................................................................................................................................... 60

ORDERING INFORMATION ................................................................................................................................. 61

PART NAME DESCRIPTION ................................................................................................................................ 62

PACKAGE INFORMATION ................................................................................................................................... 63

REVISION HISTORY ............................................................................................................................................ 67

P/N:PM1281

REV. 1.2, OCT. 02, 2009

MX29LV320DTTI-70G Related Products

	MX29LV320DTTI-70G	MX29LV320DBXBI-70G	MX29LV320DTMC-70G	MX29LV320DTXBI-70G	MX29LV320DBTI-70G	MX29LV320DBMC-70G	MX29LV320DBXEI-70G
Description	Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142, TSOP1-48	Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-210, TFBGA-48	Flash, 2MX16, 70ns, PDSO44, 0.500 INCH, ROHS COMPLIANT, MO-175, SOP-44	Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-210, TFBGA-48	Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, ROHS COMPLIANT, MO-142, TSOP1-48	Flash, 2MX16, 70ns, PDSO44, 0.500 INCH, ROHS COMPLIANT, MO-175, SOP-44	Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MO-219, LFBGA-48
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Macronix	Macronix	Macronix	Macronix	Macronix	Macronix	Macronix
Parts packaging code	TSOP1	BGA	SOIC	BGA	TSOP1	SOIC	BGA
package instruction	12 X 20 MM, ROHS COMPLIANT, MO-142, TSOP1-48	TFBGA, BGA48,6X8,32	SOP, SOP44,.63	TFBGA, BGA48,6X8,32	TSSOP, TSSOP48,.8,20	SOP, SOP44,.63	LFBGA, BGA48,6X8,32
Contacts	48	48	44	48	48	44	48
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
Maximum access time	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns	70 ns
Spare memory width	8	8	8	8	8	8	8
startup block	TOP	BOTTOM	TOP	TOP	BOTTOM	BOTTOM	BOTTOM
command user interface	YES	YES	YES	YES	YES	YES	YES
Universal Flash Interface	YES	YES	YES	YES	YES	YES	YES
Data polling	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	R-PDSO-G48	R-PBGA-B48	R-PDSO-G44	R-PBGA-B48	R-PDSO-G48	R-PDSO-G44	R-PBGA-B48
length	18.4 mm	8 mm	28.5 mm	8 mm	18.4 mm	28.5 mm	8 mm
memory density	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit	33554432 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1
Number of departments/size	8,63	8,63	8,63	8,63	8,63	8,63	8,63
Number of terminals	48	48	44	48	48	44	48
word count	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words
character code	2000000	2000000	2000000	2000000	2000000	2000000	2000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	70 °C	85 °C	85 °C	70 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-40 °C	-40 °C	-	-40 °C
organize	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	TFBGA	SOP	TFBGA	TSSOP	SOP	LFBGA
Encapsulate equivalent code	TSSOP48,.8,20	BGA48,6X8,32	SOP44,.63	BGA48,6X8,32	TSSOP48,.8,20	SOP44,.63	BGA48,6X8,32
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE	GRID ARRAY, THIN PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE	GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V	3/3.3 V
Programming voltage	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
ready/busy	YES	YES	YES	YES	YES	YES	YES
Maximum seat height	1.2 mm	1.2 mm	3 mm	1.2 mm	1.2 mm	3 mm	1.3 mm
Department size	8K,64K	8K,64K	8K,64K	8K,64K	8K,64K	8K,64K	8K,64K
Maximum standby current	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A	0.000015 A
Maximum slew rate	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA	0.03 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
Terminal form	GULL WING	BALL	GULL WING	BALL	GULL WING	GULL WING	BALL
Terminal pitch	0.5 mm	0.8 mm	1.27 mm	0.8 mm	0.5 mm	1.27 mm	0.8 mm
Terminal location	DUAL	BOTTOM	DUAL	BOTTOM	DUAL	DUAL	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
switch bit	YES	YES	YES	YES	YES	YES	YES
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	12 mm	6 mm	12.6 mm	6 mm	12 mm	12.6 mm	6 mm

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