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54ACT2708DMQR

Description
54ACT2708DMQR
Categorystorage    storage   
File Size926KB,20 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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54ACT2708DMQR Overview

54ACT2708DMQR

54ACT2708DMQR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP28,.6
Reach Compliance Codeunknown
Is SamacsysN
JESD-30 codeR-XDIP-T28
JESD-609 codee0
Memory IC TypeOTHER FIFO
memory width9
Number of terminals28
word count64 words
character code64
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize64X9
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
power supply5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Base Number Matches1

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Description 54ACT2708DMQR 54AC2708LMQR 74AC2708FCQR 54ACT2708FMQR 74AC2708SCQR 54ACT2708LMQR 74AC2708LCQR 54AC2708FMQR 54AC2708DMQR
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction DIP, DIP28,.6 QCCN, LCC28,.45SQ DFP, FL28,.4 DFP, FL28,.4 SOP, SOP28,.4 QCCN, LCC28,.45SQ QCCN, LCC28,.45SQ DFP, FL28,.4 DIP, DIP28,.6
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code R-XDIP-T28 S-XQCC-N28 R-XDFP-F28 R-XDFP-F28 R-PDSO-G28 S-XQCC-N28 S-XQCC-N28 R-XDFP-F28 R-XDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 9 9 9 9 9 9 9 9 9
Number of terminals 28 28 28 28 28 28 28 28 28
word count 64 words 64 words 64 words 64 words 64 words 64 words 64 words 64 words 64 words
character code 64 64 64 64 64 64 64 64 64
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 85 °C 125 °C 85 °C 125 °C 85 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -40 °C -55 °C -40 °C -55 °C -40 °C -55 °C -55 °C
organize 64X9 64X9 64X9 64X9 64X9 64X9 64X9 64X9 64X9
Package body material CERAMIC CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC CERAMIC
encapsulated code DIP QCCN DFP DFP SOP QCCN QCCN DFP DIP
Encapsulate equivalent code DIP28,.6 LCC28,.45SQ FL28,.4 FL28,.4 SOP28,.4 LCC28,.45SQ LCC28,.45SQ FL28,.4 DIP28,.6
Package shape RECTANGULAR SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR
Package form IN-LINE CHIP CARRIER FLATPACK FLATPACK SMALL OUTLINE CHIP CARRIER CHIP CARRIER FLATPACK IN-LINE
power supply 5 V 3.3/5 V 3.3/5 V 5 V 3.3/5 V 5 V 3.3/5 V 3.3/5 V 3.3/5 V
surface mount NO YES YES YES YES YES YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY INDUSTRIAL MILITARY INDUSTRIAL MILITARY INDUSTRIAL MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE NO LEAD FLAT FLAT GULL WING NO LEAD NO LEAD FLAT THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location DUAL QUAD DUAL DUAL DUAL QUAD QUAD DUAL DUAL
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments - Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Base Number Matches 1 1 1 1 1 - - - -
Maximum clock frequency (fCLK) - 20 MHz 30 MHz - 30 MHz - 30 MHz 20 MHz 20 MHz
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