54ACT2708FMQR datasheet, PDF - EEWORLD Datasheet

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54ACT2708FMQR: Description54ACT2708FMQR; Categorystorage storage; File Size926KB，20 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54ACT2708FMQR Overview

54ACT2708FMQR

54ACT2708FMQR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DFP, FL28,.4
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F28
JESD-609 code	e0
Memory IC Type	OTHER FIFO
memory width	9
Number of terminals	28
word count	64 words
character code	64
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64X9
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL28,.4
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

54ACT2708FMQR Related Products

	54ACT2708FMQR	54AC2708LMQR	74AC2708FCQR	54ACT2708DMQR	74AC2708SCQR	54ACT2708LMQR	74AC2708LCQR	54AC2708FMQR	54AC2708DMQR
Description	54ACT2708FMQR	54AC2708LMQR	74AC2708FCQR	54ACT2708DMQR	74AC2708SCQR	54ACT2708LMQR	74AC2708LCQR	54AC2708FMQR	54AC2708DMQR
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DFP, FL28,.4	QCCN, LCC28,.45SQ	DFP, FL28,.4	DIP, DIP28,.6	SOP, SOP28,.4	QCCN, LCC28,.45SQ	QCCN, LCC28,.45SQ	DFP, FL28,.4	DIP, DIP28,.6
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDFP-F28	S-XQCC-N28	R-XDFP-F28	R-XDIP-T28	R-PDSO-G28	S-XQCC-N28	S-XQCC-N28	R-XDFP-F28	R-XDIP-T28
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
Memory IC Type	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO	OTHER FIFO
memory width	9	9	9	9	9	9	9	9	9
Number of terminals	28	28	28	28	28	28	28	28	28
word count	64 words	64 words	64 words	64 words	64 words	64 words	64 words	64 words	64 words
character code	64	64	64	64	64	64	64	64	64
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	85 °C	125 °C	85 °C	125 °C	85 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-40 °C	-55 °C	-40 °C	-55 °C	-40 °C	-55 °C	-55 °C
organize	64X9	64X9	64X9	64X9	64X9	64X9	64X9	64X9	64X9
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	QCCN	DFP	DIP	SOP	QCCN	QCCN	DFP	DIP
Encapsulate equivalent code	FL28,.4	LCC28,.45SQ	FL28,.4	DIP28,.6	SOP28,.4	LCC28,.45SQ	LCC28,.45SQ	FL28,.4	DIP28,.6
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	FLATPACK	IN-LINE	SMALL OUTLINE	CHIP CARRIER	CHIP CARRIER	FLATPACK	IN-LINE
power supply	5 V	3.3/5 V	3.3/5 V	5 V	3.3/5 V	5 V	3.3/5 V	3.3/5 V	3.3/5 V
surface mount	YES	YES	YES	NO	YES	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY	INDUSTRIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	NO LEAD	FLAT	THROUGH-HOLE	GULL WING	NO LEAD	NO LEAD	FLAT	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	QUAD	QUAD	DUAL	DUAL
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments	-	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
Base Number Matches	1	1	1	1	1	-	-	-	-
Maximum clock frequency (fCLK)	-	20 MHz	30 MHz	-	30 MHz	-	30 MHz	20 MHz	20 MHz

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