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54ACT2708LMQR

Description
54ACT2708LMQR
Categorystorage    storage   
File Size926KB,20 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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54ACT2708LMQR Overview

54ACT2708LMQR

54ACT2708LMQR Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionQCCN, LCC28,.45SQ
Reach Compliance Codeunknown
JESD-30 codeS-XQCC-N28
JESD-609 codee0
Memory IC TypeOTHER FIFO
memory width9
Number of terminals28
word count64 words
character code64
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize64X9
Package body materialCERAMIC
encapsulated codeQCCN
Encapsulate equivalent codeLCC28,.45SQ
Package shapeSQUARE
Package formCHIP CARRIER
power supply5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD

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Description 54ACT2708LMQR 54AC2708LMQR 74AC2708FCQR 54ACT2708DMQR 54ACT2708FMQR 74AC2708SCQR 74AC2708LCQR 54AC2708FMQR 54AC2708DMQR
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
package instruction QCCN, LCC28,.45SQ QCCN, LCC28,.45SQ DFP, FL28,.4 DIP, DIP28,.6 DFP, FL28,.4 SOP, SOP28,.4 QCCN, LCC28,.45SQ DFP, FL28,.4 DIP, DIP28,.6
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
JESD-30 code S-XQCC-N28 S-XQCC-N28 R-XDFP-F28 R-XDIP-T28 R-XDFP-F28 R-PDSO-G28 S-XQCC-N28 R-XDFP-F28 R-XDIP-T28
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
Memory IC Type OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
memory width 9 9 9 9 9 9 9 9 9
Number of terminals 28 28 28 28 28 28 28 28 28
word count 64 words 64 words 64 words 64 words 64 words 64 words 64 words 64 words 64 words
character code 64 64 64 64 64 64 64 64 64
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 85 °C 125 °C 125 °C 85 °C 85 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -40 °C -55 °C -55 °C -40 °C -40 °C -55 °C -55 °C
organize 64X9 64X9 64X9 64X9 64X9 64X9 64X9 64X9 64X9
Package body material CERAMIC CERAMIC CERAMIC CERAMIC CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC CERAMIC
encapsulated code QCCN QCCN DFP DIP DFP SOP QCCN DFP DIP
Encapsulate equivalent code LCC28,.45SQ LCC28,.45SQ FL28,.4 DIP28,.6 FL28,.4 SOP28,.4 LCC28,.45SQ FL28,.4 DIP28,.6
Package shape SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
Package form CHIP CARRIER CHIP CARRIER FLATPACK IN-LINE FLATPACK SMALL OUTLINE CHIP CARRIER FLATPACK IN-LINE
power supply 5 V 3.3/5 V 3.3/5 V 5 V 5 V 3.3/5 V 3.3/5 V 3.3/5 V 3.3/5 V
surface mount YES YES YES NO YES YES YES YES NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY INDUSTRIAL MILITARY MILITARY INDUSTRIAL INDUSTRIAL MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form NO LEAD NO LEAD FLAT THROUGH-HOLE FLAT GULL WING NO LEAD FLAT THROUGH-HOLE
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm
Terminal location QUAD QUAD DUAL DUAL DUAL DUAL QUAD DUAL DUAL
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments - Texas Instruments Texas Instruments Texas Instruments
Maximum clock frequency (fCLK) - 20 MHz 30 MHz - - 30 MHz 30 MHz 20 MHz 20 MHz
Base Number Matches - 1 1 1 1 1 - - -
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