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K7N163601A-FI20

Description
ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165
Categorystorage    storage   
File Size622KB,28 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Download Datasheet Parametric View All

K7N163601A-FI20 Overview

ZBT SRAM, 512KX36, 3.2ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165

K7N163601A-FI20 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeBGA
package instruction13 X 15 MM, 1 MM PITCH, FBGA-165
Contacts165
Reach Compliance Codeunknown
ECCN code3A991.B.2.A
Is SamacsysN
Maximum access time3.2 ns
Other featuresPIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)200 MHz
I/O typeCOMMON
JESD-30 codeR-PBGA-B165
JESD-609 codee0
length15 mm
memory density18874368 bit
Memory IC TypeZBT SRAM
memory width36
Number of functions1
Number of terminals165
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX36
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Encapsulate equivalent codeBGA165,11X15,40
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply2.5/3.3,3.3 V
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum standby current0.06 A
Minimum standby current3.14 V
Maximum slew rate0.4 mA
Maximum supply voltage (Vsup)3.465 V
Minimum supply voltage (Vsup)3.135 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
Base Number Matches1
K7N163601A
K7N163201A
K7N161801A
Document Title
512Kx36/32 & 1Mx18 Pipelined NtRAM
TM
512Kx36/32 & 1Mx18-Bit Pipelined NtRAM
TM
Revision History
Rev. No.
0.0
0.1
0.2
0.3
History
1. Initial document.
1. Add JTAG Scan Order
1. Add x32 org and industrial temperature .
2. Add 165FBGA package
1. Speed bin merge.
From K7N1636(32/18)09A to K7N1636(32/18)01A.
2. AC parameter change.
tOH(min)/tLZC(min) from 0.8 to 1.5 at -25
tOH(min)/tLZC(min) from 1.0 to 1.5 at -22
tOH(min)/tLZC(min) from 1.0 to 1.5 at -20
Final spec release.
Release Icc on page 14.
part #
-25
-22
-20
-16
-13
From
440
400
370
340
280
To
470
430
400
350
290
Draft Date
Remark
March. 21. 2001 Preliminary
May. 10. 2001 Preliminary
Aug. 30. 2001 Preliminary
Dec.
26. 2001 Preliminary
1.0
2.0
May. 10 .2002
May. 22. 2002
Final
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
-1-
May 2002
Rev 2.0
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