SPST,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | , |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| Analog Integrated Circuits - Other Types | SPST |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Base Number Matches | 1 |
| IH5341MJD/GH9 | IH5352CWE+ | IH5352CWE+T | IH5352EWE+T | IH5341ITW-T | IH5341MJD/HR | IH5341MJD/883 | IH5352CPE-2 | IH5352MJE/883 | IH5352MJE/HR | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | SPST, | IC video SW quad RF N/O 16-soic | IC video SW quad RF N/O 16-soic | IC video SW quad RF N/O 16-soic | SPST, 2 Func, 1 Channel, CMOS, MBCY10, METAL CAN, TO-100, 10 PIN | Multiplexers/Switches, 2 Func, CMOS, CDIP14 | Multiplexers/Switches, 2 Func, CMOS, CDIP14 | Multiplexers/Switches, 4 Func, CMOS, PDIP16 | Multiplexers/Switches, 4 Func, CMOS, CDIP16 | Multiplexers/Switches, 4 Func, CMOS, CDIP16 |
| Is it Rohs certified? | incompatible | conform to | conform to | conform to | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | 260 | 260 | 260 | NOT SPECIFIED | 240 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 240 |
| Maximum time at peak reflow temperature | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | 20 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 20 |
| package instruction | , | LEAD FREE, SOIC-16 | LEAD FREE, SOIC-16 | SOP, SOP16,.4 | TO-100, | - | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
| Is it lead-free? | - | Lead free | Lead free | - | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Maker | - | Maxim | Maxim | Maxim | Maxim | - | - | Maxim | Maxim | Maxim |
| JESD-30 code | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | O-MBCY-W10 | R-XDIP-T14 | R-XDIP-T14 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
| JESD-609 code | - | e3 | e3 | e3 | e0 | e0 | e0 | e0 | e0 | e0 |
| Humidity sensitivity level | - | 1 | 1 | 1 | - | 1 | - | 1 | - | 1 |
| normal position | - | NO | NO | NO | - | NO | NO | NO | NO | NO |
| Number of functions | - | 4 | 4 | 4 | 2 | 2 | 2 | 4 | 4 | 4 |
| Number of terminals | - | 16 | 16 | 16 | 10 | 14 | 14 | 16 | 16 | 16 |
| Maximum on-state resistance (Ron) | - | 300 Ω | 300 Ω | 300 Ω | 350 Ω | 350 Ω | 350 Ω | 350 Ω | 350 Ω | 350 Ω |
| Maximum operating temperature | - | 70 °C | 70 °C | 85 °C | 85 °C | 125 °C | 125 °C | 70 °C | 125 °C | 125 °C |
| Minimum operating temperature | - | - | - | -40 °C | -25 °C | -55 °C | -55 °C | - | -55 °C | -55 °C |
| output | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | - | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT | SEPARATE OUTPUT |
| Package body material | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | METAL | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| encapsulated code | - | SOP | SOP | SOP | TO-100 | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | - | SOP16,.4 | SOP16,.4 | SOP16,.4 | - | DIP14,.3 | DIP14,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | ROUND | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | CYLINDRICAL | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | - | 5,+-15 V | 5,+-15 V | 5,+-15 V | - | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V | 5,+-15 V |
| Certification status | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| surface mount | - | YES | YES | YES | NO | NO | NO | NO | NO | NO |
| Maximum connection time | - | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns | 300 ns |
| switch | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | - | COMMERCIAL | COMMERCIAL | INDUSTRIAL | OTHER | MILITARY | MILITARY | COMMERCIAL | MILITARY | MILITARY |
| Terminal surface | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | GULL WING | GULL WING | GULL WING | WIRE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | - | 1.27 mm | 1.27 mm | 1.27 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | - | DUAL | DUAL | DUAL | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL |
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