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Datasheet> All Categories > Analog mixed-signal IC> The signal circuit> IH5341MJD/883
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IH5341MJD/883

Description
Multiplexers/Switches, 2 Func, CMOS, CDIP14
CategoryAnalog mixed-signal IC    The signal circuit   
File Size231KB，4 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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IH5341MJD/883 Overview

Multiplexers/Switches, 2 Func, CMOS, CDIP14

IH5341MJD/883 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Reach Compliance Codenot_compliant
Is SamacsysN
JESD-30 codeR-XDIP-T14
JESD-609 codee0
normal positionNO
Number of functions2
Number of terminals14
Maximum on-state resistance (Ron)350 Ω
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
outputSEPARATE OUTPUT
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP14,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5,+-15 V
Certification statusNot Qualified
surface mountNO
Maximum connection time300 ns
switchBREAK-BEFORE-MAKE
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
Base Number Matches1

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IH5341MJD/883 Related Products

IH5341MJD/883 IH5352CWE+ IH5352CWE+T IH5352EWE+T IH5341ITW-T IH5341MJD/GH9 IH5341MJD/HR IH5352CPE-2 IH5352MJE/883 IH5352MJE/HR
Description Multiplexers/Switches, 2 Func, CMOS, CDIP14 IC video SW quad RF N/O 16-soic IC video SW quad RF N/O 16-soic IC video SW quad RF N/O 16-soic SPST, 2 Func, 1 Channel, CMOS, MBCY10, METAL CAN, TO-100, 10 PIN SPST, Multiplexers/Switches, 2 Func, CMOS, CDIP14 Multiplexers/Switches, 4 Func, CMOS, PDIP16 Multiplexers/Switches, 4 Func, CMOS, CDIP16 Multiplexers/Switches, 4 Func, CMOS, CDIP16
Is it Rohs certified? incompatible conform to conform to conform to incompatible incompatible incompatible incompatible incompatible incompatible
Reach Compliance Code not_compliant unknown unknown compliant compliant unknown not_compliant not_compliant not_compliant not_compliant
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260 260 260 NOT SPECIFIED NOT SPECIFIED 240 NOT SPECIFIED NOT SPECIFIED 240
Maximum time at peak reflow temperature NOT SPECIFIED 30 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 20 NOT SPECIFIED NOT SPECIFIED 20
Is it lead-free? Contains lead Lead free Lead free - Contains lead - Contains lead Contains lead Contains lead Contains lead
JESD-30 code R-XDIP-T14 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 O-MBCY-W10 - R-XDIP-T14 R-PDIP-T16 R-XDIP-T16 R-XDIP-T16
JESD-609 code e0 e3 e3 e3 e0 - e0 e0 e0 e0
normal position NO NO NO NO - - NO NO NO NO
Number of functions 2 4 4 4 2 - 2 4 4 4
Number of terminals 14 16 16 16 10 - 14 16 16 16
Maximum on-state resistance (Ron) 350 Ω 300 Ω 300 Ω 300 Ω 350 Ω - 350 Ω 350 Ω 350 Ω 350 Ω
Maximum operating temperature 125 °C 70 °C 70 °C 85 °C 85 °C - 125 °C 70 °C 125 °C 125 °C
Minimum operating temperature -55 °C - - -40 °C -25 °C - -55 °C - -55 °C -55 °C
output SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT - - SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT
Package body material CERAMIC PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY METAL - CERAMIC PLASTIC/EPOXY CERAMIC CERAMIC
encapsulated code DIP SOP SOP SOP TO-100 - DIP DIP DIP DIP
Encapsulate equivalent code DIP14,.3 SOP16,.4 SOP16,.4 SOP16,.4 - - DIP14,.3 DIP16,.3 DIP16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR ROUND - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE CYLINDRICAL - IN-LINE IN-LINE IN-LINE IN-LINE
power supply 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V - - 5,+-15 V 5,+-15 V 5,+-15 V 5,+-15 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified - Not Qualified Not Qualified
surface mount NO YES YES YES NO - NO NO NO NO
Maximum connection time 300 ns 300 ns 300 ns 300 ns 300 ns - 300 ns 300 ns 300 ns 300 ns
switch BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE - - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
technology CMOS CMOS CMOS CMOS CMOS - CMOS CMOS CMOS CMOS
Temperature level MILITARY COMMERCIAL COMMERCIAL INDUSTRIAL OTHER - MILITARY COMMERCIAL MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) TIN LEAD - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE GULL WING GULL WING GULL WING WIRE - THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 1.27 mm - - 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL BOTTOM - DUAL DUAL DUAL DUAL
Maker - Maxim Maxim Maxim Maxim - - Maxim Maxim Maxim
package instruction - LEAD FREE, SOIC-16 LEAD FREE, SOIC-16 SOP, SOP16,.4 TO-100, , - DIP, DIP16,.3 DIP, DIP16,.3 DIP, DIP16,.3
Humidity sensitivity level - 1 1 1 - - 1 1 - 1

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