IH5341MJD/HR datasheet, PDF - EEWORLD Datasheet

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IH5341MJD/HR: DescriptionMultiplexers/Switches, 2 Func, CMOS, CDIP14; CategoryAnalog mixed-signal IC The signal circuit; File Size231KB，4 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html

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IH5341MJD/HR Overview

Multiplexers/Switches, 2 Func, CMOS, CDIP14

IH5341MJD/HR Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Reach Compliance Code	not_compliant
Is Samacsys	N
JESD-30 code	R-XDIP-T14
JESD-609 code	e0
Humidity sensitivity level	1
normal position	NO
Number of functions	2
Number of terminals	14
Maximum on-state resistance (Ron)	350 Ω
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
output	SEPARATE OUTPUT
Package body material	CERAMIC
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	240
power supply	5,+-15 V
Certification status	Not Qualified
surface mount	NO
Maximum connection time	300 ns
switch	BREAK-BEFORE-MAKE
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	20
Base Number Matches	1

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IH5341MJD/HR Related Products

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Description	Multiplexers/Switches, 2 Func, CMOS, CDIP14	IC video SW quad RF N/O 16-soic	IC video SW quad RF N/O 16-soic	IC video SW quad RF N/O 16-soic	SPST, 2 Func, 1 Channel, CMOS, MBCY10, METAL CAN, TO-100, 10 PIN	SPST,	Multiplexers/Switches, 2 Func, CMOS, CDIP14	Multiplexers/Switches, 4 Func, CMOS, PDIP16	Multiplexers/Switches, 4 Func, CMOS, CDIP16	Multiplexers/Switches, 4 Func, CMOS, CDIP16
Is it Rohs certified?	incompatible	conform to	conform to	conform to	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	not_compliant	unknown	unknown	compliant	compliant	unknown	not_compliant	not_compliant	not_compliant	not_compliant
Peak Reflow Temperature (Celsius)	240	260	260	260	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	240
Maximum time at peak reflow temperature	20	30	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	20
Is it lead-free?	Contains lead	Lead free	Lead free	-	Contains lead	-	Contains lead	Contains lead	Contains lead	Contains lead
JESD-30 code	R-XDIP-T14	R-PDSO-G16	R-PDSO-G16	R-PDSO-G16	O-MBCY-W10	-	R-XDIP-T14	R-PDIP-T16	R-XDIP-T16	R-XDIP-T16
JESD-609 code	e0	e3	e3	e3	e0	-	e0	e0	e0	e0
Humidity sensitivity level	1	1	1	1	-	-	-	1	-	1
normal position	NO	NO	NO	NO	-	-	NO	NO	NO	NO
Number of functions	2	4	4	4	2	-	2	4	4	4
Number of terminals	14	16	16	16	10	-	14	16	16	16
Maximum on-state resistance (Ron)	350 Ω	300 Ω	300 Ω	300 Ω	350 Ω	-	350 Ω	350 Ω	350 Ω	350 Ω
Maximum operating temperature	125 °C	70 °C	70 °C	85 °C	85 °C	-	125 °C	70 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-	-	-40 °C	-25 °C	-	-55 °C	-	-55 °C	-55 °C
output	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	-	-	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT	SEPARATE OUTPUT
Package body material	CERAMIC	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	METAL	-	CERAMIC	PLASTIC/EPOXY	CERAMIC	CERAMIC
encapsulated code	DIP	SOP	SOP	SOP	TO-100	-	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	SOP16,.4	SOP16,.4	SOP16,.4	-	-	DIP14,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	ROUND	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	CYLINDRICAL	-	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5,+-15 V	5,+-15 V	5,+-15 V	5,+-15 V	-	-	5,+-15 V	5,+-15 V	5,+-15 V	5,+-15 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-	Not Qualified	Not Qualified
surface mount	NO	YES	YES	YES	NO	-	NO	NO	NO	NO
Maximum connection time	300 ns	300 ns	300 ns	300 ns	300 ns	-	300 ns	300 ns	300 ns	300 ns
switch	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	-	-	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE	BREAK-BEFORE-MAKE
technology	CMOS	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	COMMERCIAL	COMMERCIAL	INDUSTRIAL	OTHER	-	MILITARY	COMMERCIAL	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	TIN LEAD	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	WIRE	-	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	1.27 mm	1.27 mm	-	-	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	BOTTOM	-	DUAL	DUAL	DUAL	DUAL
Maker	-	Maxim	Maxim	Maxim	Maxim	-	-	Maxim	Maxim	Maxim
package instruction	-	LEAD FREE, SOIC-16	LEAD FREE, SOIC-16	SOP, SOP16,.4	TO-100,	,	-	DIP, DIP16,.3	DIP, DIP16,.3	DIP, DIP16,.3

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