M58LV064B150ZA6T datasheet, PDF

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M58LV064B150ZA6T: Description64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories; Categorystorage storage; File Size22KB，1 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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M58LV064B150ZA6T Overview

64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories

M58LV064B150ZA6T Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	BGA
package instruction	10 X 13 MM, 1 MM PITCH, TBGA-80
Contacts	80
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum access time	150 ns
Other features	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
Spare memory width	16
command user interface	YES
Universal Flash Interface	YES
Data polling	NO
JESD-30 code	R-PBGA-B80
JESD-609 code	e1
length	13 mm
memory density	67108864 bi
Memory IC Type	FLASH
memory width	32
Number of functions	1
Number of departments/size	64
Number of terminals	80
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	2MX32
Package body material	PLASTIC/EPOXY
encapsulated code	TBGA
Encapsulate equivalent code	BGA80,8X10,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE
page size	2/4 words
Parallel/Serial	PARALLEL
power supply	2/3.3,3.3 V
Programming voltage	3 V
Certification status	Not Qualified
ready/busy	YES
Maximum seat height	1.2 mm
Department size	1M
Maximum standby current	0.000001 A
Maximum slew rate	0.05 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
switch bit	NO
type	NOR TYPE
width	10 mm

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Description	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories
Is it Rohs certified?	conform to	conform to	-	-	-	conform to	conform to	incompatible	incompatible	-
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	-
Parts packaging code	BGA	BGA	TSOP	TSOP	-	BGA	BGA	TSOP	TSOP	-
package instruction	10 X 13 MM, 1 MM PITCH, TBGA-80	10 X 13 MM, 1 MM PITCH, TBGA-80	PLASTIC, TSOP-56	PLASTIC, TSOP-56	-	10 X 13 MM, 1 MM PITCH, TBGA-64	10 X 13 MM, 1 MM PITCH, TBGA-64	14 X 20 MM, PLASTIC, TSOP-56	14 X 20 MM, PLASTIC, TSOP-56	-
Contacts	80	80	56	56	-	64	64	56	56	-
Reach Compliance Code	unknow	unknow	unknow	unknow	-	unknow	unknow	_compli	_compli	-
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	-	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	-
Maximum access time	150 ns	150 ns	150 ns	150 ns	-	150 ns	150 ns	150 ns	150 ns	-
Other features	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	SYNCHRONOUS MODE OF OPERATION ALSO POSSIBLE	SYNCHRONOUS MODE OF OPERATION ALSO POSSIBLE	-	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	-
command user interface	YES	YES	-	-	-	YES	YES	YES	YES	-
Universal Flash Interface	YES	YES	-	-	-	YES	YES	YES	YES	-
Data polling	NO	NO	-	-	-	NO	NO	NO	NO	-
JESD-30 code	R-PBGA-B80	R-PBGA-B80	R-PDSO-G56	R-PDSO-G56	-	R-PBGA-B64	R-PBGA-B64	R-PDSO-G56	R-PDSO-G56	-
JESD-609 code	e1	e1	-	-	-	e1	e1	e0	e0	-
length	13 mm	13 mm	-	-	-	13 mm	13 mm	18.4 mm	18.4 mm	-
memory density	67108864 bi	67108864 bi	67108864 bi	67108864 bi	-	67108864 bi	67108864 bi	67108864 bi	67108864 bi	-
Memory IC Type	FLASH	FLASH	FLASH	FLASH	-	FLASH	FLASH	FLASH	FLASH	-
memory width	32	32	32	32	-	16	16	16	16	-
Number of functions	1	1	1	1	-	1	1	1	1	-
Number of departments/size	64	64	-	-	-	64	64	64	64	-
Number of terminals	80	80	56	56	-	64	64	56	56	-
word count	2097152 words	2097152 words	2097152 words	2097152 words	-	4194304 words	4194304 words	4194304 words	4194304 words	-
character code	2000000	2000000	2000000	2000000	-	4000000	4000000	4000000	4000000	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	85 °C	70 °C	85 °C	70 °C	-	85 °C	70 °C	85 °C	70 °C	-
organize	2MX32	2MX32	2MX32	2MX32	-	4MX16	4MX16	4MX16	4MX16	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	TBGA	TBGA	SOP	SOP	-	TBGA	TBGA	TSOP1	TSOP1	-
Encapsulate equivalent code	BGA80,8X10,40	BGA80,8X10,40	-	-	-	BGA64,8X8,40	BGA64,8X8,40	TSSOP56,.8,20	TSSOP56,.8,20	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	-	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-
page size	2/4 words	2/4 words	-	-	-	4 words	4 words	4 words	4 words	-
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-
power supply	2/3.3,3.3 V	2/3.3,3.3 V	-	-	-	2/3.3,3.3 V	2/3.3,3.3 V	2/3.3,3.3 V	2/3.3,3.3 V	-
Programming voltage	3 V	3 V	3 V	3 V	-	3 V	3 V	3 V	3 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
ready/busy	YES	YES	-	-	-	YES	YES	YES	YES	-
Maximum seat height	1.2 mm	1.2 mm	-	-	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-
Department size	1M	1M	-	-	-	1M	1M	1M	1M	-
Maximum standby current	0.000001 A	0.000001 A	-	-	-	0.000001 A	0.000001 A	0.000001 A	0.000001 A	-
Maximum slew rate	0.05 mA	0.05 mA	-	-	-	0.05 mA	0.05 mA	0.05 mA	0.05 mA	-
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	-
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	-	3 V	3 V	3 V	3 V	-
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	-
surface mount	YES	YES	YES	YES	-	YES	YES	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS	-
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	-	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	-
Terminal surface	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	-	-	-	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal form	BALL	BALL	GULL WING	GULL WING	-	BALL	BALL	GULL WING	GULL WING	-
Terminal pitch	1 mm	1 mm	-	-	-	1 mm	1 mm	0.5 mm	0.5 mm	-
Terminal location	BOTTOM	BOTTOM	DUAL	DUAL	-	BOTTOM	BOTTOM	DUAL	DUAL	-
switch bit	NO	NO	-	-	-	NO	NO	NO	NO	-
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	-	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	-
width	10 mm	10 mm	-	-	-	10 mm	10 mm	14 mm	14 mm	-

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