M58LV064B150N1T datasheet, PDF

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M58LV064B150N1T: Description64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories; Categorystorage storage; File Size22KB，1 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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M58LV064B150N1T Overview

64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories

M58LV064B150N1T Parametric

Parameter Name	Attribute value
Maker	STMicroelectronics
Parts packaging code	TSOP
package instruction	PLASTIC, TSOP-56
Contacts	56
Reach Compliance Code	unknow
ECCN code	3A991.B.1.A
Maximum access time	150 ns
Other features	SYNCHRONOUS MODE OF OPERATION ALSO POSSIBLE
Spare memory width	16
JESD-30 code	R-PDSO-G56
memory density	67108864 bi
Memory IC Type	FLASH
memory width	32
Number of functions	1
Number of terminals	56
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	2MX32
Package body material	PLASTIC/EPOXY
encapsulated code	SOP
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Parallel/Serial	PARALLEL
Programming voltage	3 V
Certification status	Not Qualified
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	GULL WING
Terminal location	DUAL
type	NOR TYPE

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M58LV064B150N1T Related Products

	M58LV064B150N1T	M58LV064B150ZA6T	M58LV064B150ZA1T	M58LV064B150N6T	M58LV064B	M58LV064A150ZA6T	M58LV064A150ZA1T	M58LV064A150N6T	M58LV064A150N1T	M58LV064A
Description	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories	64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories
Maker	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics	-
Parts packaging code	TSOP	BGA	BGA	TSOP	-	BGA	BGA	TSOP	TSOP	-
package instruction	PLASTIC, TSOP-56	10 X 13 MM, 1 MM PITCH, TBGA-80	10 X 13 MM, 1 MM PITCH, TBGA-80	PLASTIC, TSOP-56	-	10 X 13 MM, 1 MM PITCH, TBGA-64	10 X 13 MM, 1 MM PITCH, TBGA-64	14 X 20 MM, PLASTIC, TSOP-56	14 X 20 MM, PLASTIC, TSOP-56	-
Contacts	56	80	80	56	-	64	64	56	56	-
Reach Compliance Code	unknow	unknow	unknow	unknow	-	unknow	unknow	_compli	_compli	-
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	-	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	-
Maximum access time	150 ns	150 ns	150 ns	150 ns	-	150 ns	150 ns	150 ns	150 ns	-
Other features	SYNCHRONOUS MODE OF OPERATION ALSO POSSIBLE	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	SYNCHRONOUS MODE OF OPERATION ALSO POSSIBLE	-	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE	-
JESD-30 code	R-PDSO-G56	R-PBGA-B80	R-PBGA-B80	R-PDSO-G56	-	R-PBGA-B64	R-PBGA-B64	R-PDSO-G56	R-PDSO-G56	-
memory density	67108864 bi	67108864 bi	67108864 bi	67108864 bi	-	67108864 bi	67108864 bi	67108864 bi	67108864 bi	-
Memory IC Type	FLASH	FLASH	FLASH	FLASH	-	FLASH	FLASH	FLASH	FLASH	-
memory width	32	32	32	32	-	16	16	16	16	-
Number of functions	1	1	1	1	-	1	1	1	1	-
Number of terminals	56	80	80	56	-	64	64	56	56	-
word count	2097152 words	2097152 words	2097152 words	2097152 words	-	4194304 words	4194304 words	4194304 words	4194304 words	-
character code	2000000	2000000	2000000	2000000	-	4000000	4000000	4000000	4000000	-
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	-
Maximum operating temperature	70 °C	85 °C	70 °C	85 °C	-	85 °C	70 °C	85 °C	70 °C	-
organize	2MX32	2MX32	2MX32	2MX32	-	4MX16	4MX16	4MX16	4MX16	-
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
encapsulated code	SOP	TBGA	TBGA	SOP	-	TBGA	TBGA	TSOP1	TSOP1	-
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
Package form	SMALL OUTLINE	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	SMALL OUTLINE	-	GRID ARRAY, THIN PROFILE	GRID ARRAY, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	-
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL	-
Programming voltage	3 V	3 V	3 V	3 V	-	3 V	3 V	3 V	3 V	-
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	-	3.6 V	3.6 V	3.6 V	3.6 V	-
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	-	3 V	3 V	3 V	3 V	-
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	-	3.3 V	3.3 V	3.3 V	3.3 V	-
surface mount	YES	YES	YES	YES	-	YES	YES	YES	YES	-
technology	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS	-
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	-	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	-
Terminal form	GULL WING	BALL	BALL	GULL WING	-	BALL	BALL	GULL WING	GULL WING	-
Terminal location	DUAL	BOTTOM	BOTTOM	DUAL	-	BOTTOM	BOTTOM	DUAL	DUAL	-
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	-	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	-
Is it Rohs certified?	-	conform to	conform to	-	-	conform to	conform to	incompatible	incompatible	-
command user interface	-	YES	YES	-	-	YES	YES	YES	YES	-
Universal Flash Interface	-	YES	YES	-	-	YES	YES	YES	YES	-
Data polling	-	NO	NO	-	-	NO	NO	NO	NO	-
JESD-609 code	-	e1	e1	-	-	e1	e1	e0	e0	-
length	-	13 mm	13 mm	-	-	13 mm	13 mm	18.4 mm	18.4 mm	-
Number of departments/size	-	64	64	-	-	64	64	64	64	-
Encapsulate equivalent code	-	BGA80,8X10,40	BGA80,8X10,40	-	-	BGA64,8X8,40	BGA64,8X8,40	TSSOP56,.8,20	TSSOP56,.8,20	-
page size	-	2/4 words	2/4 words	-	-	4 words	4 words	4 words	4 words	-
power supply	-	2/3.3,3.3 V	2/3.3,3.3 V	-	-	2/3.3,3.3 V	2/3.3,3.3 V	2/3.3,3.3 V	2/3.3,3.3 V	-
ready/busy	-	YES	YES	-	-	YES	YES	YES	YES	-
Maximum seat height	-	1.2 mm	1.2 mm	-	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm	-
Department size	-	1M	1M	-	-	1M	1M	1M	1M	-
Maximum standby current	-	0.000001 A	0.000001 A	-	-	0.000001 A	0.000001 A	0.000001 A	0.000001 A	-
Maximum slew rate	-	0.05 mA	0.05 mA	-	-	0.05 mA	0.05 mA	0.05 mA	0.05 mA	-
Terminal surface	-	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	-	-	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-
Terminal pitch	-	1 mm	1 mm	-	-	1 mm	1 mm	0.5 mm	0.5 mm	-
switch bit	-	NO	NO	-	-	NO	NO	NO	NO	-
width	-	10 mm	10 mm	-	-	10 mm	10 mm	14 mm	14 mm	-

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