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Datasheet> All Categories > storage> storage> M58LV064A150ZA6T
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M58LV064A150ZA6T

Description
64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories
Categorystorage    storage   
File Size22KB，1 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Environmental Compliance
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M58LV064A150ZA6T Overview

64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories

M58LV064A150ZA6T Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSTMicroelectronics
Parts packaging codeBGA
package instruction10 X 13 MM, 1 MM PITCH, TBGA-64
Contacts64
Reach Compliance Codeunknow
ECCN code3A991.B.1.A
Maximum access time150 ns
Other featuresSYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
command user interfaceYES
Universal Flash InterfaceYES
Data pollingNO
JESD-30 codeR-PBGA-B64
JESD-609 codee1
length13 mm
memory density67108864 bi
Memory IC TypeFLASH
memory width16
Number of functions1
Number of departments/size64
Number of terminals64
word count4194304 words
character code4000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize4MX16
Package body materialPLASTIC/EPOXY
encapsulated codeTBGA
Encapsulate equivalent codeBGA64,8X8,40
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE
page size4 words
Parallel/SerialPARALLEL
power supply2/3.3,3.3 V
Programming voltage3 V
Certification statusNot Qualified
ready/busyYES
Maximum seat height1.2 mm
Department size1M
Maximum standby current0.000001 A
Maximum slew rate0.05 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
switch bitNO
typeNOR TYPE
width10 mm

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Description 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories 64 Mbit 4Mb x16 or 2Mb x32, Uniform Block, Burst 3V Supply Flash Memories
Is it Rohs certified? conform to conform to conform to - - - conform to incompatible incompatible -
Maker STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics - STMicroelectronics STMicroelectronics STMicroelectronics -
Parts packaging code BGA BGA BGA TSOP TSOP - BGA TSOP TSOP -
package instruction 10 X 13 MM, 1 MM PITCH, TBGA-64 10 X 13 MM, 1 MM PITCH, TBGA-80 10 X 13 MM, 1 MM PITCH, TBGA-80 PLASTIC, TSOP-56 PLASTIC, TSOP-56 - 10 X 13 MM, 1 MM PITCH, TBGA-64 14 X 20 MM, PLASTIC, TSOP-56 14 X 20 MM, PLASTIC, TSOP-56 -
Contacts 64 80 80 56 56 - 64 56 56 -
Reach Compliance Code unknow unknow unknow unknow unknow - unknow _compli _compli -
ECCN code 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A - 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A -
Maximum access time 150 ns 150 ns 150 ns 150 ns 150 ns - 150 ns 150 ns 150 ns -
Other features SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS MODE OF OPERATION ALSO POSSIBLE SYNCHRONOUS MODE OF OPERATION ALSO POSSIBLE - SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE -
command user interface YES YES YES - - - YES YES YES -
Universal Flash Interface YES YES YES - - - YES YES YES -
Data polling NO NO NO - - - NO NO NO -
JESD-30 code R-PBGA-B64 R-PBGA-B80 R-PBGA-B80 R-PDSO-G56 R-PDSO-G56 - R-PBGA-B64 R-PDSO-G56 R-PDSO-G56 -
JESD-609 code e1 e1 e1 - - - e1 e0 e0 -
length 13 mm 13 mm 13 mm - - - 13 mm 18.4 mm 18.4 mm -
memory density 67108864 bi 67108864 bi 67108864 bi 67108864 bi 67108864 bi - 67108864 bi 67108864 bi 67108864 bi -
Memory IC Type FLASH FLASH FLASH FLASH FLASH - FLASH FLASH FLASH -
memory width 16 32 32 32 32 - 16 16 16 -
Number of functions 1 1 1 1 1 - 1 1 1 -
Number of departments/size 64 64 64 - - - 64 64 64 -
Number of terminals 64 80 80 56 56 - 64 56 56 -
word count 4194304 words 2097152 words 2097152 words 2097152 words 2097152 words - 4194304 words 4194304 words 4194304 words -
character code 4000000 2000000 2000000 2000000 2000000 - 4000000 4000000 4000000 -
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS -
Maximum operating temperature 85 °C 85 °C 70 °C 85 °C 70 °C - 70 °C 85 °C 70 °C -
organize 4MX16 2MX32 2MX32 2MX32 2MX32 - 4MX16 4MX16 4MX16 -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code TBGA TBGA TBGA SOP SOP - TBGA TSOP1 TSOP1 -
Encapsulate equivalent code BGA64,8X8,40 BGA80,8X10,40 BGA80,8X10,40 - - - BGA64,8X8,40 TSSOP56,.8,20 TSSOP56,.8,20 -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR -
Package form GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE SMALL OUTLINE SMALL OUTLINE - GRID ARRAY, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE -
page size 4 words 2/4 words 2/4 words - - - 4 words 4 words 4 words -
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL - PARALLEL PARALLEL PARALLEL -
power supply 2/3.3,3.3 V 2/3.3,3.3 V 2/3.3,3.3 V - - - 2/3.3,3.3 V 2/3.3,3.3 V 2/3.3,3.3 V -
Programming voltage 3 V 3 V 3 V 3 V 3 V - 3 V 3 V 3 V -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified -
ready/busy YES YES YES - - - YES YES YES -
Maximum seat height 1.2 mm 1.2 mm 1.2 mm - - - 1.2 mm 1.2 mm 1.2 mm -
Department size 1M 1M 1M - - - 1M 1M 1M -
Maximum standby current 0.000001 A 0.000001 A 0.000001 A - - - 0.000001 A 0.000001 A 0.000001 A -
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA - - - 0.05 mA 0.05 mA 0.05 mA -
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V - 3.6 V 3.6 V 3.6 V -
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V - 3 V 3 V 3 V -
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V 3.3 V -
surface mount YES YES YES YES YES - YES YES YES -
technology CMOS CMOS CMOS CMOS CMOS - CMOS CMOS CMOS -
Temperature level INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL - COMMERCIAL INDUSTRIAL COMMERCIAL -
Terminal surface Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) - - - Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form BALL BALL BALL GULL WING GULL WING - BALL GULL WING GULL WING -
Terminal pitch 1 mm 1 mm 1 mm - - - 1 mm 0.5 mm 0.5 mm -
Terminal location BOTTOM BOTTOM BOTTOM DUAL DUAL - BOTTOM DUAL DUAL -
switch bit NO NO NO - - - NO NO NO -
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE - NOR TYPE NOR TYPE NOR TYPE -
width 10 mm 10 mm 10 mm - - - 10 mm 14 mm 14 mm -

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