S-24H30I10 datasheet, PDF - EEWORLD Datasheet

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S-24H30I10: DescriptionNon-Volatile SRAM, 8X8, 300ns, CMOS, PDIP8, DIP-8; Categorystorage storage; File Size751KB，15 Pages; ManufacturerABLIC

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S-24H30I10 Overview

Non-Volatile SRAM, 8X8, 300ns, CMOS, PDIP8, DIP-8

S-24H30I10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	DIP
package instruction	DIP, DIP8,.3
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	300 ns
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
length	9.3 mm
memory density	64 bit
Memory IC Type	NON-VOLATILE SRAM
memory width	8
Number of functions	1
Number of terminals	8
word count	8 words
character code	8
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8X8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	4.5 mm
Maximum standby current	0.000001 A
Maximum slew rate	0.01 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Base Number Matches	1

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S-24H30I10 Related Products

	S-24H30I10	S-24H45IF10	S-24S45IF10
Description	Non-Volatile SRAM, 8X8, 300ns, CMOS, PDIP8, DIP-8	Non-Volatile SRAM, 16X16, 300ns, CMOS, PDSO8, SOP-8	Non-Volatile SRAM, 16X16, 300ns, CMOS, PDSO8, SOP-8
Is it Rohs certified?	incompatible	incompatible	incompatible
Parts packaging code	DIP	SOIC	SOIC
package instruction	DIP, DIP8,.3	SOP, SOP8,.25	SOP, SOP8,.25
Contacts	8	8	8
Reach Compliance Code	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99
Maximum access time	300 ns	300 ns	300 ns
JESD-30 code	R-PDIP-T8	S-PDSO-G8	S-PDSO-G8
JESD-609 code	e0	e0	e0
length	9.3 mm	5 mm	5 mm
memory density	64 bit	256 bit	256 bit
Memory IC Type	NON-VOLATILE SRAM	NON-VOLATILE SRAM	NON-VOLATILE SRAM
memory width	8	16	16
Number of functions	1	1	1
Number of terminals	8	8	8
word count	8 words	16 words	16 words
character code	8	16	16
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
organize	8X8	16X16	16X16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	SOP	SOP
Encapsulate equivalent code	DIP8,.3	SOP8,.25	SOP8,.25
Package shape	RECTANGULAR	SQUARE	SQUARE
Package form	IN-LINE	SMALL OUTLINE	SMALL OUTLINE
Parallel/Serial	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.5 mm	2.15 mm	2.15 mm
Maximum standby current	0.000001 A	0.000001 A	0.000001 A
Maximum slew rate	0.01 mA	0.01 mA	0.01 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V
surface mount	NO	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING
Terminal pitch	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	5 mm	5 mm
Base Number Matches	1	1	1
Maker	-	ABLIC	ABLIC
Is Samacsys	-	N	N

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