TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Parts packaging code | SOIC |
| package instruction | SOP, |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e3 |
| length | 4.9 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 1.75 mm |
| Maximum slew rate | 2.4 mA |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| Telecom integrated circuit types | DATA ENCRYPTION CIRCUIT |
| Temperature level | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 3.9 mm |
| Base Number Matches | 1 |
| HCS500/SN | HCS500T/SN | HCS500-I/SN | HCS500T-I/SN | |
|---|---|---|---|---|
| Description | TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 | TELECOM, DATA ENCRYPTION CIRCUIT, PDSO8, 0.150 INCH, PLASTIC, SOIC-8 |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to |
| Parts packaging code | SOIC | SOIC | SOIC | SOIC |
| package instruction | SOP, | SOP, | SOP, | SOP, |
| Contacts | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| JESD-30 code | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e3 | e3 | e3 | e3 |
| Humidity sensitivity level | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 70 °C | 85 °C | 85 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | SOP | SOP | SOP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum slew rate | 2.4 mA | 2.4 mA | 2.4 mA | 2.4 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| Telecom integrated circuit types | DATA ENCRYPTION CIRCUIT | DATA ENCRYPTION CIRCUIT | DATA ENCRYPTION CIRCUIT | DATA ENCRYPTION CIRCUIT |
| Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | 40 | 40 | 40 |
| Base Number Matches | 1 | 1 | 1 | 1 |
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